• Journal of the Korean Society for Precision Engineering
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• v.12 no.8
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• pp.99-105
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• 1995

This paper provides a highly efficient grinding for ferrous materials using ELID-grinding method. The grinding efficiency using ELID gring method with CIFB-cBN wheel and CB-cBN wheel is compared with general grinding method with V-cBN wheel. This paper measured grinding ratio for plunge grinding and grinding resistance for traverse grinding in order to investigate grinding ability. The results show that ELID grinding methods is useful for the high efficient grinding of ferrous materials.

• 연구논문집
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• s.28
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• pp.59-71
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• 1998

The ELID(electrolytic in-process dressing) grinding method is a new precision grinding technique with the special electrolytic in-process dressing by metal bonded grinding wheel, fluid, and power supply. It is possible to make a efficient precision machining of hard and brittle materials such as ceramics, hard metals, and quenched steels by using this method, In this study, a new efficient precision grinding method with ELID was attempted for application to the machining and finishing processes of cylindrical structural components. And, we try to develop the cylindrical grinding technique for mirror surface of ceramics, tungsten carbide and SCM steel, and for the high efficiency grinding of machined parts, for example, ball screw shaft. Electrical characteristics of three different wheel grit sizes of #325, #2000 and #4000 were investigated experimentally. ELID grinding method is proved to be useful for mirror surface generation and efficient machining.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.12
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• pp.2962-2969
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• 1993

Recently, a study on the mirror-like surface grinding of brittle materials is active and as branch of these study, new dressing method for superabrasive wheel, electrolytic inprocess dressing(Elid) was developed. Using Elid, the mirror-like surface of brittle material can be generated without polishing or lapping process. In the future, Elid grinding will take important place in industry. But so far the analysis on Elid grinding was not quantitative but qualitative. In this study, The purpose is the quantitative analysis on Elid grinding by computer simulation, For computer simulation, the mean and the variance of the abrasive distribution were measured by tracing of the grinding wheel with stylus in transverse direction in the case of respective dressing current condition. This measurement result in a density distribution of abrasive by mathematical formulation using statistical method. The prediction of the surface roughness in Elid grinding was based on this density distribution.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.13-18
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• 2012

We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.459-464
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• 2000

In this paper, it verifies the relationships between wheel velocity and surface roughness with the mirror surface grinding using electrolytic in-process dressing (ELID). In the general, as wheel velocity is high, surface roughness is better on the base of grinding theory. However, the relationships between wheel velocity and surface roughness is undefined due to the effect of electro-chemical dressing and the characteristics of materials. According to above relationships, ELID grinding experiment is carried out by following the change of wheel velocity. As the result of this study, it is found that surface roughness is not better as linearly as the increase of wheel velocity, but the limit of wheel velocity exists according to the characteristics of materials. Also, in contradiction to the present trend of high wheel velocity of manufacturing system for high surface integrity, it is able to expected to the base on the development of new ultra precision grinding method with the practicality of mirror surface grinding using ELID grinding method.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.629-632
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• 2005

ELID(ELectrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as a polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study describes an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould, such as WC-Co, which are extensively used in precision tooling material. And for the optics glass-ceramic named Zerodure, which is extensively used in precision optics components too. The experimental results show that the combined method is very effective in reducing the time required for final polishing. The best surface roughness of the polished glass-ceramic was within 1.7nm Ra in this study.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.57-60
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• 1995

Recently, ELID (electrolytic in-process dressing) grinding technique is developed. It is possible to make a efficient precision machining of hard materials such as ceramic hard metals, and quenched steels. This paper deals with some typical applications of ELID-grinding for cylindrcal machining. The significant advantages, performance and characteristics on mirror surface grinding for external surface are described.