• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.16 no.4
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• pp.8-14
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• 2002

A modern lightning protection system is required to eliminate the risks such as electrical shocks and damages of structures, electrical and electronic equipments due to lightning. However, the conventional lightning protection systems play and important role in protecting persons and structures only. Thus an effective lightning protection system is indispensable today in computer, information and communication facilities and etc. The mafor objective of this paper is to develop the technology to protect electronics and computerized facilities against lightning-caused overvoltages. The study is oriented on the control of the potential rise of down conductors with the type and installation method of down conductors. As a result, to reduce side flashes and hazards caused by the potential rise of down conductor due to lightning current, the coaxial cable with a low characteristic impedance and high insulation level is suitable for a down conductor. In particular it is extremely effective to bond down conductors to the steel supporter, metal raceways and steel frame of structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.466-466
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• 2011

There have been several methods to fabricate carbon nanotube (CNT) emitters, which include as-grown, spraying, screen-printing, electrophoresis and bonding methods. Unfortunately, these techniques generally suffer from two main problems. One is a weak mechanical adhesion between CNTs and the cathode. The as-grown, spraying and electrophoresis methods show a weak mechanical adhesion between CNTs and the cathodes, which induces CNT emitters pulled out under a high electric field. The other is a severe degradation of the CNT tip due to organic binders used in the fabrication process. The screen-printing method which is widely used to fabricate CNT emitters generally shows a critical degradation of CNT emitters caused by the organic binder. Such kinds of problems induce a short lifetime of the CNT field emitters which may limit their practical applications. Therefore, a robust CNT emitter which has the strong mechanical adhesion and no degradation is still a great challenge. Here, we introduce a simple and effective technique for fabrication of CNT field emitter, namely filtration-taping-transfer method. The CNT emitters fabricated by the filtration-taping-transfer method show the low turn-on electric fields, the high emission current, good uniformity and good stability. The enhanced emission performance of the CNT emitters is mainly attributed to high emission sites on the emitter area, and to good ohmic contact and strong mechanical adhesion between the emitters and cathodes. The CNT emitters using a simple and effective fabrication method can be applied for various field emission applications such as field emission displays, lamps, e-beam sources, and x-ray sources. The detail fabrication process will be covered at the poster.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.369-370
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• 2005

LTCC (Low Temperature Cofired Ceramic) technology is one of technologies which can realize SIP (System-In-a-Package). In this paper realization of gas sensor using LTCC technology was described. In the conventional gas sensor structure, wire bonding method is generally used as an interconnection method whereas in the LTCC sensor structure, via was used for the interconnection. As sensing materials, $SnO_2$ was adopted. The effect of frit glass portion on the adhesion of the sensing material to the LTCC substrate and the electrical conductivity of the sensing material were analyzed. AgPd, PdO, Pt was added to the sensing material as an additive for improving the gas sensitivity and electrical conductivity and the effect of the amount of additives in the sensing material on the electrical conductivity was investigated. The effect of the amount of frit glass in the termination on the sensor performance, especially mechanical integrity, was considered and the crack initiation and propagation in the boundary between the sensing material and the termination was studied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.442-453
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• 2023

Tandem or multijunction solar cells (MJSCs) can convert sunlight into electricity with higher efficiency (η) than single junction solar cells (SJSCs) by dividing the solar irradiance over sub-cells having distinct bandgaps. The efficiencies of various common SJSC materials are close to the edge of their theoretical efficiency and hence there is a tremendous growing interest in utilizing the tandem/multijunction technique. Recently, III-V materials integration on a silicon substrate has been broadly investigated in the development of III-V on Si tandem solar cells. Numerous growth techniques such as heteroepitaxial growth, wafer bonding, and mechanical stacking are crucial for better understanding of high-quality III-V epitaxial layers on Si. As the choice of growth method and substrate selection can significantly impact the quality and performance of the resulting tandem cell and the terminal configuration exhibit a vital role in the overall proficiency. Parallel and Series-connected configurations have been studied, each with its advantage and disadvantages depending on the application and cell configuration. The optimization of both growth mechanisms and terminal configurations is necessary to further improve efficiency and lessen the cost of III-V on Si tandem solar cells. In this review article, we present an overview of the growth mechanisms and terminal configurations with the areas of research that are crucial for the commercialization of III-V on Si tandem solar cells.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.221-228
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• 2011

This paper describes 250-Mb/s fiber optic transmitter and receiver ICs for plastic optical fiber applications using a$ 0.18-{\mu}m$ CMOS technology. Simple signal and light detection schemes are introduced for power reduction in sleep mode. The transmitter converts non-return-to-zero digital data into 650-nm visible-red light signal and the receiver recovers the digital data from the incident light signal through up to 50-m plastic optical fiber. The transmitter and receiver ICs occupy only 0.62 $mm^2$ of area including electrostatic discharge protection diodes and bonding pads. The transmitter IC consumes 23 mA with 20 mA of LED driving currents, and the receiver IC consumes 16 mA with 4 mA of output driving currents at 250 Mb/s of data rate from a 3.3-V supply in active mode. In sleep mode, the transmitter and receiver ICs consume only 25 ${\mu}A$ and 40 ${\mu}A$, respectively.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.42-47
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• 1998

We have fabricated electron-optical lens for micro E-beam system that can overcome the limitation of current E-beam lithography. Our electron-optical lens consists of multiple silicon electrodes which were fabricated by micromachining technology and assembled by anodic bonding. The assembled system was installed in UHV chamber to observe the emission characteristics of focused electrons by the electro-optical lens. We used STM(Scanning Tunneling Microscope) tip for electron source. By performing lithography with the focused electrons with PMMA(poly-methylmethacrylate) as E-beam resist. We could draw 0.13${\mu}{\textrm}{m}$ nano-scale lines.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.6
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• pp.381-386
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• 2017

A railway track generates severe levels of vibrations. In order to reduce these vibrations and to provide structural stability, various rail pads, mats, etc., are used for vibration protection. In this study, a specially designed rail pad was developed to reduce vibration and to generate electric power simultaneously, that is, by using the vibrations generated by railway cars on the track. The newly developed rail pads were tested to evaluate the characteristics of electric power by investigating the generated voltage and the current levels and patterns. In addition, we proposed an optimal laminated structure and adhesive by comparing the voltage generated by each type of adhesive required for optimal adhesion of the rail pad and the piezoelectric device.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.11a
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• pp.195-197
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• 2007

This paper presents experimental results on the safety of persons due to a ground fault in 22.9 kV-Y distribution system In order to evaluate the touch voltages due to internal ground faults in a step down transformer based on the newly prescribed KS C IEC 60364 standard series, the verification tests in a 22.9 kV multi-grounded neutral system were carried out From the experimental results, it was found that there will be significant potential rise jeopardizing LV equipment insulation in case of separate grounding between HV and LV system and the effective measures against hazardous touch voltages due to a IN side ground fault in the common grounding system between HV and LV system are proposed. As a consequence, it was found that the equipotential bonding is an important prerequisite for the effectiveness of the protective measures for the safety of persons in the common ground system between 22.9 kV-Y and low-voltage grounding system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.7-11
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• 2002

In this study, Au thin films were etched with a $Cl_2/Ar$ gas combination in an in an inductively coupled plasma. The etch properties were measured for different gas mixing ratios of $Cl_2/(Cl_2+Ar)$ while the other process conditions were fixed at rf power (700 W), dc bias voltage (150 V), and chamber pressure (15 mTorr). The highest etch rate of the Au thin film was 3500 $\AA/min$ and the selectivity of Au to $SiO_2$ was 4.38 at a $Cl_2/(Cl_2+Ar)$ gas mixing ratio of 0.2. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. There is Au-Cl bonding by chemical reaction between Cl and Au. During the etching of Au thin films in $Cl_2/Ar$ plasma, Au-Cl bond is formed, and these products can be removed by the physical bombardment of Ar ions. In addition, Optical emission spectroscopy (OES) were investigated to analyze radical density of Cl and Ar in plasma. The profile of etched Au investigated with scanning electron microscopy (SEM).

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.8
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• pp.417-422
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• 2006

This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(Laser Doppler Vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject stable droplets up to 20 kHz, 4.4 m/s and above 8 pl at the different applied driving waveforms.