• Textile Coloration and Finishing
• /
• v.6 no.2
• /
• pp.1-9
• /
• 1994

In order to study the effect of mordanting on silk fabrics treated with tannin, those fabrics were treated with Al, Cu, Cr, Fe, Sn by pre and post mordanting. It was studied about color change, weighting effect, dgree of photodegradation by pre and post mordanting. The results are as fallows ; 1. On the addition of mordants into mimosa and tannic acid solution, &{\lambda}_{max}& of the former was slightly blue-shifted, on the other hand, &{\lambda}_{max}& of the latter was obviously Red-shifted. 2. In case of Cu, Cr, Pre mordanting, weighting effect were appeared. Weighting effect of silk fabrics treated with Tannic acid increased higher than mimosa by mordanting. 3. In color change, Silk fabrics treated with Mimosa and Tannic acid generally changed to red direction and fabrics treated with tannic acid changed to yellow direction by pre and post mordanting. 4. In the photodegradation, the degree of photodegradation on mordanted fabrics increased. Its degree was slack in Cu, Cr, Post mordanting. On the other hand, Al, Fe, Sn were greate. Silk fabrics treated with Mimosa and Tannic acid got inhibiting effect on photodegradation.

• Journal of the Korean Chemical Society
• /
• v.57 no.4
• /
• pp.483-488
• /
• 2013

Copper oxide (CuO) was synthesized from $CuCl_2$ by solution method. Anatase $TiO_2$ particle was dispersed into the solution before preparing CuO, so that $TiO_2$/CuO heterojunction was created through the nucleation of CuO onto the $TiO_2$ surface. Some amount of CuO was reduced to $Cu_2O$ by treating glucose into the solution, thereby preparing $TiO_2/Cu_xO$ complex. The obtained $TiO_2/Cu_xO$ complex showed advanced phtocatalytic activity under the sun light compared with the P-25 sample. In addition, the the $TiO_2/Cu_xO$ complex showed excellent antipathogenic effect.

• Journal of the Korean Vacuum Society
• /
• v.9 no.3
• /
• pp.197-206
• /
• 2000

The deposition characteristics of MOCVD Cu using the (hfac)Cu(1,1-COD)(1,1,1,5,5,5-hexafluoro-2,4-pentadionato Cu(I) 1,5-cyclooctadine) have been investigated in terms of the effects of carrier gas such as hydrogen and argon as well as the effects of H(hfac) ligand addition. MOCVD Cu using a hydrogen carrier gas led to a higher deposition rate and lower resistivity than an argon carrier gas system. The improvement in the surface roughness of the MOCVD Cu films and the (111) preferred orientation texture was obtained by using a hydrogen carrier gas. However, the adhesion characteristics of the films showed relatively weaker compared to the Ar carrier gas system, probably due to the larger amount of F content in the films, which was confirmed by the AES analyses. When an additional H(hfac) ligand was added, the deposition rate was significantly enhanced in the case of an argon + H(hfac) carrier gas system while significant change in the deposition rate of MOCVD Cu was not observed in the case of the hydrogen carrier gas system. However, the addition of H(hfac) in both carrier gases led to lowering the resistivity of the MOCVD Cu films. In conclusion, this paper suggests the deposition mechanism of MOCVD Cu and is expected to contribute to the enhancement of smooth Cu films with a low resistivity by manipulating the deposition conditions such as the carrier gas and addition of H(hfac) ligand.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.2
• /
• pp.152-157
• /
• 2001

For the fabrication of YBa$_2$Cu$_3$O$_{x}$ thick film using diffusion process between $Y_3$BaCuO$_{5}$ and BaO+CuO, each material was selected as substrate and doping material. In this paper, we investigated the characteristic of YBa$_2$Cu$_3$O$_{x}$ thick film due to both addition of CeO$_2$into substrate and initial particle size of doping material. Through X-ray diffraction patterns and SEM photographs, the variation of composition and thickness of the formed phase was observed. It was from the experiment obtained that the addition of CeO$_2$into $Y_2$BaCuO$_{5}$ substrate and the initial particle size of doping material play important part in promoting the reaction between substrate and doping material.aterial.

• Journal of Korea Foundry Society
• /
• v.41 no.5
• /
• pp.419-433
• /
• 2021

Al-Si-Cu alloys benefit from the addition of copper for better hardness and strength through precipitation hardening, which results in remarkably strong alloys. However, the addition of copper expands the solidification range of Al-Si-Cu alloys, and due to this, these alloys become more prone to hot tearing, which is one of the most common and serious fracture phenomena encountered during solidification. The conventional evaluation method of the hot tearing properties of an alloy is a relative and qualitative analysis approach that does not provide quantitative data about this phenomenon. In the present study, the mold itself part of a device developed in Instone et al. was partially modified to obtain more reliable quantitative data pertaining to the hot tearing properties of an Al-Si-Cu casting alloy. To assess the influence of Cu element, four levels of Cu contents were tested (0.5, 1.0, 3.0, and 5.0 wt.%) in the Al-Si-Cu system alloy and the hot tearing properties were evaluated in each case. As the Cu content was increased, the hot tearing strength decreased to 2.26, 1.53, 1.18, and 1.04 MPa, respectively. At the moment hot tearing occurred, the corresponding solid fraction and solidification rate decreased at the same temperature due to the increase in the solid-liquid coexistence range as the Cu content increased. The morphology of the fracture surfaces was changed from dendrites to dendrites covered with residual liquid, and CuAl₂ phases were observed in the vicinity of hot tearing.

• Journal of Korea Foundry Society
• /
• v.41 no.5
• /
• pp.411-418
• /
• 2021

In order to experimentally investigate the effect of Ni or Cu addition on microstructure and mechanical properties of high Si Solution Strengthened Ferritic Ductile cast Iron (SSF DI), a series of lab-scale sand casting experiment were conducted by changing initial concentration of Ni up to 3.0wt% or Cu up to 0.9wt% in the alloy. It was found that increase in Ni or Cu content in the alloy leads to increase in strength properties and hardness as well as decrease in ductility. The higher Ni or Cu content the SSF DI has, the higher fraction of pearlite was observed. At similar levels of Ni or Cu contents in the alloy, higher pearlite area fraction was observed in the Cu-containing SSF DI than that in the Ni-containing SSF DI. When the effect of the microstructure on the mechanical properties of Ni-containing SSF DI was considered, Ni-containing SSF DI was found to have excellent strength and hardness as well as good elongation when the pearlite fraction was controlled less than 10%. As the pearlite fraction in the Ni-containing SSF DI exceeds 10%, however, it shows drastic decrease in elongation. Meanwhile, gradual increase in strength and hardness, and decrease in elongation with respect to increase in pearlite fraction were observed in Cu-containing SSF DI. The different microstructure-mechanical property relationships between Ni-containing and Cu-containing SSF DI were due to the combined effect of the relatively weak pearlite stabilizing effect of Ni compared to that of Cu in high Si SSF DI, and matrix strengthening effect caused by the different amounts of those alloying elements required for similar pearlite fraction.

• Journal of Korea Foundry Society
• /
• v.39 no.6
• /
• pp.103-109
• /
• 2019

Cu-added SKD11 was manufactured through the casting process and the effects of Cu addition with different contents (0, 1, 2 and 3 wt%) and aging treatment on microstructure, mechanical characteristics such as tensile strength and hardness, and thermal conductivity were investigated. The microstructure was analyzed by FE-SEM and XRD, the mechanical characteristics by Rockwell hardness tester and Tensile tester, and the thermal conductivity by Laser flash. As a result, SKD11 containing Cu had higher hardness than as-received SKD11. The hardness of as-cast SKD11 containing 1 wt% Cu was 42.4 HRC, whereas the hardness of asreceived SKD11 cast alloy was 19.5 HRC, indicating that the hardness was greatly improved when Cu was added. In the case of tensile strength, Cu-added SKD11 cast alloy had lower tensile strength than as-received SKD11, and the tensile strength tended to increase as Cu content increased. After heat treatment, however, tensile strength of as-received SKD11 was significantly increased, whereas in the case of Cu-added SKD11, as the Cu contents increased, the tensile strength increased less and even reduced at 3 wt% Cu. The thermal conductivity of Cu-added SKD11 cast alloy was about 13 W m^-1 K^-1, which was lower than that of the asreceived SKD11 cast alloy (28 W m^-1 K^-1). After the heat treatment, however, the thermal conductivity of as-received SKD11 was reduced, while the thermal conductivity of the SKD11 added with Cu was increased. Thermal conductivity was generally larger with less Cu content, and this tendency became more pronounced after heat treatment.

• Korean Journal of Materials Research
• /
• v.19 no.2
• /
• pp.111-114
• /
• 2009

For the fabrication of core-shell structure bimetallic lead-free solder balls, both the critical temperature ($T_{cr}$) for the phase separation of two immiscible liquid phases and the temperature coefficient of the interfacial tension between the two separated liquid phases are required. In order to obtain this information, the temperature dependence of the surface tension of 60%Bi-24%Cu-16%Sn(-REM) alloys was measured using the constrained drop method. The slope of the temperature dependence of the surface tension changed clearly at a critical temperature for the separation of two immiscible liquid phases. The critical temperature of the 60%Bi-24%Cu-16%Sn alloy was estimated to be 1097K. An addition of 0.05% Ce decreased the critical temperature to 1085K, whereas that of 0.05% La increased it to 1117K. It was found that the surface tension and its temperature coefficient of the 60%Bi-24%Cu-16%Sn alloy were slightly increased by the addition of 0.05% Ce and 0.05% La. In addition, additions of Ce and La increased the temperature coefficient of the interfacial tension.

• Progress in Superconductivity and Cryogenics
• /
• v.18 no.4
• /
• pp.1-4
• /
• 2016

We investigated the relation between the Cu-O bond length and the superconducting properties of $BaSnO_3$ (BSO)-added $GdBa_2Cu_3O_{7-x}$ (GdBCO) thin films by using extended x-ray absorption fine structure (EXAFS) spectroscopy. 4 wt.% $BaSnO_3$ (BSO) added $GdBa_2Cu_3O_{7-x}$ (GdBCO) thin films with varying thickness from $0.2{\mu}m$ to $1.0{\mu}m$ were fabricated by using pulsed laser deposition (PLD) method. The transition temperature ($T_c$) and the residual resistance ratio (RRR) of the GdBCO films increased with increasing thickness up to $0.8{\mu}m$, where the crystalline BSO has the highest peak intensity, and then decreased. This uncommon behaviors of $T_c$ and RRR are likely to be created by the addition of BSO, which may change the ordering of GdBCO atomic bonds. Analysis from the Cu K-edge EXAFS spectroscopy showed an interesting thickness dependence of ordering behavior of BSO-added GdBCO films. It is noticeable that the ordering of Cu-O bond and the transition temperature are found to show opposite behaviors in the thickness dependence. Based on these results, the growth of BSO seemingly have evident effect on the alteration of the local structure of GdBCO film.

• Clean Technology
• /
• v.7 no.1
• /
• pp.35-42
• /
• 2001

This study was performed to evaluate the effect of zeolite addition on biofloc in aictvated sludge process. Two units were compared each other, in which one was operated as control unit (CU) and the other was managed by adding zeolite into aeration basin to sustain 4,000 mg/l (ZU). It was observed that flocs of both units were enduringly increased in medium size by extending SRT (Solid Retention Time), although their effect size of ZU was smaller than theirs of CU. Zeolite application excessively improved sludge settling property and ZU presented sludge settling velocity of 3.4 to 11 m/h regardless of SRT variation. The sludge volume index (SVI) was in the range of 50 and 108 ml/g. Conversely, the sludge settling velocity of CU seriously depended on SRT increase, and sludge sedimentation was not achieved at a 40 days of SRT due to Sphaerotilus appeared predominantly in reactor.