• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.29-34
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• 2002

This paper presents formation of ejector-pin hollowness in injection molding. Injection molding process is widely used in production of plastic part for good dimensional accuracy and high productivity. However, the injection molding leaves ejector-pin hollowness on pal, which causes bad part surface and quality. Dimensions and profiles of ejector-pin hollowness are measured for formation or ejector-pin hollowness. The formation of ejector-pin hollowness is traced with dimensions and profiles of ejector-pin hollowness. The compression force and moment cause ejector-pin to form hollowness on part surface.

• Korean Journal of Computational Design and Engineering
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• v.9 no.2
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• pp.112-121
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• 2004

As customers demands are rapidly changing, a product life cycle is getting shorter and a product model is forced to be changed frequently. An ejecting design system becomes more important for high productivity to eject a product in high temperature without any damage. For example, an ejector pin that is a key component of the system can cause high local stresses and strains in the molding at the time of ejection. The number, the size, and the location of pins are important to make a smooth ejection. Therefore we propose an analytical approach with the aid of designer’s experience to calculate a total release force and pressure distribution so that the number, the size, and the location of pins can be easily determined. As a part of the result, the design system is built by Intent! with AutoCAD 2000 and a video player deck example is presented to verify the approach.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.603-607
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• 2002

Cavity pressure is a factor of what is occurring inside the mold and is used as one of the process parameters that control the overall injection molding cycle. The insight of cavity pressure is able to predict part quality and optimum process condition. In this paper, it is adapted ejector pin sensor to measure the cavity pressure and investigates the flow balance and the cavity pressure according to different runner thickness for adjusting the flow balance. Flow balance is very important to have not the poor results such as flash and warpage in the family mold. This paper predicted flow balance and cavity pressure using CAE analysis tool and compared with the test results. The results of analysis and test have a good agreement with the cavity pressure profile and flow pattern of the test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.