• Journal of the Korean Wood Science and Technology
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• 제15권1호
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• pp.1-11
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• 1987

소나무 크라프트 펄프제조과정중 회수된 폐액으로 Black liquor-phenol formaldehyde. Methylolated kraft lignin-phenol formaldehyde 및 Lignin cake-phenol rein 세 종류의 접착제가 제조되었다. Black liquor-phenol formaldehyde resin 제조시 Phenol의 약 60%를 크라프트 폐액으로 대치할 수 있다. 본 접착제의 최적압착조건은 $160^{\circ}C$에서 7분간이였다.(상태접착력 : 15.77kg/$cm^2$ 내수접착력 : 8.54kg/$cm^2$). Methylolated kraft lignin-pheno] formaldehyde resin 제조시 Phenol의 약 80~90%를 Methylolated kraft lignin으로 대용할 수 있었다. 본 접착제 제조시 pH를 2.6 용매로서 Methanol, 접착제 1g 당 $0.2m\ell$ Formaldehyde를 첨가하는 것이 접착력이 가장 높았다(상대접착력 : 18.54kg/$cm^2$, 내수 접착력 : 10.08kg/$cm^2$. Lignin cake-phenol ressin에서 Phenol양과 Kraft lignin양이 1 : 1일 경우에 접착력이 높았다. 본 접착제의 최적 압착조건은 $150^{\circ}C$에서 4분간이었다.(상태 접착력 : 18.46kg/$cm^2$, 내수접착력 : 12.3kg/$cm^2$).

• 한국정밀공학회지
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• 제32권10호
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• pp.897-902
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• 2015

This study reports on a uniform resin coating method by using a doctor blade type dispenser. For high productivity, continuous imprint-lithography has been studied, and developed fabrication systems are used in several applications such as anti-reflection films, dry adhesives, and water collecting surfaces. In the continuous fabrication field, researchers have typically focused on patterning and demolding procedures. During the roll-to-roll fabrication process, however, the uniform resin coating process is also important in order to obtain a high quality product, which can be evaluated by uniform thickness, precise geometric expressions, and a thin residual layer. To achieve these, a doctor blade type dispenser was designed and fabricated. As a result, thickness of coated resin was well controlled by modulating the flow rate of the resin and blading gap. In addition, a very thin layer coating process (${\sim}10{\mu}m$) was achieved by softly contacting the blade on the substrate.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• 한국산업보건학회지
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• 제29권3호
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• 한국산림과학회지
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• 제51권1호
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• pp.41-50
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• 1981

본연구(本硏究)의 목적(目的)은 현재(現在) 증량제(增量剤)로 사용(使用)하고 있는 도인소맥분(導人小麥粉)을 국내(国內)에서 값싸게 생산(生産)할 수 있는 다른 증량제(增量剤)로 대체(代替)키 위한 가능성(可能性)을 규명하는데 있다. 증량재료(増量材料)는 옥촉서간(玉蜀黍幹), 송수피(松樹皮), 소맥(小麥), 리기다송엽(松葉), 잣나무엽(葉) 및 목분말(木粉末)을 택(択)해서 $103{\pm}2^{\circ}C$에서 24시간(時間)동안 전건(全乾)시킨 다음 60~100mesh로 분쇄(粉碎)하였다. 증량방법(増量方法)에 있어서 요소수지(尿素樹脂)는 10, 20, 30, 50%로 증량(増量)하였으며 수용성석탄산수지(水溶性石炭酸樹脂)는 5, 10, 15, 20%로 증량(増量)하였다. 본연구(本硏究)에서 얻은 결론(結論)은 다음과 같이 요약(要約)할 수 있다. 1. 요소수지(尿素樹脂)에 있어서 상태접착력(常態接着力)은 소맥분(小麥粉)이 가장 양호(良好)하였다. 2. 요소수지(尿素樹脂)에 있어서 내수접착력(耐水接着力)은 10%와 20%증량(増量)의 경우 소맥분(小麥粉)보다 목분(木粉)이 더 양호(良好)하였으나 이들 사이의 유의적(有意的)인 차이(差異)는 없었다. 3. 석탄산수지(石炭酸樹脂)의 상태접착력(常態接着力)에 있어서 5%증량((増量)의 경우 잣나무엽분(葉粉)이 가장 양호(良好)하였으나 10, 15, 20% 증량((増量)의 경우는 소맥분(小麥粉)이 가장 양호(良好)하였다. 4. 석탄산수지(石炭酸樹脂)의 내수접착력(耐水接着力)에 있어서는 소맥분(小麥粉)이 가장 양호(良好)하였다. 5. 석탄산수지(石炭酸樹脂)의 상태(常態) 및 내수접착력(耐水接着力)에 있어서 15와 20%증량((増量)의 경우 옥촉서간(玉蜀黍幹)이 소맥분(小麥粉) 다음으로 양호(良好)한 결과(結果)를 나타내었다.

• Journal of the Korean Wood Science and Technology
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• 제34권6호
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• pp.29-35
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• 2006

본 연구는 단판 함수율을 0%, 3%, 5%, 8%, 15%, 30%로, 지방산: 글리세롤: MDI의 당량비율을 1:1:2, 1:1:3, 1:1:4, 1:1:5, 1:1:6 으로 달리하여 상태 (비내수)접착력을 조사하였다. 함수율 0%, 3%, 5%, 8%, 15%에서는 지방산 : 글리세롤 : MDI 당량비 1:1:2 일때, KS F 3101(보통합판) 기준 접착력 $7.0kgf/cm^2$를 상회하였으며, 함수율이 커질수록 접착력이 점차 감소하여 각각 $13.7kgf/cm^2$, $1.6kgf/cm^2$, $11.2kgf/cm^2$, $9.8kgf/cm^2$, $7.4kgf/cm^2$ 순으로 나타났다. 함수율 30% 에서는 지방산 : 글리세롤 : MDI 당량비 1:1:6 일 때, 강도 $8.1kgf/cm^2$로 KS 규격 접착력을 만족하였다. KS 규격 접착력을 만족시키기 위해서는 단판의 함수율이 증가할수록 MDI 비율을 높여야 한다.

• 보존과학회지
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• 제31권1호
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• pp.1-11
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• 2015

보물 제1312호 무위사 아미타여래삼존좌상은 기존에 목조불로 알려졌으나 2009년에 실시한 정밀안전진단을 통해 본존불인 아미타여래좌상은 흙으로 조성된 소조불로 밝혀졌다. 그런데 아미타여래좌상의 소조층은 손상이 심각하여 보수가 불가피하였고, 이에 보수재료로서 보다 안전하고 적합한 충전제에 대한 연구를 진행하였다. 본 연구는 무위사 아미타여래좌상의 소조층 보수에 가장 적합한 충전제를 제작하기 위한 실험으로 다양한 비율로 배합한 조합토 샘플을 제작한 후 건조 시 표면의 경화상태, 균열 및 색상변화, 수축률 결과를 측정하였다. 충전제 제작에 사용된 조합토 재료는 황토와 세사, 면 솜을 적용하였으며 6가지의 배합비율로 조합토 시료를 만들고 여기에 찹쌀풀, 도박풀, 아교로 만든 12가지 농도의 접착제를 혼합하여 총72가지 조건의 시료를 제작하여 비교분석 하였다. 실험결과 조합토는 황토와 세사의 질량비에 대하여 2.5%의 면 솜을 함유하고, 황토와 세사의 비율이 15:1일 때 수축률이 가장 낮은 것으로 판명되었으며, 천연접착제 중 색상의 변화가 적고, 물성변화량과 수축률이 가장 낮은 아교가 사용 가능한 접착제로 판단되었다. 즉, 조합토(황토:세사=15:1)와 아교15ml 첨가 시 가장 낮은 수축률을 나타내어 무위사 아미타여래좌상 보존처리 시소조층의 충전제로 가장 적합한 것으로 판명되었다.

• 한국산림과학회지
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• 제60권1호
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• pp.51-57
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• 1983

고온경화형(高温硬化型) 수용성(水溶性) 요소(尿素) 페놀공축합수지(共縮合樹脂)의 제조(製造)몰비(比)를 각각 달리 제조(製造)하고 페놀수지(樹脂)의 경우 촉매(觸媒)를 달리 제조(製造)하여 이들 접착제(接着劑)의 성질(性質)과 그 접착강도(接着強度)를 Kapur 합판제조(合板製造)를 통(通)하여 구명(究明)한 결과(結果) 다음과 같은 결론(結論)를 얻었다. 1) 각(各) 접착제(接着劑)로써 열압(熱壓)하여 제조(製造)된 합판(合板)의 비중(比重)은 단판(單板)의 비중(比重)에 따른 영향(影響)을 받아 0.67부터 0.82까지를 보였으며 합판(合板)의 기건함수율(氣乾含水率)은 모두 KS규격(規格)을 만족시켰다. 2) 상태접착력(常態接着力) 및 준내수접착력(準耐水接着力)의 경우, 페놀수지(樹脂)를 제외하고 60%고형분수지(固形分樹脂)가 50%고형분수지(固形分樹脂)보다 높은 값을 보였고 요소(尿素)와 페놀의 공축합비(共縮合比)에 따른 결과(結果)는 20%페놀함량(含量)의 요소(尿素) 폐놀공축합수비(共縮合樹脂)가 제일 높았고 70% 페놀함량(含量)의 수지(樹脂)가 제일 낮았다. 목분증량(木粉增量)은 50%페놀함량(含量) 이상(以上)의 공축합수비(共縮合樹脂)에서 접착력(接着力) 상승에 유효(有效)하였고 특히 50%고형분(固形分)의 경우, 알카리촉매 페놀수지(樹脂)를 포함하여 현저하였다. 페놀수지제법(樹脂製法) 중 양자겸용법이 최고(最高)의 접착력(接着力)을 과시하였고 알카리촉매법이 제일 낮았다. 준내수접착력(準耐水接着力)의 경우 요소수지(요소수지)는 제일 하위집단(下位集團)에 속하였다. 3) 내수접착력(耐水接着力)의 경우, 페놀수지제법(樹脂製法) 중 알카리 산(酸) 양자겸용법(兩者謙用法)을 택하는 것이 가장 좋고 알카리촉매법(觸媒法)은 반드시 목분증량(木粉增量)을 하는 것이 필요(必要)하다. 10%페놀함량(含量) 요소(尿素) 폐놀 공축합수비(共縮合樹脂)도 유효(有效)한 내수접착력(耐水接着力)을 과시하였다.