• 한국정밀공학회지
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• 제19권6호
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• pp.29-34
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• 2002

This paper presents formation of ejector-pin hollowness in injection molding. Injection molding process is widely used in production of plastic part for good dimensional accuracy and high productivity. However, the injection molding leaves ejector-pin hollowness on pal, which causes bad part surface and quality. Dimensions and profiles of ejector-pin hollowness are measured for formation or ejector-pin hollowness. The formation of ejector-pin hollowness is traced with dimensions and profiles of ejector-pin hollowness. The compression force and moment cause ejector-pin to form hollowness on part surface.

• 한국CDE학회논문집
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• 제9권2호
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• pp.112-121
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• 2004

As customers demands are rapidly changing, a product life cycle is getting shorter and a product model is forced to be changed frequently. An ejecting design system becomes more important for high productivity to eject a product in high temperature without any damage. For example, an ejector pin that is a key component of the system can cause high local stresses and strains in the molding at the time of ejection. The number, the size, and the location of pins are important to make a smooth ejection. Therefore we propose an analytical approach with the aid of designer’s experience to calculate a total release force and pressure distribution so that the number, the size, and the location of pins can be easily determined. As a part of the result, the design system is built by Intent! with AutoCAD 2000 and a video player deck example is presented to verify the approach.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.603-607
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• 2002

Cavity pressure is a factor of what is occurring inside the mold and is used as one of the process parameters that control the overall injection molding cycle. The insight of cavity pressure is able to predict part quality and optimum process condition. In this paper, it is adapted ejector pin sensor to measure the cavity pressure and investigates the flow balance and the cavity pressure according to different runner thickness for adjusting the flow balance. Flow balance is very important to have not the poor results such as flash and warpage in the family mold. This paper predicted flow balance and cavity pressure using CAE analysis tool and compared with the test results. The results of analysis and test have a good agreement with the cavity pressure profile and flow pattern of the test.

• 한국산학기술학회논문지
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• 제13권8호
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• pp.3301-3306
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• 2012

LED 칩 패키징에서 다이 본딩은 분할된 칩을 리드 프레임에 고정시켜 칩이 이후 공정을 견딜 수 있도록 충분한 강도를 제공하는 중요한 공정이다. 기존의 다이 본더의 픽업 장치는 단순히 콜렛의 하강 동작과 이젝터 핀의 상승 동작만으로 구동되어 픽업 장치와 다이가 접촉하는 순간 충격에 의한 다이의 손상과 위치 정렬 오차에 대한 문제점이 발생한다. 본 연구에서는 위치 정렬 에러 및 다이의 손상을 최소화시키기 위하여 고정밀, 고속 이송이 가능한 픽업 헤드를 사용한 다이 본더 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 다이 본더의 유한요소모델을 생성하였고 구조 해석을 수행하였다. 그다음, 다이 본더의 작동 주파수에 대해 픽업 헤드의 유한요소모델을 이용하여 진동해석을 수행하였다. 해석 결과, 다이 본더에 작용하는 응력 및 변위, 고유진동수에 대해 분석하였고 개발된 시스템의 구조적 안정성에 대해 확인하였다.