• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.183-184
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.289-294
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• 2012

There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from nonuniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.

• Journal of Drive and Control
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• v.10 no.3
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• pp.7-13
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• 2013

Hydraulic vane pumps are widely used in various hydraulic systems because of its compactness and light weight. It is well known that the vanes and cam ring are separated by very thin liquid films which result in the EHL state. Contrary to the case of cylindrical roller bearings, the inlet and side boundary pressures are much higher than the atmospheric pressure. In this paper, a numerical solution of the EHL of finite line contacts between the cam ring and vane tip with profiled ends is presented. Using a finite difference method with non-uniform grids and the Newton-Raphson method, converged solutions are obtained for moderate load and material parameters. The EHL pressure distribution and film shape are considerably affected by pump delivery pressure and the side boundary condition applied. Both the maximum pressure and the minimum film thickness always occurred near the edge regions. The present results can be used in the design of optimum vane profile in hydraulic vane pump.