• 마이크로전자및패키징학회지
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• 제26권2호
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• pp.31-43
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• 2019

본 연구에서는 유연한 접속부를 갖는 유연전자 패키지 플립칩 접속을 위해 폴리머 탄성범프를 제작하였으며, 범프의 온도 및 하중에 따른 폴리머 탄성 범프의 점탄성 및 점소성 거동을 해석 및 실험적으로 분석하고 비교 평가하였다. 폴리머 탄성 범프는 하중에 의한 변형이 용이하여 범프 높이 평탄도 오차의 보정이 용이할 뿐만 아니라 소자가 형성된 칩에 가해지는 응력 집중이 감소하는 것을 확인하였다. 폴리머 탄성 범프의 과도한 변형에 따른 Au Metal Cap Crack 현상을 보완하여 $200{\mu}m$ 직경의 Spiral Cap Type, Spoke Cap type 폴리머 탄성 범프 형성 기술을 개발하였다. 제안된 Spoke Cap, Spiral Cap 폴리머 탄성 범프는 폴리머 범프 전체를 금속 배선이 덮고 있는 Metal Cap 범프에 비해 범프 변형에 의한 응력 발생이 적음을 확인할 수 있으며 이는 폴리머 범프 위의 금속 배선이 부분적으로 패터닝되어 있어 쉽게 변형될 수 있는 구조이므로 응력이 완화되는데 기인하는 것으로 판단된다. Spoke cap type 범프는 패드 접촉부와 전기적 접속을 하는 금속 배선 면적이 Spiral Cap type 범프에 비해 넓어 접촉 저항을 유지하면서 동시에 금속 배선에 응력 집중이 가장 낮은 결과를 확인하였다.

• 대한기계학회논문집
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• 제15권2호
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• pp.523-536
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• 1991

This dissertation analyzes the running mechanism of flexible and thin tape above rotating head through the numerical simulation and the experiment. The scope of analysis is confined to the phenomena of two dimensional elasto hydrodynamic lubrication between the protruded bump on a rotating cylinder and the running tape. This model is based on the elastic deformation equation of plate and shell and Reynolds equation. Finite difference method is employed as a numerical technique to calculate (1) the distribution of pressure between the running tape and rotating bump and (2) the vertical deformation of elastic thin tape over he rotating bump under hydrodynamic pressure. In numerical analyses, the effects of bump size on flying characteristics of the tape were evaluated and examined considering the influence of tension and stiffness of tape.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.419-420
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• 2008

• Tribology and Lubricants
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• 제20권5호
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• pp.245-251
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• 2004

This paper presents the effects of the bump foil stiffness on the static and dynamic performance of the foil journal bearings. Reynolds equation is used for the static and dynamic performance analyses. To consider the deflection of top foil the top foil is modeled as a elastic beam and the bump foil is modeled as a spring. So in the static performance analysis the load capacity is compared to the various bump foil stiffness and in the dynamic performance analysis the trajectory of journal center is compared to the various bump foil stiffness.

• Tribology and Lubricants
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• 제21권6호
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• pp.256-262
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• 2005

The calculation of bump foil deflection is very important to predict the performance of foil bearings more accurately, because the foil bearings consist of top foil and its elastic foundation usually called bump foil. For the purpose of this, a finite element model considering 3-dimensional structure of the bump foil is developed to calculate the deflection of inter-connected bump. The results obtained from the suggested model are compared and analyzed with those from the previous proposed deflection models. In addition, load capacity of the foil bearings is analyzed by using this model.

• Tribology and Lubricants
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• 제22권5호
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• pp.252-259
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• 2006

Air foil bearing supports the rotating journal using hydrodynamic force generated at thin air film. The bearing performances, stiffness, damping coefficient and load capacity, depend on the rotating speed and the performance of the elastic foundation, bump foil. The main focus of this study is to decide the dynamic performance of corrugated bump foil, structural stiffness and Coulomb damping caused by friction between bump foil and top foil/bump foil and housing. Structural stiffness is determined by the bump shape (bump height, pitch and bump thickness), dry-friction, and interacting force filed up to fixed end. So, the change of the characteristics was considered as the parameters change. The air foil bearing specification for analysis follows the general size; diameter 38.1 mm and length 38.1 mm (L/D=1.0). The results show that the stiffness at the fixed end is more than the stiffness at the free end, Coulomb damping is more at the fixed end due to the small displacement, and two dynamic characteristics are dependent on each other.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2006년도 춘계학술대회논문집
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• pp.1135-1141
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• 2006

Air foil bearing supports the rotating journal using hydrodynamic force generated at thin air film. The bearing performance, stiffness, damping coefficient and load capacity, depends on the rotating speed and the performance of the elastic foundation, bump foil. The main focus of this study is to decide the dynamic performance of corrugated bump foil, structural stiffness and Coulomb damping caused by friction between bump foil and top foil/bump foil and housing. Structural stiffness is determined by the bump shape (bump height, pitch and bump thickness), dry-friction, and interacting force filed up to fixed end. So, the change of the characteristics was considered as the parameters change. The air foil bearing specification for analysis follows the general size; diameter 38.1 mm and length 38.1mm (L/D=1.0). The results show that the stiffness at the fixed end is more than the stiffness at the free end, Coulomb damping is more at the fixed end due to the small displacement, and two dynamic characteristics are dependent on each other.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2004년도 유체기계 연구개발 발표회 논문집
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• pp.98-103
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• 2004

This paper presents modeling and simulation of the bump foil bearings with consideration of the elastic behavior of the foil and gas compressibility. Heshmat had originally introduced the simple compliance model to estimate the EHL(elasto-hydrodynamic lubrication) performance. But this approach can not consider the deflection of top foil at the edge of bearing, so model is insufficient to analyze in case that the eccentricity ratio is greater than I. So the top foil is considered as a simple beam model supported by linear spring elements, and the bump foil deflection can be simple compliance model. The EHL calculations are performed for convention rigid type, classical foil type, variable pitch type and double bump type toil bearings. This paper presents that 2nd or 3rd generation bearings have excellent performance in every speeds.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Tribology and Lubricants
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• 제28권4호
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• pp.173-177
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• 2012

We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.