• 폴리머
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• 제35권3호
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• pp.196-202
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• 2011

비즈페놀 A 에폭시 수지와 폴리옥시프로필렌 디아민 경화제계의 경화 반응속도를 시차주사열량계을 이용하여 승온 및 등온 경화조건에서 조사하였다. 승온실험에서는 Ozawa와 Kissinger법을 이용하여 다양한 가열속도에서 얻어진 발열피크의 이동으로부터 활성화 에너지를 구하였다. 또한 등온실험에서 얻어진 데이터는 자촉매 효과를 고려한 Kamal의 속도모델로 분석하였으며, 그 결과 경화반응 초기의 속도우세 구간에서 실험데이터와 잘 맞았다. 반응 후기의 확산우세 구간에서는 확산효과를 적용하여 경화의 전체과정을 기술하였다. 또한 동역학분석을 이용하여 경화 후 저장 탄성률과 가교점간의 평균분자량을 측정하였다.

• 소성∙가공
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• 제24권2호
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• 연구논문집
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• 통권29호
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.200-204
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• 2008

비대칭성 고리형 지방족 아민 경화제를 이용한 diglycidyl ether of bisphenol F(DGEBF) 계열의 에폭시의 경화 반응을 등온 및 동적 경화 실험을 통하여 분석하였다. 등온 부분경화 실험 및 동적 경화반응을 통하여 아민 경화제의 비대칭성으로 인해 경화 반응이 저온부 및 고온부분의 두 가지 반응으로 구성되어 있다는 것을 확인하였고, 따라서 경화도가 0.6 이상인 영역에서는 등온경화반응 모델식을 이용하여 실험값을 예측하기는 어렵다는 것을 확인하였다. 승온 속도를 여러 가지로 변화시키며 동적 경화반응을 분석하여 저온부 및 고온부 각각의 반응에 대한 활성화에너지 및 속도상수를 알아보았고, 경화 초기에는 저온부의 반응이 주가 되는 것을 확인하였다.

• Design & Manufacturing
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• 제8권2호
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• Macromolecular Research
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• 제9권3호
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• pp.157-163
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• 2001

The influences of carbon black loading and cure type on the cure characteristics including kinetics and dynamic mechanical properties were investigated for a styrene-butadiene rubber (SBR). The rate constants of accelerated sulfur vulcanization reaction at three different temperatures were determined using a cure rheometer, and they were compared with those from the direct measurement of sulfur concentration. The strain softening behavior under dynamic deformation, known as the Payne effect was also discussed depending on the carbon black loading and cure type.

• 폴리머
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• 제24권1호
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• pp.105-112
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• 2000

본 연구에서는 항공기 구조용 재료로 쓰이는 탄소섬유/에폭시 복합재료 프리프레그(DMS 2224)를 모델시스템으로 하여 등온환경과 등속도 가열환경에서 경화반응 속도를 연구하였다. 이 복합재료의 공정온도에서의 가공공정을 묘사할 수 있는 현상학적인 반응속도 모델을 differential scanning calorimetry (DSC)와 이론을 통하여 제안하였다. 등온환경에서의 실험으로부터 반응특성곡선을 관찰한 결과 경화반응이 1차 반응함수임을 확인하였고, 활성화 에너지는 78.43 kJ/mo1을 얻었다. 이 프리프레그는 경화온도에 따라 한계경화도를 보여주어 유리화가 존재함을 확인하였고 이를 1차 반응속도 모델에 적용시킨 결과, 유리화 이후의 확산우세현상을 포함한 반응속도 모델을 제안하였다. 제안된 모델식을 이용하여 등온/등속도 가열환경을 포함한 실제 경화공정을 성공적으로 표현할 수 있었다.

• Macromolecular Research
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• 제17권2호
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• pp.121-127
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• 2009

The cure kinetics of the epoxy-layered, silicate nanocomposites were studied by differential scanning calorimetry under isothermal and dynamic conditions. The materials used in this study were o-cresol novolac epoxy resin and phenol novolac hardener, with organically modified layered silicates. Various kinetic parameters, including the reaction order, activation energy, and kinetic rate constants, were investigated, and the storage stability of the epoxy-layered silicate nanocomposites was measured. To synthesize the epoxy-layered silicate nanocomposites, the phenolic hardener underwent pre-intercalation by layered silicate. From the cure kinetics analyses, the organically modified layered silicate decreased the activation energy during cure reaction in the epoxy/phenolic hardener system. In addition, the storage stability of the nanocomposite with the pre-intercalated phenolic hardener was significantly increased compared to that of the nanocomposite with direct mixing of epoxy, phenolic hardener, and layered silicate. This was due to the protective effect of the reaction between onium ions and epoxide groups.

• Composites Research
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• 제28권3호
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• pp.99-103
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• 2015

본 논문에서는 복합재료 제조공정 중 온도에 따른 경화 반응을 이해하고 열분석을 수행하였으며, 이 결과를 바탕으로 온도에 따른 수지의 경화도 및 비열의 변화를 수식화하였다. 온도에 따른 경화도와 비열은 DSC와 MDSC (Modulated DSC)를 활용하여 측정하였다. DSC와 MDSC 분석은 Isothermal과 Dynamic 조건으로 수행하여 Cure Kinetics, 유리전이온도 및 비열을 측정하고, 회기 분석 방법을 이용하여 물성거동을 수학적으로 모델링하였다.

• Elastomers and Composites
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• 제53권2호
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• pp.52-56
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• 2018

The present study examines the transformation of dynamic DSC data into the equivalent isothermal data for the formation kinetics of a polyurethane elastomer. The reaction of 2'-dichloro-4,4'-methylenedianiline (MOCA) with a PTMG/TDI-based isocyanate prepolymer was evaluated. DSC measurement was performed in the dynamic scanning mode with several different heating rates to obtain the reaction thermograms. Then, the data was transformed into the isothermal data through a procedure based on Ozawa analysis. The main feature of this procedure was the transformation of $({\alpha}-T)_{\beta}$ curves from dynamic DSC into $({\alpha}-t)_T$ curves using the isoconversional $(t-T)_{\alpha}$ diagram. Validity was discussed for the relationship between the dynamic DSC data and the transformed isothermal results.