• 제목/요약/키워드: Eco-friendly Packaging

검색결과 115건 처리시간 0.021초

Biodegradable PLA-based Biocomposites with Spent Coffee Grounds as Degradation Accelerator: Hydrolytic Degradation and Characterization Research

  • Kim, Youngsan;Lim, Daekyu;Kwon, Sangwoo;Jang, Hyunho;Park, Su-il
    • 한국포장학회지
    • /
    • 제28권2호
    • /
    • pp.89-95
    • /
    • 2022
  • The goal of this study was to evaluate the effect of spent coffee grounds (SCG) biofiller on the morphological, thermal, mechanical and hydrolytic degradation characteristics of poly(lactic acid) (PLA) based biocomposites. The PLA-based biocomposite films were fabricated by using a high-viscosity kneading and hot-pressing machine. The PLA/SCG biocomposites were analyzed with SEM, DSC, TGA, UTM and hydrolytic degradation test. Aggregation in the PLA matrix is a result of increasing SCG concentrations. In the thermal properties, it was described that the cold crystallization temperature (Tcc) decreased as SCG was added to PLA. When SCG was incorporated to PLA, the degradation onset temperature (Tonset) revealed a diminish. The elastic modulus increased while tensile strength of PLA diminished as SCG was applied. Through hydrolysis analysis, the decomposition of PLA was accelerated with the addition of SCG. This research confirmed the possibility of devloping an eco-friendly packaging material with high degradability as SCG hasten the breakdown of PLA.

Preparation and Characterization of PBAT/OTPS Blend Films with Epoxidized Soybean Oil (ESO) for Eco-friendly Packaging Application

  • Jina Song;Sangwoo Kwon;Su-il Park
    • 한국포장학회지
    • /
    • 제29권1호
    • /
    • pp.9-14
    • /
    • 2023
  • The application of starch-based films is limited by the poor water vapor barrier and mechanical properties. In this study, plasticized octenyl-succinated corn starch (OTPS) was mixed into Poly (butylene adipate-co-terephthalate) (PBAT) with various concentration (0/0.25/0.5/0.75 wt%) of epoxidized soybean oil (ESO) to enhance the mechanical properties and the hydrophobicity of blends. Tensile Strength and elongation at break of PBAT/OTPS film was slightly strengthened as the added ratio of ESO raised to 0.5 wt%, yet lessened again in 0.75 wt% sample. The yield strength and elastic modulus were highest in 0.25wt% of ESO added. In thermal properties, the melting temperature (Tm) and crystallization temperature (Tc) were highest at ESO 0.25 and the maximum degradation temperature (Tmax) of components of the films were developed as ESO added. Also, it has been proved that the addition of hydrophobic substances reduces the hydrophilicity of the film by contact angle. This suggests the use of epoxidized oil for preparing films based on high TPS content allows obtaining enhanced interfacial adhesion. This study confirmed that ESO acts as a compatibilizer between OTPS and PBAT to improve the mechanical properties and hydrophobicity of the sample. The sample containing 0.5wt% of ESO was the most suitable for packaging application.

친환경 골판지 상자 제조를 위한 재활용 폐지 섬유의 물리적·환경적 특성 평가 (Fiber Analysis and Environmental Assessment of Recycled Waste paper for Eco-friendly Corrugated Box Manufacture)

  • 박정윤;이태주;김형진;김진무
    • 펄프종이기술
    • /
    • 제45권4호
    • /
    • pp.65-74
    • /
    • 2013
  • In the manufacture of corrugated box, the fibrous raw materials are mainly consisted of recycled papers, such as KOCC(Korean Old Corrugated Container), kraft sack, and AOCC(American Old Corrugated Container). Among these recycled waste paper, the proportion of KOCC is relatively higher than others in fibrous raw materials. Generally, KOCC shows some poor fiber properties and contains hazardous heavy metal sources. Therefore, it is to evaluate the property of recycled paper sources for eco-friendly corrugated box manufacture. In this study, the physical and mechanical properties of 3 kinds of recycled fibers and their mixed stocks were analyzed. The environmental assessment was also evaluated by analyzing the 4 representative heavy metal contents and evaporation residues in waste papers. As the results, KOCC showed the poorest fiber qualities and had the highest heavy metal contents and evaporation residues among the recycled fibers. Finally, the mechanical strength properties were increased by decreasing KOCC proportion of mixed stock conditions. In addition, the heavy metal contents and evaporation residues were also decreased by increasing recycled AOCC and kraft sack proportion.

The Importance of Green Fashion Product Development to Improve Consumers' Environmental Awareness

  • Suk-Kyung YANG
    • 동아시아경상학회지
    • /
    • 제11권2호
    • /
    • pp.29-38
    • /
    • 2023
  • Purpose - The current study aims to learn how fashion consumers now feel about environmental issues. The significance of "green fashion product creation" in resolving environmental issues is explored. It also examines how customers' environmental consciousness has evolved due to the introduction of green fashion products. Research design, data, and methodology - The study methods, procedures, and results of the 16 publications included in this literature review were critically examined. The data sources, analyses, and key findings presented in each publication were compared and contrasted. To better understand how to raise environmental consciousness among customers. Result - The investigation indicates a total of four results why eco-friendly product should be developed to attract potential green consumers. Four solutions are as follows; (1) Encourages Sustainable Consumption Behavior, (2) Increases Consumer Environmental Awareness, (3) Improves Corporate Social Responsibility, and (4) Enhances Competitive Advantage. Conclusion - Promoting sustainability in the fashion sector requires full visibility throughout the supply chain. Companies in the fashion industry would serve their customers better if they were more forthcoming about the resources, methods, and circumstances that went into making their wares. Consumers may accomplish this by including instructions on the packaging or posting them on the business's website.

IP-R&D를 통한 자동차분야 LED사업전략에 관한 연구 : Flip-Chip을 채용한 CSP (Chip-Scale Packaging) 기술을 중심으로 (A Study on Automotive LED Business Strategy Based on IP-R&D : Focused on Flip-Chip CSP (Chip-Scale Packaging))

  • 류창한;최용규;서민석
    • 반도체디스플레이기술학회지
    • /
    • 제14권3호
    • /
    • pp.13-22
    • /
    • 2015
  • LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

세미나 - 브랜드 쇼핑백 디자인의 친환경적 소구에 대한 수용자 인식과 선호도 (Consumer's Awareness and Preference on Brand Shopping Bag Design's Eco-friendly Resource)

  • 양초산
    • 월간포장계
    • /
    • 통권245호
    • /
    • pp.98-112
    • /
    • 2013
  • 친환경 디자인이란 환경과 생태적 측면을 고려한 제반 디자인 활동이나 경향을 의미하며, 최근 많은 기업체에서 친환경 제품이나 서비스를 통해 일반 소비자들과 소통하는 중요한 분야로 인식되고 있다. 따라서 본 연구에서는 백화점 쇼핑백 디자인의 재활용 여부와 경험, 횟수, 관심도, 조형성 평가를 통해 주요 3개국(한국, 일본, 미국) 백화점 쇼핑백에 대한 일반소비자들의 친환경적 소구에 대한 인식과 선호도 연구결과를 조사하는데 목적이 있다. 본 연구에서는 분석을 위해 연구범위를 주요 3개국 고급백화점으로 제한하였으며, 분석 대상업체의 개수를 한국 4업체, 일본 4업체, 미국 6업체 등 최종 3개국 14업체를 분석대상으로 선정하고 통계분석(spsswin18.O)하였다. 본 고는 한국브랜드디자인학회 통권 제24호에서 발췌했다.

  • PDF

Analysis of Pest Prevention Packaging Cases in Preparation for Consumer Complaints Caused by Global Warming in the Product Distribution Process: Focusing on Poly Bag Packaging for Hygiene Products in Company A

  • Jung, Sung-Tae
    • 한국포장학회지
    • /
    • 제27권1호
    • /
    • pp.9-16
    • /
    • 2021
  • The present study was conducted to accomplish management efficiency by preparing preemptive measures for consumer dissatisfaction and overcome risks caused by Global Warming through studies of model cases in packaging. Through this study, we made it possible to find a way for companies to prepare for Global warming and consumer dissatisfaction. By contributing to eco-friendly packaging, we are trying to preemptively respond to recent major issues through packaging. Through this experiment, we tried to measure the degree of penetration of Plodia interpunctella H. larva into the insect repellent film produced by printing Ink containing a natural repellent. The control experiment was conducted with an untreated LDPE film to which no insect repellent was applied. The numbers decreased from 17 to 7 when the film was processed with repellent to show experimental results verifying effects of repellent by decrease in 10 (58.8% Decrease). Such results show that it is safe when the film is unfolded but in the case where the film is folded, the Plodia interpunctella H. punches through the film to lead to consumer dissatisfaction and it suggests that this can bring on risks to corporate management. Considering that most of the film is folded in the case of PE bag packaging, the direction which the corporations should take in terms of preparing for climate change countermeasures and consumer dissatisfaction has been clarified. Due to it receiving satisfactory results in safety rest results for printing film applied with pest repellent as well as the Quality analysis to test repellent contents of repellent film, it is certain that the importance of repellent method in packaging will increase in preparing for consumer dissatisfaction and actions against climate change henceforth.

토양의 다짐도와 재령기간에 따른 E.S.B. 혼합토의 일축압축강도특성 (Unconfined Compressive Strength Characteristics of E.S.B. Mixed Soil Based on Soil Compactness and Curing Period)

  • 오세욱;김홍석;방성택
    • 한국지반환경공학회 논문집
    • /
    • 제20권5호
    • /
    • pp.47-55
    • /
    • 2019
  • 본 연구에서는 토양의 종류에 따라 친환경고화재인 E.S.B.(Eco Soil Binder)를 사용하여 혼합토의 강도특성과 활용목적에 따른 흙 포장의 기초자료를 제공하고자 한다. 연구에 사용된 토양은 우리나라 주변에서 흔히 채취되는 화강풍화토로 토질분류법에 의한 SW, SP, SC로 구분된다. 일축압축강도 시험을 위한 공시체는 지름 50mm, 높이 100mm의 크기로 혼합토 중량대비 E.S.B.의 혼합비율을 5%, 10%, 15%, 20%, 25%, 30%로 변화시키고 각 조건에 따라 다짐도를 90%, 100%를 적용하고 재령기간 3, 7, 28일에 따른 일축압축강도 특성을 분석하였다. 또한 흙 포장 기준강도와 일축압축강도의 강도비를 산정하여 최적의 E.S.B.혼합비율을 결정하고 ACI209R의 추정식을 활용한 일축압축강도의 현장 적용성을 평가하였다.

국내 수송환경에 적합한 마찰전기 나노발전기의 발전특성 분석 (Analysis of Power Generation Characteristics of TENG (Triboelectric Nanogenerator) Suitable for Domestic Transport Environment)

  • 박종민;정현모
    • 한국포장학회지
    • /
    • 제28권3호
    • /
    • pp.193-199
    • /
    • 2022
  • Sustainable energy supplies without the recharging and replacement of charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. The TENG harvests electrical energy from wasted mechanical energy in the ambient environment. TENG devices are very likely to be used in next-generation renewable energy and energy harvesting. TENG devices have the advantage of being able to manufacture very simple power devices. In this experiment, various organic dielectrics and inorganic dielectrics were used to improve the open voltage of TENG, Among the various organic dielectrics, Teflon-based FEP, which has the highest electron affinity, showed the highest open voltage and Al electrode was fabricated on Teflon substrate by sputtering deposition process. And AAO (Anodized Aluminum Oxide) nanostructures were applied to maximize the specific surface area of the TENG device. The power generation of TENG within the acceleration level (0.25, 0.5, 1.0, 1.5 and 2 G) and the frequency range (5-120 Hz) of the domestic transport environment was up to 4 V.

반도체 패키징용 에폭시 기반 접합 소재 및 공정 기술 동향 (Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging)

  • 엄용성;최광성;최광문;장기석;주지호;이찬미;문석환;문종태
    • 전자통신동향분석
    • /
    • 제35권4호
    • /
    • pp.1-10
    • /
    • 2020
  • Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.