• 제목/요약/키워드: Driver IC

검색결과 203건 처리시간 0.031초

A Novel Driving Method for Cost Competitive a-Si TFT-LCD

  • Moon, Su-Hwan;Lim, Hong-Youl;Kim, Dae-Kyu;Lee, Min-Kyung;Ko, Kyung-Tai;Lee, Jun-Ho;Yoon, Sung-Hoe;Kim, Byeong-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.470-473
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    • 2009
  • We have developed a novel driving method, Six times Rate Driving(SRD) for the purpose of making cost competitive TFT-LCD. By applying SRD method to an a-Si TFT-LCD, the driving rate was increased six times as it was named but the number of data lines and so its D-Ics were reduced to one sixth of the conventional one which resulted in the cost saving of that much. We also newly designed the gate driver in order to avoid any expansion of the bezel width caused by applying SRD. Our newly developed driving technology, SRD was successfully applied to 7.0-inch WSVGA (1024 ${\times}$ 600) TFT-LCD which can be driven with only one data D-IC and here introduced.

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Display Driver IC용 Amplifier Input Transistor의 Matching 개선 (The Improvement of Matching of Amplifier Input Transistor for Display Driver IC)

  • 김현철;노용한
    • 한국전기전자재료학회논문지
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    • 제21권3호
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    • pp.213-216
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    • 2008
  • The voltages for pixel electrodes on LCD panels are supplied with analog voltages from LCD Driver ICs (LDIs). The latest LDI developed for large LCD TV's has suffered from the degradation of analog output characteristics (target voltage: AVO and output voltage deviation: dVO). By the failure analysis, humps in $I_D-V_G$ curves have been observed in high voltage (HV) NMOS devices for input transistors in amplifiers. The hump is investigated to be the main cause of the deviation for the driving current in HV NMOS transistors. It also makes the matching between two input transistors worse and consequently aggravates the analog output characteristics. By simply modifying the active layout of HV NMOS transistors, this hump was removed and the analog characteristics (AVO &dVO) were improved significantly. In the help of the improved analog characteristics, it also became possible to reduce the size of the input transistors less than a half of conventional transistors and significantly improve the integration density of LDIs.

LLC 공진형 컨버터를 이용한 독립제어 가능한 2 채널 LED 구동회로 (Independently-Controlled Dual-Channel LED Driver using LLC Resonant Converter)

  • 황민하;최윤;오동성;홍성수;한상규
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2011년도 전력전자학술대회
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    • pp.224-225
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    • 2011
  • 본 논문은 하나의 제어 IC로 이중출력 각각 독립 제어가 가능한 LLC 공진형 컨버터를 제안한다. 기존의 이중출력 LLC 공진형 컨버터의 경우 master 출력전압만 제어가 가능하므로, slave 출력의 정밀제어를 위해 별도의 DC/DC 컨버터가 필요하며, 이는 시스템의 전력 변환 효율을 떨어뜨리고 제작단가를 증가시키는 단점이 있다. 반면, 제안된 회로는 LLC 공진형 컨버터의 이중출력을 하나의 제어 IC로 주파수 및 시비율 각각 가변하는 방식으로 개별적 제어가 가능하므로 부하 및 입력전압 조건과 무관하게 모든 출력 전압의 제어를 정밀하게 할 수 있는 장점이 있다. 따라서 별도의 DC/DC 컨버터 사용이 불필요하므로 고효율 및 저가격의 특징을 가질 수 있다. 본 논문에서는 제안된 회로의 타당성 검증을 위해 이론적 분석결과를 제시하고 40W급 LED 조명회로에 적용한 실험 결과를 바탕으로 그 우수성을 확인한다.

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저전력 모터 구동을 위한 SOI 드라이브 IC 와 RC-IGBT를 탑재한 지능형 반도체 모듈 (The Intelligent Power Modules Assembly with Reverse Conduction IGBTs and SOI Driver for Low Power Motor Drives)

  • 조정수;박성범;이준배;정대웅
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2011년도 전력전자학술대회
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    • pp.287-289
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    • 2011
  • 본 논문은 인피니언 테크놀로지스의 RC-IGBT (Reverse Conducting Isolated Gate Bipolar Transistor)와 SOI 드라이브 IC(Integrated Circuit)를 사용한 DIL(Dual-In-Line) 구조의 저전력 모듈인 CIPOS TM (Control Integrated POwer System) 제품을 소개한다. 이 전력 모듈은 최적의 게이트 구동회로, 트렌치 필드스톱의 RC-IGBT를 사용하여 기존의 IGBT 와 Diode를 사용하는 구조에서 최소화 된 패키지 크기를 사용하여 높은 효율을 구현할 수 있다. 본 논문을 통하여 인버터의 어플리케이션에 적합하게 설계된 전력모듈에 대한 소개와 그 특징 및 시스템 구성을 위한 고려사항에 대하여 기술하였다.

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고효율, 저전력 Switched-Capacitor DC-DC 변환기의 설계 및 구현 (Design and Implementation of High-Efficiency, Low-Power Switched-Capacitor DC-DC Converter)

  • 김남균;김상철;방욱;송근호;김은동
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.523-526
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    • 2001
  • In this paper, we design and fabricate the high-efficiency and low-power switched-capacitor DC-DC converter. This converter consists of internal oscillator, output driver and output switches. The internal oscillator has 100kHz oscillation frequency and the output switches composed of one pMOS transistor and three nMOS transistors. According to the configuration of two external capacitors, the converter has three functions that are the Inverter, Doubler and Divider. The proposed converter is fabricated through the 0.8$\mu\textrm{m}$ 2-poly, 2-metal CMOS process. The simulation and experimental result for fabricated IC show that the proposed converter has the voltage conversion efficiency of 98% and power efficiency more than 95%.

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월쉬변환을 이용한 IC엔진의 다중실화검출 (The detection of IC engine's Mutiple misfire using Walsh transform)

  • 김종부;이태표어정수임국현
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1998년도 하계종합학술대회논문집
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    • pp.235-238
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    • 1998
  • This paper presents the detection of internal combustion engine's multiple misfire. The primary cause of air pollution by vehicles is imperfect conbustion of fuel. The CARB(California Air Resources Board) have imposed regulations for the detection of misfiring in automotive engines. The OBD-II regulations requir that misfire should be monitored by the diagnostic system, and that the goal of OBD-II is to alert the driver to the presence of a malfunction of the emission control system. Present invention based upon measurements of engine roughness as derived from crankshaft angular velocity measurements with special signal processing method. Crankshaft angular velocity signals are processed by walsh-fourier transform. Experimental work confims that it's possible to apply walsh-fourier transform for the detection of multiple misfires in no-load idle and road testing.

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미세 피치를 갖는 bare-chip 공정 및 시스템 개발

  • 강희석;정훈;조영준;김완수;강신일;심형섭
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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    • pp.79-83
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    • 2005
  • IT 기술, 반도체 산업 등의 급격한 발전에 힘입어 최근의 첨단 전자, 통신제품은 초경량 초소형화와 동시에 고기능 복합화의 발전 추세를 보이고 있다. 이런 추세에 발맞추어 전자제품, 통신제품의 핵심적인 부품인 IC chip도 소형화되고 있다. IC chip 패키징 기술의 하나인 Filp Chip Package는 Module Substrate 위에 Chip Surface를 Bumping 시킴으로서 최단의 접속길이와 저열저항, 저유전율의 특성도 가지면서 초소형에 높은 수율의 저 원가생산성을 갖는 첨단의 패키징 기술이다. 이런 패키징 기술은 수요증가와 더불어 폭발적으로 늘어나고 있으나 까다로운 공정기술에 의해 아직 여러 회사에서 장비가 출시되고 있지 못한 상태이다. 이에 본 연구에서는 최근 수요가 증가하는 LCD Driver IC용 COF 장비를 위한 Flip chip Bonding 장비 및 시스템을 설계, 제작하였다.

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다이오드 레이저를 이용한 Chip On Glass 접합에 관한 연구 (Study of Chip On Glass Bonding Method using Diode Laser)

  • 서명희;류광현;남기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.423-426
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    • 2005
  • A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

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IC 센서를 이용한 고속철도차량 구동장치의 무선 온도 모니터링 시스템 (Wireless Temperature Monitoring of Driving Gear Unit in High Speed Train Using IC Sensor)

  • 권석진;서정원;이동형;황지성
    • 한국정밀공학회지
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    • 제30권7호
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    • pp.673-678
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    • 2013
  • Driving gear units can be affected by various problems, including those associated with external or internal defects in the bearing, problems with the lubricant oil, high-loading of the railway, and frequent impacts generated by rail joints. Temperature monitoring is a basic method in diagnosing abnormal conditions in the reduction gear and other components. This paper describes a new wireless monitoring system for the temperature diagnosis of abnormal conditions of the reduction gear. Integrated circuit (IC)-type temperature sensors were installed in the reduction gear box of a high-speed railway car. The temperature data from the reduction gear were acquired and analyzed in situ during high-speed rail operation. Analysis of these data was used to alert the driver and/or maintenance personnel when problems occurred.

LCD Module내 COF Bending에 따른 Lead Broken Failure의 개선 (Improvement of COF Bending-induced Lead Broken Failure in LCD Module)

  • 심범주;최열;이준신
    • 한국전기전자재료학회논문지
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    • 제21권3호
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    • pp.265-271
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    • 2008
  • TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.