• 제목/요약/키워드: Dissolution property

검색결과 76건 처리시간 0.03초

Influence of "Historical Effects" on the Rheological Properties of a Polyacrylonitrile Copolymer Solution

  • Cheng, Yumin;Zhang, Huibo;Zhang, Shuangkun;Liu, Weiwei;Wang, Jing;Cheng, Run;Ryu, SeungKon;Jin, Riguang
    • Carbon letters
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    • 제14권1호
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    • pp.45-50
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    • 2013
  • Polyacrylonitrile (PAN) copolymers of different molecular weights were synthesized by a suspension polymerization and precipitation polymerization method. The rheology behaviors of the synthesized PAN copolymers were investigated in relation to their molecular weight, solid content and melting temperature. The influence of "historical effects" on the spinning solution of PAN was studied by analyzing the laws of viscosity considering the diversification time and temperature. The viscosity disciplines of each spinning solution conformed well to the rheological universal laws in a comparison of the suspension polymerization product with that of precipitation polymerization. Viscosity changes in the swelling process of dissolution were gentler in the suspension polymerization product; a small amount of water will quickly debase the solution viscosity, and high-speed mixing can greatly shorten the time required by the spinning solution to reach the final viscosity.

키틴을 이용한 폴리(L-젖산)(Poly(L-lactic acid)(PLLA)) 전기방사 나노섬유의 기계적 보강 (Mechanical Reinforcement of Electrospun Poly(L-lactic acid)(PLLA) Nanofibers with Chitin)

  • 문현우;최승환;황동수
    • 한국해양바이오학회지
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    • 제11권2호
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    • pp.36-41
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    • 2019
  • This study was conducted to analyze the difference in mechanically improved properties by distinguishing α-chitin and β-chitin for Poly(L-lactic acid)(PLLA). First, dissolution of chitins was established by mixing polar solvents hexafluoroisopropanol (HFIP) and trifluoroacetic acid (TFA) in appropriate proportions. Under these conditions, the dissolved chitin was used for electrospinning with other polymers. The electrospun nanofibers of the PLLA and chitins were successfully produced. Compared to the pristine state, when chitin was added to PLLA, the tensile strength increased 1.41 times (α-chitin), by 1.61 times (β- chitin), respectively. Based on this, it was confirmed that α- and β- chitin could be strategically used for different polymers. The results also suggest that chitin can be applied to various fields as good reinforcing material as well as electrospinning.

폐견사류의 미세분말화 및 표면 가공제 적용 (Preparation of Fine Silk Powder and It′s Application for Surface Modification)

  • 이용우;이광길;여주홍;김종호
    • 한국잠사곤충학회지
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    • 제43권1호
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    • pp.41-48
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    • 2001
  • The purification, dissolution and powdering of stained waste silk obtained from weaving and dyeing process were studied for the surface modification of textile fabric and plastic materials. The whiteness of stained waste silk could be improved through degumming and bleaching with sodium hydrosulfite. The water-soluble fibroin solution can be obtained by dissoving the degummed waste silk in a boiling solution of 50% calcium chloride for 60 minutes. The salts and heavy metals contained in fibroin solution were removed by electric dialysis, wool fiber filtration and gel filtration chromatography. The fibroin powder was prepared by using a fine grinder after the alkali treatment for weakening the silk fiber. The fine fibroin powder of particle size around 30 ㎛ was obtained with a ultra fine-mill, while it was finer below 10 ㎛ with a ball-mill. The dissolved or powdered silk was applied to the surface of fabric with addition of the binder (a urethane resin). The moisture content of polyester and nylon fabrics treated with the silk solution was improved due to hygroscopic property of silk. The fine fibroin powder mixed with the binder ws coated on the surface of synthetic film by use of the air pressed sprayer. It was revealed that the hygroscopicity as well as the softness of fibroin powder coated film was much improved. Therefore, it is thought that the fine silk fibroin powder is applicable as an coating agent for the surface modification of plastic and synthetic leather.

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Bacillus thuringiensis subsp. sotto의 내독소 결정체 용해 과정 및 활성기작과 항원 발현 양상 (In Vitro Dissolution and Proteolytic Activation of $\delta$-endotoxin and Antigenic Expression Pattern of Bacillus thuringiensis subsp, sotto)

  • 남기범;조재민;홍순복;이형환;조명환
    • 한국미생물·생명공학회지
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    • 제23권6호
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    • pp.730-736
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    • 1995
  • The solubilization and proteolytic process of $\delta $-endotoxin was analvsed to compare the biochemical property of the toxin isolated from B. thuringiensis subsp. sotto. The purified crystals were dissolved in 50 mM carbonate buffer containing 10 mM dithiothreitol at pH 10 for various times. The electrophoretic pattern showed that a rapid disappearance of 138 kDa protein band. This disappearance of protein with high molecular weight was accompanied by the appearance of new protein fragment with 104 kDa, 60 kDa, and 25 kDa. For proteolvtic processing, the soluble crystals were digested with trypsin for various times. The soluble crystal protein of 104 kDa was completely disappeared. However, the protein fragment of 60 kDa and 25 kDa still remained after complete proteolysis. The comparative immunoblot analysis showed that the antiserum against intact crystals showed strong immunoreactivity to the homologous inclusion protein of 138 kDa, 104 kDa, and 25 kDa, and to the intact spores of 221 kDa and 138 kDa, but not to the vegetative cell homogenate. The sera against crystals and spores had no immunoreactivity to the vegetative cell homogenate.

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일제의 필지 분할에 의한 동래부 객사 공간의 해체 과정 (The Process of Dissolution on the Lots-Subdivision at Gaeksa of Dongnae-bu by Japanese Imperialism)

  • 송혜영;서치상
    • 건축역사연구
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    • 제22권3호
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    • pp.27-36
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    • 2013
  • The purpose of this study is to analyze the process of lots-subdivision within the block of Gaeksa at Dongnae-bu under the rule of Japanese Imperialism. Gaeksa of the old government office was the sanctuary that symbolized the sovereignty. Therefore it was naturally a main object of demolition and then the site was converted to other purpose. And Gaeksa was not only converted into the elementary school and the public market but the historic site also processed to break down for opening the road through Japanese Occupation of Korea. The main reasons of lots-subdivision were the transfer from state property to private ownership and the urban development project. Needless to say, the particular major reason was derived from the intention of Japanese Imperialism to destroy the traditional urban. As a result, Gaeksa can not be recognized the traces of today and contributes to the demolition of the remaining ancient building. Finally the deformed urban structure was left over from destroyed building.

Influence of steel-fiber type and content on electrical resistivity of old-concrete

  • Uygunoglu, Tayfun;Topcu, Ilker Bekir;Simsek, Baris
    • Computers and Concrete
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    • 제21권1호
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    • pp.1-9
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    • 2018
  • Electrical resistivity is a property associated with both the physical and chemical characteristics of concrete. It allows the evaluation of the greater or lesser difficulty with which aggressive substances penetrate the concrete's core before the dissolution of the passive film process and the consequent reinforcement's corrosion begin. This work addresses the steel fiber addition to concrete with two types and various contents from 0% to 1.3%, correlating it with its electrical resistivity. To that effect, 9 different mixes of steel fiber reinforced concrete (SFRC) were produced. The electrical resistivity was evaluated on the on six years aged SFRC by direct measurement at different frequency from 0.1 kHz to 100 kHz. The results indicate that steel fiber content is strongly conditioned by the type and quantity of the additions used. It was also found that long type of fibers has more effect on decreasing the electrical resistivity of concrete than short fibers. Therefore, they increase the corrosion risk of concrete depending on fiber volume fraction and moisture percentage.

이원계 전해도금법에 의한 Sn-3.0Ag-0.5Cu 무연솔더 범핑의 정밀 조성제어 (Precise composition control of Sn-3.0Ag-0.5Cu lead free solder bumping made by two binary electroplating)

  • 이세형;이창우;강남현;김준기;김정한
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.218-220
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    • 2006
  • Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

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난용성 의약품의 생체이용률 증진을 위한 무정형 초미립자의 조제 : UDCA와 SLS의 혼합분쇄 효과 (Amorphous Ultrafine Particle Preparation for Improvement of Bioabailability of Insolube Drugs: Effect of Co-Grinding of UDCA with SLS)

  • 정한영;곽성신;김현일;최우식
    • 약학회지
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    • 제46권2호
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    • pp.102-107
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    • 2002
  • The particle size of medicinal materials is an important physical property which affects the pharmaceutical behaviors such as dissolution, chemical stability, compressibility and bioavailability of solid dosage forms. The size reduction of raw pharmaceutical powder is needed to formulize insoluble drugs or slightly soluble drugs and to improve the pharmaceutical properties such as the solubility, the pharmaceutical mixing and the dispersion. The objective of the present study is to evaluate the grinding characteristics of ursodeoxycholic acid(UDCA) as a model of insoluble drugs. The effects of the grinding time and the amount of additive on particle size distribution of ground UDCA were investigated. Grinding of insoluble drug, UDCA and a series of dry co-grinding experiments of UDCA with sodium lauryl sulfate(SLS) as an additive were carried out using a planetary ball mill. It was measured that the median diameter and the particle size distribution of ground products with grinding UDCA and additive SLS by Mastersizer. As a result of co-grinding of UDCA and SLS, the particle size of co-grinding products was decreased more than single grinding one. However, it was observed that co-grinding products were reaggregated to larger particles after 120 min.

Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing

  • Yang, Yong Suk;You, In-Kyu;Han, Hyun;Koo, Jae Bon;Lim, Sang Chul;Jung, Soon-Won;Na, Bock Soon;Kim, Hye-Min;Kim, Minseok;Moon, Seok-Hwan
    • ETRI Journal
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    • 제35권4호
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    • pp.571-577
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    • 2013
  • The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

저Pb Sn-5%Pb-1.5%Ag-x%Bi계 솔더 합금의 특성에 관한 연구 (A study on the characteristics of low Pb Sn-5%Pb-1.5%Ag-x%Bi solder alloys)

  • 홍순국;주철홍;강정윤;김인배
    • Journal of Welding and Joining
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    • 제16권3호
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    • pp.157-166
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    • 1998
  • Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

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