The Characteristics of the Wafer Bonding between InP Wafers and $\textrm{Si}_3\textrm{N}_4$ /InP
(Direct Wafer Bonding법에 의한 InP 기판과 $\textrm{Si}_3\textrm{N}_4$ /InP의 접합특성)
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- Korean Journal of Materials Research
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- v.8 no.10
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- pp.890-897
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- 1998