• 한국정밀공학회지
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• 제16권10호
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• pp.182-186
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• 1999

Structural ceramics such as $Al_2O_3$, SIC, and $Si_3N_4$ are difficult to grind materials because of their high hardness and brittleness. They are normally ground in brittle mode, but it is possible to be ground in ductile mode depending upon the grinding conditions. In this paper an experimental investigation has been carried out to see the relationship between the grinding energy and grinding mode. It has been found that the ductile mode grinding consumes more grinding energy than the brittle mode grinding. Thus, the grinding conditions of the higher specific grinding energy leads to the plastic deformation in the ground surface of workpiece and results in the better surface finish.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• 한국공작기계학회논문집
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• 제12권5호
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• pp.40-45
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• 2003

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

• 한국정밀공학회지
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• 제24권10호
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• pp.13-18
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• 2007

• 한국생산제조학회지
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• 제21권1호
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• pp.85-89
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• 2012

Conventional grinding of BK7 glass will normally result in brittle fracture at the surface, generating severe sub-surface damage and poor surface finish. The precision grinding of BK7 glass in parallel grinding modes has been investigated. Grinding process, maximum chip thickness, ductile/brittle regime, surface roughness and sub-surface damage have been addressed. Special attention has been given to the condition for generating a ductile mode response on the ground surface. Experiments reveal that the level of surface roughness and depth of sub-surface damage vary differently for different condition. This study gives an indication of the strategy to follow to achieve high quality ground surfaces on brittle materials.

• 한국정밀공학회지
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• 제18권7호
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• pp.106-111
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• 2001

This study reports the grinding characteristics of quartz. Grinding experiments were performed at various grinding conditions including wheel mesh, table speed and depth of cut. The grinding forces and specific grinding energies were measured. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM. A new parameter SDR(Surface roughness Direction Ratio) is proposed to characterize the grinding mechanisms of quartz. A set of experiments was performed to verify the effectiveness of the suggested parameter. The experimental results indicate that the ductile mode is the dominant material removal mode at the grinding conditions which show the higher value of SDR whereas the material is removed by brittle fracture in a lower value of SDR value increases with wheel mesh size.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국기계가공학회지
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• 제11권3호
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• pp.19-23
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• 2012

Glassy carbon is widely used for high temperature melting process such as quartz due to its thermal stability. For utilizing Classy Carbon to glass mold press(GMP) optical lens, brittleness of Glassy Carbon is main obstacle of ultraprecision machining. Thus authors investigated ductile machining of Glassy Carbon adopting turning and grinding process respectively. From the experiments, ultraprecision turning surfaces resulted brittle crack in all machining conditions and ultraprecision grinding surfaces showed semi-ductile mode in small undeformed chip thickness conditions.

• 한국정밀공학회지
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• 제14권3호
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• pp.21-27
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• 1997

This paper aims to clarify the effects of grinding conditions in form grinding of Sr-ferrite with the electro-plated diamond wheel. The main conclusions obtained were as follows. (1) The flexural strength and surface roughness of ferrite became the best at the peripheral wheel speed of 1700 m/min. (2) In the case of the depth of cut larger than 0.4mm, crack layers is induced in the ground surface, and the fracture type of chips exhibits slight ductile mode in the depth of cut smaller than 0.2mm. (3) Whe the depth of cut exceeds 0.6mm, the wheel life becomes extremely severe due to the large chipping and brack- age in the diamond grains. However, at the depth of cut .leq. 0.05mm, the diamond grain shows abrasive wear. (4) The decrease of flexural strength and the increase of surface roughness is in proportion to the increase of the feed rate. (5) Most effective nozzle setting angles with various delivery conditions of the grinding fluid, such as nozzle position .PHI. , flow rate Q, etc., were made clear.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.29-33
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• 1996

This paper aims to clatify the potimum grinding condition for the electroplated diamond wheel in form grinding of Sr-ferrite. The main conclusions obtained were as follows. (1) The flexural strength and surface roughness of ferrite became the highest at the peripheral wheel speed of 1700m/min. (2) In the case of depth of cut larger than 0.4mm, crack layers is induced in the ground surface, the fracture type of chips exhibits slight ductile mode in the depth of cut smaller than 0.2mm. (3) When the depth of cut exceed 0.6mm, the tool life becomes extermely short due to large chipping and brackage. However, at the depth of cut .geq. 0.05mm, the diamond grain shows abrasive wear. (4) The flexural strength and surface roughness increases in proportion to the feed rate.