• 제목/요약/키워드: Donor-doped

검색결과 106건 처리시간 0.03초

전자 주게가 첨가된 완화형 강유전체 $Pb({Mg_{1/3}}{Nb_{2/3})}O_2$의 B자리 양이온 질서배열구조 (B-site Cationic Ordering Structures of Donor-Doped Relaxor Ferroelectric $Pb({Mg_{1/3}}{Nb_{2/3})}O_3$)

  • 차석배;김병국;제해준
    • 한국재료학회지
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    • 제10권7호
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    • pp.478-481
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    • 2000
  • $Pb(Mg_{1/3}Nb_{2/3})O_3$$Pb_{2+}$ 자리에 치환되어 전자주게 역할을 하는 $La^3,\; Pr^{3+,4+},\; Nd^{3+},\; Sm^{3+}$ 등이 10mol% 첨가된 단일상의 $Pb(Mg_{1/3}Nb_{2/3})O_3$ 소결체를 합성하여 이들의 B자리 양이온 질서배열구조를 XRD와 TEM을 이용하여 분석하였다. 전자 주게가 첨가되지 않았을 때에는 XRD패턴에서 공간군 Pm3m에 해당하는 기본 회절선(fundamental reflection) 만 검출되었으나 전자 주게가 첨가된 경우에는 $Mg_{2+}$$Nb_{5+}$의 1:1 질서배열로 인하여 단위포의 체적이 8배가 되어(h/2 k/2 l/2)(h,k,l 모두 홀수) 조격자 회절선(superlattice reflection)이 검출되었다. TEM 제한시야회절패턴(selected area diffraction pattern)에서는 전자 주게의 첨가 여부에 관계없이 초격자 회절점이 검출되었으나 전자 주게가 첨가된 경우에 기본 회절점에 대한 초격자 반사점의 상대적인 강도가 현저히 증가하였다. TEM 암시양상(dark field image)에서는 전자 주게가 첨가되었을 때에만 반상경계(antiphase boundary)가 관찰되었다. 이로부터 전자 주게인 $La^3,\; Pr^{3+,4+},\; Nd^{3+},\; Sm^{3+}$등이 $Pb_{2+}$를 치환함에 따라 $Pb(Mg_{1/3}Nb_{2/3})O_3$의 B자리 양이온 1:1 질서배열이 강화됨을 실험적으로 증명하였다. 얻어진 결과는 전하보상기구에 근거하여 해석하였다.

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Ti와 W이 첨가된 SBT 세라믹스의 강유전 특성 (Ferroelectric Properties of Ti-Doped and W-Doped SBT Ceramics)

  • 천채일;김정석
    • 한국세라믹학회지
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    • 제41권5호
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    • pp.401-405
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    • 2004
  • 순수한 SrB $i_2$T $a_2$$O_{9}$ 세라믹스와 도너와 억셉터가 치환된 S $r_{0.99}$B $i_2$(T $a_{0.99}$ $W_{0.01}$)$_2$$O_{9}$ 와 SrB $i_2$(T $a_{0.99}$ $Ti_{0.01}$)$_2$ $O_{8.99}$ 세라믹스를 제조하고 미세구조, 강유전 P-E 이력특성, 상전이 온도를 조사하였다. 입자크기는 SrB $i_2$T $a_2$$O_{9}$ 세라믹스의 강유전 이력곡선에는 영향을 주지 않았다. 도너를 치환한 S $r_{0.99}$B $i_2$(T $a_{0.99}$ $W_{0.01}$)$_2$$O_{9}$ 세라믹스는 순수한 SrB $i_2$T $a_2$$O_{9}$ 세라믹스보다 잔류 분극이 크고 더욱 포화된 강유전 P-E 이력곡선을 보였으며, 억셉터가 치환된 SrB $i_2$(T $a_{0.99}$ $Ti_{0.01}$)$_2$ $O_{8.99}$ 세라믹스는 잔류분극이 크게 감소하여 가운데가 잘록한 모양을 보였다. 도너가 치환된 S $r_{0.99}$B $i_2$(T $a_{0.99}$ $W_{0.01}$)$_2$$O_{9}$ 세라믹스의 강유전 분극이 순수한 SrB $i_2$T $a_2$$O_{9}$ 세라믹스보다 더 큰 것은 Sr 공공의 생성에 의하여 분역벽 이동이 용이해졌기 때문이다.동이 용이해졌기 때문이다.동이 용이해졌기 때문이다.동이 용이해졌기 때문이다.

Electrical Properties of PCCYA-doped ZnO-based Varistors

  • Nahm, Choon-Woo
    • Transactions on Electrical and Electronic Materials
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    • 제9권3호
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    • pp.96-100
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    • 2008
  • The microstructure, voltage-current, and capacitance-voltage relations ofP CCYA doped ZnO-based varistors were investigated for different amounts of $Al_2O_3$. As the $Al_2O_3$ amount increased, the average grain size (d) increased from d=4.3 to $d=5.5{\mu}m$ and the sintered density $({\rho})$ increased from ${\rho}=5.63$ to ${\rho}=5.67g/cm^3$. As the $Al_2O_3$ amount increased, the breakdown voltage $(V_B)$ increased from $V_B=633$ to $V_B=71$ V/mm and the non-ohmic coefficient $({\alpha})$ increased from ${\alpha}=47$ to ${\alpha}=4$. $Al_2O_3$ served as a donor due to the donor density $(N_d)$, which increases in the range of $N_d=0.77-1.85{\times}10^{18}/cm^3$ with increasing amount of $Al_2O_3$.

Irradiation Induced Defects in a Si-doped GaN Single Crystal by Neutron Irradiation

  • Park, Il-Woo
    • 한국자기공명학회논문지
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    • 제12권2호
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    • pp.74-80
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    • 2008
  • The local structure of defects in undoped, Si-doped, and neutron irradiated free standing GaN bulk crystals, grown by hydride vapor phase epitaxy, has been investigated by employing electron magnetic resonance(EMR), Raman scattering and cathodoluminescence. The GaN samples were irradiated to a dose of $2{\times}10^{17}$ neutrons in an atomic reactor at Korea Atomic Energy Research Institute. There was no appreciable change in the Raman spectra for undoped GaN samples before and after neutron irradiation. However, a forbidden transition, $A_1$(TO) mode, appeared for a neutron irradiated Si-doped GaN crystal. Cathodoluminescence spectrum for the neutron irradiated Si-doped GaN crystal became much broader or was much more broadened than that for the unirradiated one. The observed EMR center with the g value of 1.952 in a neutron irradiated Si-doped GaN may be assigned to a Si-related complex donor.

Defect Chemistry of BaTiO_3$ Codoped with Mn and Nb

  • Han, Young-Ho;Shin, Dong-Jin
    • The Korean Journal of Ceramics
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    • 제4권2호
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    • pp.68-71
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    • 1998
  • The effect of Mn and Nb additions on the electrical properties of BaTiO$_3$ has been studied by means of equilibrium electrical conductivity as a function of temperature, oxygen partial pressure(Po$_2$) and composition. If the manganese ion is added to the normal Ti site, i.e. BaTi$_{1-x}Mn_xO_{\delta-6}$, the equilibrium conductivity shows strong evidence of acceptor-doped behavior. The conductivity minimum, corresponding to the transition from oxygen excess, p-type behavior to oxygen deficient, n-type behavior with decreasing Po$_2$, is displaced to lower Po$_2$ and is broadened and flattened. The partial replacement of Mn ion with Nb decreases the acceptor-doped effect and the total replacement exhibits a typical donor-doped behavior. It was confirmed that unlike undoped or other acceptor-doped behavior. It was confirmed that unlike undoped or other acceptor-doped samples, for the p-type region, the electrical conductivity follows the 1/6th power dependence of oxygen partial pressure.

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Doping된 Si 반도체 세계에서 pH 효과 (pH Effects at Doped Si Semiconductor Interfaces)

  • 천장호;라극환
    • 대한전자공학회논문지
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    • 제27권12호
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    • pp.1859-1864
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    • 1990
  • The effect of H+ and OH- ion concentrations at doped Si semiconductor/pH buffer solution interfaces were investigated in terms of cyclic current-voltage characteristics. The effects of space charge on oppositely doped Si semiconductors, i.e., p-and n-Si semiconductors, can be effectively applied to study the pH effects and the slow surface states at the interfaces. The adsorptions of H+ and OH- inons on the doped Si semiconductor surfaces are physical adsorption rather than chemical adsorption. Adsorptive processes and charging effects of the slow surface states can be explained as the potential barrier variations and the related current-voltage characteristics at the interfaces. Under forward bias, the charged slow surface states on the p-and n-si semiconductor surface are donor and acceptor slow surface states, respectively. The effects of minority carriers on the slow surface states can be neglected at the doped Si semiconductor interfaces.

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