• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of ILASS-Korea
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• v.4 no.4
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• pp.30-37
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• 1999

The breakup characteristics of liquid sheet formed by the liquid rocket injector has a close relation with the combustion efficiency. In this paper, basic characteristics of droplet size and velocity distribution were measured with PDPA for the Like Doublet Impinging Injector. Test variables were the angle of impact, the diameter of orifice and jet velocity. Water was used as test fluid. As a result, for impingement angle less than 90 degree, following correlations were obtained between drop size and design parameters : $D_{32}({\mu}m)=295.0{\times}V^{-0.09}\times(2\theta)^{-0.1}{\times}d^{0.072}$. For impingement angle greater than 100 degree, drop sizes were increased but eventually converged to a certain limiting value.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of Korea Foundry Society
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• v.34 no.1
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• pp.22-26
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• 2014

Internal defects, such as shrinkage during casting, cause stress concentrations and initiate cracking. Therefore, it is important to understand the effects of internal defects on the mechanical properties including the impact behavior. This study evaluates the effects of internal casting defects on the impact performance of A356 Al-alloy castings. The internal shrinkage defects in the casting impact specimen are scanned using an industrial Computed Tomography (CT) scanner, and drop impact tests are performed with varing impact velocities on the A356 casting aluminium specimen ($10mm{\times}10mm$ section area) in order to locate the fracture energy under an impact load. The specimens with defects with a diameter less than 0.35 mm exhibit equivalent fracture impact energies of approximately 32 J and those with a 1.7 mm diameter defect reduced the fracture impact energy by 35%.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.125-128
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• 2003

Low-velocity impact damage is a major concern in the design of structures made of composite materials, because impact damage is hidden inside and cannot be detected by visual inspection. The piezoelectric thin film sensor can be used to detect variations in structural and material properties for structural health monitoring. In this paper, the PVDF and PZT sensors were used for monitoring impact damage initiation in Gr/Ep composite panel to illustrate this potential benefit. A series of impact test at various impact energy by changing impact mass and height is performed on the instrumented drop weight impact tester. The wavelet transform(WT) is used to decompose the piezoelectric sensor signals in this study. Test results show that the particular waveform of sensor signals implying the damage initiation and development are detected above the damage initiation impact energy. And it is found that both PZT and PVDF sensors can be used to detect the impact damage.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.174-178
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• 2001

The piezoelectric thin film sensor can be used to interpret variations in structural and material properties, e.g. for structural integrity monitoring and assessment. To illustrate one of this potential benefit, PVDF film sensors are used for monitoring impact damage initiation in Gr/Ep composite panel. Both PVDF film sensors and strain gages are surface mounted to the Gr/Ep specimens. A series of impact test at various impact energy by changing impact mass and height is performed on the instrumented drop weight impact tester. The sensor responses are carefully examined to predict the onset of impact damage such as matrix cracking, delamination, and fiber breakage, etc. Test results show that the particular waveforms of sensor signals implying the damage initiation and development are detected above the damage initiation impact energy. As expected, the PVDF film sensor is found to be more sensitive to impact damage initiation event than the strain gage.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.3
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• pp.210-220
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• 2001

This paper aims at the evaluation on the characterization of CFRP laminate plates using falling weight impact tester. The experimentation was conducted on several laminates of different fiber and ply orientation. A system was built for the impact strength of CFRP laminates in consideration of stress wave propagation with using drop-weight impact tester as one of impact test. Absorbed energy of orthotropic composites with using T300 fiber, which are composed of the same fiber and stacking number is higher than that or quasi-isotropic specimen over impact energy 7J, but in case or using T700 fiber, much difference does not show. Also, absorbed energy of orthotropic composites with using T300 fiber, which are composed or stacking number and orientation became more than that of T700 fiber specimen; however great change doesn't show in case of quasi-isotropic specimens. It is found that influence was confirmed between impact energy and absorbed energy as the impact energy is increased with adding the falling weight.

• Nuclear Engineering and Technology
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• v.26 no.2
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• pp.197-204
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• 1994

In a PWR rod cluster control assembly(RCCA) for shutdown is released upon action of control rod drive mechanism and falls down through the guide thimble by its weight. Drop time and impact velocity of the RCCA are two key parameters with respect to reactivity insertion time and the mechanical integrity of fuel assembly. Therefore, the precise control of drop time and impact velocity is prerequisite to modifying the existing design features of the RCCA and guide thimble or newly designing them. During its falling down into the core, the RCCA is retarded by various forces acting on it such as fluid resistance caused by the RCCA movement, buoyance and mechanical friction caused by contacting inner surface of the guide thimble, etc. However, complicated coupling of the various forces makes it difficult to derive an analytical dynamic equation for the drop time and impact velocity. This paper deals with the development of a computer program containing an analytical dynamic equation applicable to the Korean Fuel Assembly(KOFA). The computer program is benchmarked with an available single control rod drop tests. Since the predicted values are in good agreement with the test results, the computer program developed in this paper can be employed to modify the exiting design features of the RCCA and guide thimble and to develope their new design features for advanced nuclear reactors.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.78-85
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• 2002

This paper deals with the finite element model of the monitor for the simulation of directional free drop tests such as backward, sideward, edge and vertex drop. The model was made for an unconditional stable solution for the explicit integration algorithm. The general behaviors at the time of impact were found to well correlate with the actual situation in terms of acceleration, displacement, contact force and stress of monitor components even though the experiment of the associated drop is performed for the validity of the model.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.10
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• pp.945-954
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• 2004

Recently, specifications of flat display module is going to be higher definition, brightness and more wide viewing angle. On the other hand, physical thickness of those modules is forced to be slimmer and lighter. The flat display modules such as plasma or TFT-LCD employ thin crystallized panels that are normally weak to high level transient mechanical energy inputs. As a result, anti-shock performance is one of the most important design specifications of TFT-LCD modules. TFT-LCD module manufacturers and their customers like PC or TV makers perform a series of strict impact/drop test for the modules. However most of the large display module designs are generated based on engineer's own trial-error experiences. Those designs may result in disqualification from the drop/impact test during final product evaluation. A rigorous study on the impact failure of the displays is of course necessitated in order to avoid the problems. In this article, a systematic design evaluation is presented with combinations of FEM modeling and testing to support the optimal shock proof display design procedure.