• Title/Summary/Keyword: EPMA

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Evolution of Cube Texture in the Nickel-Silver-Stainless steel Multi-layer Sheet

  • Lee, Hee-Gyoun;Jung, Yang-Hong;Hong, Gye-Won
    • Progress in Superconductivity
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    • v.1 no.1
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    • pp.51-55
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    • 1999
  • A Ni/Ag/Stainless steel 310S(SS310S) multi-layer sheet has been fabricated by a combination of vacuum brazing, cold rolling and texture annealing processes. After heat-treating the thin Ni/Ag/SS310S multi-layer sheet at $900^{\circ}C$ for 2h, development of (100)<001>cube texture on Ni surface was revealed by (111) pole figure. Quantitative chemical analysis was made by EPMA for the cross-section of the Ni/Ag/SS310S multi-layer sheet. EPMA results showed that Ag diffusion into the Ni layer, which may suppress the cube texture development, was negligible. A small amount of Cr atoms were detected in the Ni layer. It showed that Ag can be used as a chemical barrier of alloying element atoms in Ni layer for the Ni/Ag/SS310S multi-layer sheet and a strong cube texture was developed for the Ni layer in the Ni/Ag/SS310S multi-layer sheet.

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Interfacial Elemental Change When Soldering the Nico-crally and Fe-Cr-Ni Alloy (국소의치금속상과 Fe-Cr계 wire를 soldering 할때 발생한 계면의 성분변화)

  • Cho, Sung-Am;Ko, Hyun-Kwon
    • The Journal of Korean Academy of Prosthodontics
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    • v.27 no.1
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    • pp.49-54
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    • 1989
  • The purpose of this study was to investigate the interfacial elemental change when solding the Ni-Co-Cr dental removable partial denture alloy and Fe-Cr-Ni wrought wire alloy with Ag-Cu-Zu Silver solder, by EDXA, EPMA, to investigate the appropriateness of clinical usefullness for repair the fractured clasps of removable partial dentive. The result of this study was as follows: 1. The Ni element of major component of Ticonium penetrate into the silver solder 2. The movement Age element of silver solder into Fe-Cr-Ni wire was not significant, by EDXA and EPMA.

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AN EXPERIMENTAL STUDY OF THE EFFECT OF ION EXCHANGE ON STRENGTHENING OF DENTAL PORCELAIN (이온교환법에 의한 치과용도재의 강도증진 효과에 관한 실험적 연구)

  • Lee Young-Kook;Lee Sun-Hyung;Yang Jae-Ho
    • The Journal of Korean Academy of Prosthodontics
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    • v.29 no.3
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    • pp.75-86
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    • 1991
  • Ion exchange strengthening is a chemical process whereby large alkali ions(such as potassium) are substituted for smaller ions(sodium) within the surfaces of glasses and ceramics, thereby reducing the thermal expansion coefficient of this surface region, and creating beneficial state of compressive stress within the near surface region. The purpose of this study was to determine the effects of ion exchange and etching treatments on the strength of some dental porcelains. Two feldspathic dental porcelains(Vitadur-N, G-Cera) were used in this study. A commercial ion exchange paste and etching gel containing 8% hydrofluoric acid were used for surface conditioning. Transverse strength was measured using a universal testing machine and the technique of EPMA(electron probe micro analysis) was used to access the potassium contents. The results were as follows: 1. Improvement in strength was only obtained by treating the surface placed in tension. 2. No changes in the dimensions of the treated specimens were detected when samples were measured with a micrometer. 3. There was significant increase in transverse strength of G-Cera IV group treated with etching and ion exchange, compared with G-Cera II group only treated with ion exchange. 4. From the results of EPMA test, increase in potassium contents was observed on the surface treated with ion exchange paste.

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The Study on the Root Surfaces with SEM and EPMA Following Periodontal Treatment with Curet and Ultrasonic Scaler (Curet과 Ultrasonic Scaler를 이용한 치주치료후 SEM과 EPMA를 이용한 잔존치근면에 대한 연구)

  • Kim, Jae-Hyuk;Kim, Chong-Yeo;Lim, Sung-Bin;Chung, Chin-Hyung
    • Journal of Periodontal and Implant Science
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    • v.29 no.2
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    • pp.387-400
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    • 1999
  • One of the fundamental causes of periodontal disease is accumulation of bacterial plaque and calculus and most effective method of removing these plaque and calculus are scaling and root planning using hand curet and ultrasonic scaler. Many studies concerning residual degenerated mineral content after periodontal therapies have been carried out, but some problems about these studies were also known. This research studies mineral concents and distribution of residual root surfaces after perfoming hand curet and ultrasonic scaler on root surfaces of single rooted teeth which were extracted for periodontal reasons. EPMA were used to avoid errors from chemical quantative analysis and in addition SEM observation was also performed. The results were as follows. 1. No differences were found between curet group andultrasonic scaler group in Ca, P, Mg and Na level. 2. Concentration level was decreased in the sequence of Ca, P, Mg and Na. 3. Ca and P level were decreased as going to apical portion at curet group and ultrasonic scaler group. 4. More cementum was removed at cervical portion compared to other portion at curet group and ultrasonic scaler group. 5. Ca, P, Mg level was higher in dentin compared to cememtum. There was no difference in mineral level for Ca, P, Mg and Na between root surfaces treated with hand curet and ultrasonic scaler.

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Underwater Explosive Welding of Stainless Steel and Magnesium Alloy (수중 충격파를 이용한 스테인레스 스틸과 마그네슘합금의 폭발용접에 관한 연구)

  • Lee, Joon-Oh;Kim, Young-Kook;Cho, Sang-Ho
    • Tunnel and Underground Space
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    • v.22 no.3
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    • pp.221-225
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    • 2012
  • Magnesium is one of the light weight materials, which can improve fuel economy and reduce emissions in automotive industry. Recently, magnesium alloys have gained considerable attention due to good mechanical properties. In this work, we have performed an explosive welding using the magnesium alloys (AZ31) and stainless steel (SUS 304). As a result, SUS304/AZ31 were successfully combined each other; however, a resolidified interlayer was observed at the point of welded layer. To reduce the resolidified interlayer, we have changed the thickness (0.5 mm and 1 mm) of stainless steel, distance (45 mm and 60 mm) between explosive and the center of materials and initial angle ($20^{\circ}$ and $30^{\circ}$) of explosive. In the case of the thickness 0.5 mm and angle of $30^{\circ}$, the resolidfied interlayer was not observed due to the increase of distance from the explosive. To accurately estimate the resolidified interlayer, electron probe micro-analyzer (EPMA) method and hardness were used. For the EPMA analysis, mixed materials were confirmed at the resolidified interlayer, and the measurement exhibited the middle value compared with the AZ31 and SUS304.

A Working Standard Technique far Determination of Interference Correction Factors and Preparation of Standard Materials for CHIME Dating (CHIME 연대 측정의 간섭 보정 계수 결정과 표준 물질의 준비를 위한 실험실 표준법)

  • Cho, Deung-Lyong;Kato, Takenori;Suzuki, Kazuhiro
    • Journal of the Korean earth science society
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    • v.27 no.5
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    • pp.521-527
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    • 2006
  • The EPMA analysis for CHIME dating requires standard materials, which include nuclear fuel materials that are rare and sensitive to handle. Any laboratory that does not meet these standards has had difficulties adopting the CHIME dating method. We have developed a working standard technique for CHIME dating to prepare standard materials without use of nuclear fuel materials. Mineral samples, such as small pieces of monazite that are homogeneous in X-ray intensities, are calibrated using well-characterized primary standards in one laboratory. Once this procedure is done, they can be readily usable as working standards in the other laboratories, only with measurement of X-ray intensities. This method is applicable in preparing standard materials for both chemical compositions and determination of X-ray interference correction factors, and it is independent from chemical composition of mineral standard.

Electron Probe Micro Analysis of Cs in $UO_2$ (우라늄산화물중 Cs의 전자탐침 미세분석)

  • Park, Soon Dal;Joe, Kih Soo;Kim, Won Ho
    • Analytical Science and Technology
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    • v.14 no.3
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    • pp.203-211
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    • 2001
  • In this paper it was described on the intereference effect of uranium to analyze Cs in $UO_2$ by Electron Probe Micro Analysis(EPMA) and the beam stability of Cs $L_{\alpha}$ X-ray intensity for some Cs compounds. According to the experimental results, the CsI showed the highest $L_{\alpha}$ X-ray intensity among the tested Cs compounds at the experimental condition; 15~30 kV of accelerating voltage and PET, LiF crystal. When 100 nA of beam current was applied to Cs compounds, Cs $L_{\alpha}$ X-ray intensity was continuously decreased with increasing time. The decreasing rate of Cs $L_{\alpha}$ X-ray intensity was directly proportional to the applied beam current and accelerating voltage but inversely proportional to the applied beam size. It was found that uranium interference can be prevented by using Cs $L_{\alpha}$ X-ray wavelength of Lif crytal for Cs analysis in $UO_2$ by EPMA.

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Investigation of Ag Migration from Ag Paste Bump in Printed Circuit Board (Ag Paste bump 구조를 갖는 인쇄회로기판의 Ag migration 발생 안전성 평가)

  • Song, Chul-Ho;Kim, Young-Hun;Lee, Sang-Min;Mok, Jee-Soo;Yang, Yong-Suk
    • Korean Journal of Materials Research
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    • v.20 no.1
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    • pp.19-24
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    • 2010
  • The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).