• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.2
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• pp.89-95
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• 2022

The goal of this study was to evaluate the effect of spent coffee grounds (SCG) biofiller on the morphological, thermal, mechanical and hydrolytic degradation characteristics of poly(lactic acid) (PLA) based biocomposites. The PLA-based biocomposite films were fabricated by using a high-viscosity kneading and hot-pressing machine. The PLA/SCG biocomposites were analyzed with SEM, DSC, TGA, UTM and hydrolytic degradation test. Aggregation in the PLA matrix is a result of increasing SCG concentrations. In the thermal properties, it was described that the cold crystallization temperature (T_cc) decreased as SCG was added to PLA. When SCG was incorporated to PLA, the degradation onset temperature (T_onset) revealed a diminish. The elastic modulus increased while tensile strength of PLA diminished as SCG was applied. Through hydrolysis analysis, the decomposition of PLA was accelerated with the addition of SCG. This research confirmed the possibility of devloping an eco-friendly packaging material with high degradability as SCG hasten the breakdown of PLA.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.1
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• pp.9-14
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• 2023

The application of starch-based films is limited by the poor water vapor barrier and mechanical properties. In this study, plasticized octenyl-succinated corn starch (OTPS) was mixed into Poly (butylene adipate-co-terephthalate) (PBAT) with various concentration (0/0.25/0.5/0.75 wt%) of epoxidized soybean oil (ESO) to enhance the mechanical properties and the hydrophobicity of blends. Tensile Strength and elongation at break of PBAT/OTPS film was slightly strengthened as the added ratio of ESO raised to 0.5 wt%, yet lessened again in 0.75 wt% sample. The yield strength and elastic modulus were highest in 0.25wt% of ESO added. In thermal properties, the melting temperature (T_m) and crystallization temperature (T_c) were highest at ESO 0.25 and the maximum degradation temperature (T_max) of components of the films were developed as ESO added. Also, it has been proved that the addition of hydrophobic substances reduces the hydrophilicity of the film by contact angle. This suggests the use of epoxidized oil for preparing films based on high TPS content allows obtaining enhanced interfacial adhesion. This study confirmed that ESO acts as a compatibilizer between OTPS and PBAT to improve the mechanical properties and hydrophobicity of the sample. The sample containing 0.5wt% of ESO was the most suitable for packaging application.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.45 no.4
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• pp.65-74
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• 2013

In the manufacture of corrugated box, the fibrous raw materials are mainly consisted of recycled papers, such as KOCC(Korean Old Corrugated Container), kraft sack, and AOCC(American Old Corrugated Container). Among these recycled waste paper, the proportion of KOCC is relatively higher than others in fibrous raw materials. Generally, KOCC shows some poor fiber properties and contains hazardous heavy metal sources. Therefore, it is to evaluate the property of recycled paper sources for eco-friendly corrugated box manufacture. In this study, the physical and mechanical properties of 3 kinds of recycled fibers and their mixed stocks were analyzed. The environmental assessment was also evaluated by analyzing the 4 representative heavy metal contents and evaporation residues in waste papers. As the results, KOCC showed the poorest fiber qualities and had the highest heavy metal contents and evaporation residues among the recycled fibers. Finally, the mechanical strength properties were increased by decreasing KOCC proportion of mixed stock conditions. In addition, the heavy metal contents and evaporation residues were also decreased by increasing recycled AOCC and kraft sack proportion.

• East Asian Journal of Business Economics (EAJBE)
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• v.11 no.2
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• pp.29-38
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• 2023

Purpose - The current study aims to learn how fashion consumers now feel about environmental issues. The significance of "green fashion product creation" in resolving environmental issues is explored. It also examines how customers' environmental consciousness has evolved due to the introduction of green fashion products. Research design, data, and methodology - The study methods, procedures, and results of the 16 publications included in this literature review were critically examined. The data sources, analyses, and key findings presented in each publication were compared and contrasted. To better understand how to raise environmental consciousness among customers. Result - The investigation indicates a total of four results why eco-friendly product should be developed to attract potential green consumers. Four solutions are as follows; (1) Encourages Sustainable Consumption Behavior, (2) Increases Consumer Environmental Awareness, (3) Improves Corporate Social Responsibility, and (4) Enhances Competitive Advantage. Conclusion - Promoting sustainability in the fashion sector requires full visibility throughout the supply chain. Companies in the fashion industry would serve their customers better if they were more forthcoming about the resources, methods, and circumstances that went into making their wares. Consumers may accomplish this by including instructions on the packaging or posting them on the business's website.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.13-22
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• 2015

LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

• The monthly packaging world
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• s.245
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• pp.98-112
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• 2013

친환경 디자인이란 환경과 생태적 측면을 고려한 제반 디자인 활동이나 경향을 의미하며, 최근 많은 기업체에서 친환경 제품이나 서비스를 통해 일반 소비자들과 소통하는 중요한 분야로 인식되고 있다. 따라서 본 연구에서는 백화점 쇼핑백 디자인의 재활용 여부와 경험, 횟수, 관심도, 조형성 평가를 통해 주요 3개국(한국, 일본, 미국) 백화점 쇼핑백에 대한 일반소비자들의 친환경적 소구에 대한 인식과 선호도 연구결과를 조사하는데 목적이 있다. 본 연구에서는 분석을 위해 연구범위를 주요 3개국 고급백화점으로 제한하였으며, 분석 대상업체의 개수를 한국 4업체, 일본 4업체, 미국 6업체 등 최종 3개국 14업체를 분석대상으로 선정하고 통계분석(spsswin18.O)하였다. 본 고는 한국브랜드디자인학회 통권 제24호에서 발췌했다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.1
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• pp.9-16
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• 2021

The present study was conducted to accomplish management efficiency by preparing preemptive measures for consumer dissatisfaction and overcome risks caused by Global Warming through studies of model cases in packaging. Through this study, we made it possible to find a way for companies to prepare for Global warming and consumer dissatisfaction. By contributing to eco-friendly packaging, we are trying to preemptively respond to recent major issues through packaging. Through this experiment, we tried to measure the degree of penetration of Plodia interpunctella H. larva into the insect repellent film produced by printing Ink containing a natural repellent. The control experiment was conducted with an untreated LDPE film to which no insect repellent was applied. The numbers decreased from 17 to 7 when the film was processed with repellent to show experimental results verifying effects of repellent by decrease in 10 (58.8% Decrease). Such results show that it is safe when the film is unfolded but in the case where the film is folded, the Plodia interpunctella H. punches through the film to lead to consumer dissatisfaction and it suggests that this can bring on risks to corporate management. Considering that most of the film is folded in the case of PE bag packaging, the direction which the corporations should take in terms of preparing for climate change countermeasures and consumer dissatisfaction has been clarified. Due to it receiving satisfactory results in safety rest results for printing film applied with pest repellent as well as the Quality analysis to test repellent contents of repellent film, it is certain that the importance of repellent method in packaging will increase in preparing for consumer dissatisfaction and actions against climate change henceforth.

• Journal of the Korean GEO-environmental Society
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• v.20 no.5
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• pp.47-55
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• 2019

This study aims to provide basic data for soil packaging differing in accordance with the strength characteristics of mixed soil, using E.S.B. (Eco Soil Binder), an eco-friendly hardening agent, based on the type of soil. The soil used in this study is weathered granite soil readily collected in and around Korea, and is classified into SW, SP and SC according to soil classification systems. The test piece for the unconfined compressive strength test has dimensions of 50 mm in diameter and 100 mm in height, with the mix ratio of E.S.B. proportional to the weight of mixed soil changed from 5% to 10%, 15%, 20%, 25%, and 30%, where compactness of 90% and 100% were applied according to each condition to analyze the unconfined compressive strength characteristics at material ages of 3, 7, and 28 days. Also, the ratio of soil packaging standard strength and unconfined compressive strength was calculated to determine the optimal E.S.B. mix ratio, whereby the field applicability of the unconfined compressive strength using the estimation equation of ACI209R was evaluated.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.193-199
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• 2022

Sustainable energy supplies without the recharging and replacement of charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. The TENG harvests electrical energy from wasted mechanical energy in the ambient environment. TENG devices are very likely to be used in next-generation renewable energy and energy harvesting. TENG devices have the advantage of being able to manufacture very simple power devices. In this experiment, various organic dielectrics and inorganic dielectrics were used to improve the open voltage of TENG, Among the various organic dielectrics, Teflon-based FEP, which has the highest electron affinity, showed the highest open voltage and Al electrode was fabricated on Teflon substrate by sputtering deposition process. And AAO (Anodized Aluminum Oxide) nanostructures were applied to maximize the specific surface area of the TENG device. The power generation of TENG within the acceleration level (0.25, 0.5, 1.0, 1.5 and 2 G) and the frequency range (5-120 Hz) of the domestic transport environment was up to 4 V.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.