• Korean Journal of Materials Research
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• v.14 no.7
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• pp.462-469
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• 2004

The effect of Cu addition on the corrosion characteristics of Zr alloys that developed for nuclear fuel cladding in KAERI (Korea Atomic Energy Research Institute) was evaluated. The alloys having different element of Nb, Sn, Fe, Cr and Cu were manufactured and the corrosion tests of the alloys were performed in static autoclave at $360^{\circ}C$, distilled water condition. The alloys were also examined for their microstructures using the optical microscope and the TEM equipped with EDS and the oxide property was characterized by using X-ray diffraction. From the result of corrosion test more than 450 days, the corrosion rate of the Zr-based alloys was changed with alloying element such as Nb, Sn, Fe, Cr and especially affected by Cu addition. The corrosion resistance was increased with increasing the Cu content and the tetragonal $ZrO_2$ layer was more stabilized on the Cu-containing alloys.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.3
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• pp.150-158
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• 2022

The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al₅FeSi phases were segmented and refined. The nanosized Al₃Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.557-558
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• 2006

In all conventional sintered PM products, the pores present are of two types, primary and secondary. Primary pores forming during compaction and latter during sintering, due to penetration of formed liquid through the matrix grain boundary. Effect of carbon addition on diffusion of Cu in SH737-2Cu system was investigated. After compaction and transient liquid phase sintering at $1120^{\circ}C$ and $1180^{\circ}C$, samples were characterized for densification, showing rise in sintering density and reduction in swelling on carbon addition. Quantitative microstructural characterization (shape factor and pore size) revealed bimodal distribution for 0% carbon, more rounded pores for 0.9% carbon and higher sintering temperature, and pore coarsening at higher sintering temperature.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2005.11a
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• pp.43-43
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• 2005

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.884-892
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• 2010

To modify the physical properties of Cu thin films, gelatin is generally used as an additive. In this study, we assessed the effect of gelatin on the mechanical properties of electrodeposited Cu films. For this purpose, Cu/gelatin composite films were fabricated by adding 100 ppm of gelatin to an electrolyte, and tension and indentation tests were then performed. Additional tests based on pure Cu films were also performed for comparison. The Cu films containing gelatin presented a smaller grain size compared to that of pure Cu films. This increased the hardness of the Cu films, but addition of gelatin did not significantly affect the elastic modulus of the films. Cu films prepared at room temperature showed no significant change in the yield strength and tensile strength with an addition of gelatin, but we observed a dramatic decrease in the elongation. In contrast, Cu films prepared at $40^{\circ}C$ with gelatin presented a significant increase in the yield strength and tensile strength after the addition of gelatin. Elongation was not affected by adding gelatin. Presumably, the results would be closely related to the preferred orientation of the Cu thin film with the addition of gelatin and at temperatures that lead to a change in the microstructure of the Cu thin films.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Transactions on Electrical and Electronic Materials
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• v.5 no.3
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• pp.109-112
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• 2004

In this study, in order to develop the low temperature sintering ceramics for ultrasonic vibrator, Pb(Sb$\_$$\frac{1}{2}$/Nb$\_$$\frac{1}{2}$/) O$_3$-Pb(Ni$\_$1/3/Nb$\_$2/3/)O$_3$-Pb(Zr$\_$0.48/Ti$\_$0.52/)O$_3$ ceramics were manufactured as a function of the amount of CuO addition, and their dielectric and piezoelectric characteristics were investigated. With increasing CuO addition, the grain size and density increased up to 0.3 wt% CuO addition. Taking into consideration electromechanical coupling factor(k$\_$p/) of 0.53, mechanical quality factor(Q$\_$m/) of 423, dielectric constant($\varepsilon$$\_$r/) of 1,759 and piezoelectric constant(d$\_$33/) of 362pC/N, it could be concluded that 0.5 wt% CuO added composition ceramic sintered at 920$^{\circ}C$ was suitable for ultrasonic vibrator application.

• Journal of the Korean institute of surface engineering
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• v.42 no.5
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• pp.246-249
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• 2009

Cu-Ti alloys with titanium in the range of 0.5-6.0 wt% were developed to evaluate the effect of the titanium content and heat treatment on microstructure, hardness, and electrical conductivity. The hardness of the Ti-added copper alloys generally increased with the increase in titanium content and hardening was effective up to the 2.5 wt%-Ti addition. Microstructural examination showed that the second phase of $Cu_4Ti$ started to precipitate out from the 3.0 wt% Ti-addition, and the precipitate size and volume fraction increased with further Ti addition. Aging of the present Cu-Ti alloys at $450^{\circ}C$ for 1 h increased the hardness; however, the further aging up to 10 h did not much change the hardness. In the present study, it was inferred that in optimal Ti addition and aging condition Cu-Ti alloy could have the hardness and electrical conductivity values which are comparable to those of commercial Cu-Be alloy.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.86-86
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.85-85
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• 2002