• Tribology and Lubricants
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• 제34권3호
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• pp.75-83
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• 2018

Microturbomachinery (< 250 kW) using gas foil bearings can function without oil lubricants, simplify rotor-bearing systems, and demonstrate excellent rotordynamic stability at high speeds. State-of-the-art technologies generally use bump foil bearings or leaf foil bearings due to the specific advantages of each of the two types. Although these two types of bearings have been studied extensively, there are very few studies on leaf-bump foil bearings, which are a combination of the two aforementioned bearings. In this work, we illustrate a simple mathematical model of the leaf-bump foil bearing with leaf foils supported on bumps, and predict its static and dynamic performances. The analysis uses the simple elastic model for bumps that was previously developed and verified using experimental data, adds a leaf foil model, and solves the Reynolds equation for isothermal, isoviscous, and ideal gas fluid flow. The model predicts that the drag torques of the leaf-bump foil bearings are not affected significantly by static load and bearing clearance. Due to the preload effect of the leaf foils, rotor spinning, even under null static load, generates significant hydrodynamic pressure with its peak near the trailing edge of each leaf foil. A parametric study reveals that, while the journal eccentricity and minimum film thickness decrease, the drag torque, direct stiffness, and direct damping increase with increasing bump stiffness. The journal attitude angle and cross-coupled stiffness remain nearly constant with increasing bump stiffness. Interestingly, they are significantly smaller compared to the corresponding values obtained for bump foil bearings, thus, implying favorable rotor stability performance.

• 한국유체기계학회 논문집
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• 제5권3호
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• pp.7-14
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• 2002

A new foil bearing, ViscoElastic Foil Bearing(VEFB) is suggested with the need for a high damping foil bearing. Sufficient damping capacity is a key technical hurdle to super-bending-critical operation as well as widespread use of foil bearings into turbomachinery. The super-bending-critical operation of the conventional bump foil bearing and the VEFB is examined, as well as the structural dynamic characteristics. The structural dynamic test results show that the equivalent viscous damping of the VEFB is much larger than that of the bump bearing, and that the structural dynamic stiffness of the VEFB is comparable or larger than that of the bump bearing. The results of super-bending-critical operation of the VEFB indicate that the enhanced structural damping of the viscoelastic foil dramatically reduces the vibration near the bending critical speed. With the help of increased damping resulting from the viscoelasticity, the suppression of the asynchronous orbit is possible beyond the bending critical speed.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.21-27
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• 2007

이방성 전도필름(ACF) 접합에 사용되는 니켈 범프를 무전해 및 전해 도금법으로 제작한 다음, 이 범프들의 기계적 특성과 충격안전성을 압축시험, 범프전단시험, 낙하충격시험을 통하여 연구하였다. Nano indenter를 이용한 압축시험에서 얻은 하중-변형량 데이터를 변환시켜 니켈범프의 응력-변형량 곡선을 구하였다. 전해 니켈 범프는 무전해 니켈 범프에 비해 매우 작은 탄성한계응력과 탄성계수를 나타냈었다. 무전해 니켈 범프의 탄성한계응력과 탄성계수가 각각 600-800MPa, $9.7{\times}10^{-3}MPa/nm$인 반면 전해 니켈 범프의 경우에는 각각 70MPa, $7.8{\times}10^4MPa/nm$이었다. 범프전단 시험에서 무전해 니켈 범프는 소성변형이 거의 일어나지 않고 낮은 전단하중에서 범프가 패드 층에서 튕기듯이 떨어져 나간 반면 전해 니켈 범프는 큰 소성변형을 일으키며 범프가 잘려나갔으며 높은 전단하중을 보여주었다. 낙하충격시험 결과 ACF 플립칩 방법으로 본딩한 무전해 및 전해 범프 모두 높은 충격 신뢰성을 보였다.

• 대한기계학회논문집
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• 제15권1호
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• pp.107-119
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• 1991

본 연구에서는 테이프의 미소한 수직 변형에 대한 실험을 수행하여 이에 대한 계측 이론 및 계측방법을 정립한다. 회전 헤드와 주행 테이프를 구동할 수 있는 실 험 장치를 개발하고 주행 테이프의 변형을 정밀 계측할 수 있는 측정 시스템을 구성한 다. 이러한 측정 시스템을 이용하여 고속이면서 미소한 주행 테이프의 변형에 대해 비접촉적인 방법으로 3차원 계측을 실시한다. 헤드의 형상 및 크기가 다른 모델들을 설계 및 가공을 통해 제작하여 주행 테이프의 부상 특성을 평가한다. 주행 테이프의 부상 특성에 관한 수치 해석 결과에 대하여 실제와의 부합 여부를 검토할 수 있도록 실험을 수행한다. 본 연구에서 구성한 비접촉 측정 시스템으로 계측한 테이프의 3차 원 변형에 대한 실험 결과와 수치 해석 결과를 비교 검토한다.

• Tribology and Lubricants
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• 제40권1호
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• pp.17-23
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• 2024

This study analyzes the thermal effects on the performance of an air foil thrust bearing (AFTB) using COMSOL Multiphysics to approximate actual bearing behavior under real conditions. An AFTB is a sliding-thrust bearing that uses air as a lubricant to support the axial load. The AFTB consists of top and bump foils and supports the rotating disk through the hydrodynamic pressure generated by the wedge effect from the inclined surface of the top foil and the elastic deformation of the bump foils, similar to a spring. The use of air as a lubricant has some advantages such as low friction loss and less heat generation, enabling air bearings to be widely used in high-speed rotating systems. However, even in AFTB, the effects of energy loss due to viscosity at high speeds, interface frictional heat, and thermal deformation of the foil caused by temperature increase cannot be ignored. Foil deformation derived from the thermal effect influences the minimum decay in film thickness and enhances the film pressure. For these reasons, performance analyses of isothermal AFTBs have shown few discrepancies with real bearing behavior. To account for this phenomenon, a thermal-fluid-structure analysis is conducted to describe the combined mechanics. Results show that the load capacity under the thermal effect is slightly higher than that obtained from isothermal analysis. In addition, the push and pull effects on the top foil and bump foil-free edges can be simulated. The differences between the isothermal and thermal behaviors are discussed.

• Tribology and Lubricants
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• 제23권5호
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• pp.219-227
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• 2007

The dynamic performance of air foil bearings relies on a coupling between a thin air film and an elastic foil structure. A number of successful analytical techniques to predict dynamic performance have been developed. However, the evaluation of its dynamic characteristic is still not enough because of the mechanical complexity of the foil structure and strong nonlinear behavior of friction force. This work presents a nonlinear transient analysis method to predict dynamic performance of foil bearings. In this method, time dependent Reynolds equation is used to calculate pressure distribution and a finite element method is used to model the bump foil structure. The analysis is treated with a direct implicit integration technique that can handle nonlinear problems and the stick-slip algorithm is used to consider friction force. Using this method the response to the mass unbalance excitation is investigated for various design parameters and operating conditions. The results of analysis show that foil bearing is very effective on the restriction of vibration at the resonance frequency compared to the rigid surface bearings and the effectiveness depends on the operating conditions, static load and a amount of mass unbalance. In addition, there exist optimum values of friction coefficient, bump foil stiffness and number of circumferential slit with regards to minimizing dynamic response at the resonance frequency. These optimum values are system dependent.

• KSTLE International Journal
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• 제1권1호
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• pp.12-20
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• 2000

Nano-wear and friction of carbon overcoated laser-textured and mechanically-textured computer hard disk were characterised after contact start/stop (CSS) wear test. Various analytical and mechanical testing techniques were employed to study the changes in topography, roughness, chemical elements, mechanical properties and friction characteristics of the coating arising from the contact start/stop wear test These techniques include: the atomic force microscopy (AFM), the continuous nano-indentation test, the nano-scratch test, the time-of-flight secondary ion mass spectroscopy (TOF-SIMS) and the auger electron spectroscopy (AES). It was shown that the surface roughness of the laser-textured (LT) bump and mechanically textured (MT) Bone was reduced approximately am and 7nm, respectively, after the CSS wear test. The elastic modulus and hardness values increased after the CSS test, indicating straining hardening of the top coating layer, A critical load was also identified fer adhesion failure between the magnetic layer and the Ni-P layer, The TOF-SIMS analysis also revealed some reduction in the intensity of C and $C_2$$F_59$, confirming the wear of lubricant elements on the coating surface.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.79-84
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• 2016

유연전자소자가 외부힘에 의해 변형될 경우 반도체 다이가 기계적 응력 때문에 변형되거나 파괴되고 이러한 변형이나 파괴는 channel의 전자이동도를 변화시키거나 배선의 저항을 증가시켜 집적회로의 동작 오류를 발생시킨다. 따라서 반도체 집적회로는 굽힘 변형이 발생해도 기계적 응력이 발생하지 않는 중립축에 위치하는 것이 바람직하다. 본 연구에서는 굽힘변형을 하는 flip-chip 접합공정이 적용된 face-down flexible packaging system에서 중립축의 위치와 파괴 모드를 조사하였고 반도체 집적회로와 집중응력이 발생한 곳의 응력을 감소시킬 수 있는 방법을 제시하였다. 이를 위해, 설계인자로 유연기판의 두께 및 소재, 반도체 다이의 두께를 고려하였고 설계인자가 중립축의 위치에 미치는 영향을 조사한 결과 유연기판의 두께가 중립축의 위치를 조절하는데 유용한 설계인자임을 알 수 있었다. 3차원 모델을 이용한 유한요소해석 결과 반도체 다이와 유연기판 사이의 Cu bump 접합부에서 항복응력보다 높은 응력이 인가될 수 있음을 확인하였다. 마지막으로 flexible face-down packaging system에서 반도체 다이와 Cu bump 의 응력을 감소시킬 수 있는 설계 방법을 제안하였다.

• Tribology and Lubricants
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• 제34권3호
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• pp.107-114
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• 2018

This paper presents a computational model of a gas foil journal bearing with shim foils between the top foil and bumps, and predicts its static and dynamic performance. The analysis takes the previously developed simple elastic foundation model for the top foil-bump structure and advances it by adding foil models for the "shim foil" and "outer top foil." The outer top foil is installed between the (inner) top foil and bumps, and the shim foil is installed between the inner top foil and outer top foil. Both the inner and outer top foils have an arc length of $360^{\circ}$, but the arc length of the shim foil is shorter, which causes a ramp near its leading edge in the bearing clearance profile. The Reynolds equation for isothermal and isoviscous ideal gas solves the hydrodynamic pressure that develops within the bearing clearance with preloads due to the ramp. The centerline pressure and film thickness predictions show that the shim foil mitigates the peak pressure occurring at the loading direction, and broadens the positive pressure as well as minimum film thickness zones except for the shortest shim foil arc length of $180^{\circ}$. In general, the shim foil decreases the journal eccentricity, and increases the power loss, direct stiffness, and damping coefficients. As the shim foil arc length increases, the journal eccentricity decreases while the attitude angle, minimum film thickness, and direct stiffness/damping coefficients in the horizontal direction increase.