• Title/Summary/Keyword: Dissimilar material

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TIG welding of copper and aluminum (TIG 용접에 의한 동-알루미늄의 접합)

  • Joo, Sung-Min;Kim, Sung-Joo;Bang, Han-Sur;Katayama, Seiji
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2003.10a
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    • pp.117-120
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    • 2003
  • Joining or welding of dissimilar metallic materials is very difficult problem because material properties like heat conductivity, melting points, coefficient of thermal expansion, etc. are different each other and cracks are occurred easily due to formation of intermetallic compounds. Nevertheless, deep attention from great industrial demands and trials to joining dissimilar materials has been increased steadily. In this study, TIG welding of Cu to Al is tried and tensile test, SEM and EDX analysis are carried out.

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Elastodynamic Response of a Crack Perpendicular to the Graded Interfacial Zone in Bonded Dissimilar Materials Under Antiplane Shear Impact

  • Kim, Sung-Ho;Choi, Hyung-Jip
    • Journal of Mechanical Science and Technology
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    • v.18 no.8
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    • pp.1375-1387
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    • 2004
  • A solution is given for the elastodynamic problem of a crack perpendicular to the graded interfacial zone in bonded materials under the action of anti plane shear impact. The interfacial zone is modeled as a nonhomogeneous interlayer with the power-law variations of its shear modulus and mass density between the two dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the transient problem to the solution of a Cauchy-type singular integral equation in the Laplace transform domain. Via the numerical inversion of the Laplace transforms, the values of the dynamic stress intensity factors are obtained as a function of time. As a result, the influences of material and geometric parameters of the bonded media on the overshoot characteristics of the dynamic stress intensities are discussed. A comparison is also made with the corresponding elastostatic solutions, addressing the inertia effect on the dynamic load transfer to the crack tips for various combinations of the physical properties.

Computer Simulation on the Explosive Welding Characteristics of Dissimilar Materials (이종재료의 폭발용접특성 해석에 관한 컴퓨터 시뮬레이션)

  • 김청균;김명구;손원호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.12
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    • pp.3028-3044
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    • 1993
  • A metallic bond of great strength for the same or dissimilar metals can be produced by the explosive welding. The formation of a metallic jet at the interface between the two impacting plates has been simulated using the numerical hydrocode DYNA2D. The mechanism of explosive welding for the wave formation is also analyzed by the computer simulation technique. The microscopic with the experimentally observed behaviour of the explosive welding. The computer simulations of the explosive welding process have proven especially useful for analyzing the mechanism of metallic bones.

A Study on Energy Release Rate for Interface Cracks in Pseudo-isotropic Dissimilar Materials (유사등방성 이종재 접합계면 균열의 에너지 해방률에 관한 연구)

  • 이원욱;김진광;조상봉
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.7
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    • pp.193-200
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    • 2003
  • The energy release rate for an interface crack in pseudo-isotropic dissimilar materials was obtained by the eigenfunction expansion method using the two-term William's type complex stress function. The complex stress function for pseudo-isotropic materials must be different from that for anisotropic materials. The energy release rate for an interface crack in pseudo-isotropic dissimilar materials was analyzed numerically by RWCIM. The results obtained were verified by comparing the other worker's results and discussed.

A Simple Finite Element Modeling Method for Leak-Before-Break Crack Analysis of Pipe with Overlay Dissimilar Metal Weldments (이종금속 오버레이 용접 배관의 파단전누설균열 해석을 위한 단순 유한요소 모델링 방법)

  • Kim, Maan Won;Park, Young Sup
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.9 no.1
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    • pp.70-76
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    • 2013
  • Several finite element models for the leak-before-break (LBB) assessment of overlay dissimilar metal weldment were constructed and analyzed to develop a simple finite element modeling method. The J-integral, crack opening displacement (COD) and J-integral distribution along the crack front in thickness direction due to the applied moment were obtained from the analysis results of the constructed finite element models, and studied compared to the previous literatures. It is concluded that the modeling with base material only is simple and produces a slightly conservative results compared to the complex modeling composed with weld metal and base metal in the calculation of J-integrals and COD values which are used for the calculation of fracture toughness and postulated leakage crack length respectively.

A Study on the Stress Concentration Phenomenon of a Dissimilar Joints (이종재 접합부에서의 응력집중현상에 관한 연구)

  • 조상명;김영식
    • Journal of Welding and Joining
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    • v.10 no.1
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    • pp.35-42
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    • 1992
  • In this study, the stress concentration phenomenon for the dissimilar joints(ceramic-metal) bonded by thermal treating using a soft-insert metal(copper) was investigated with the aid of FEM(finite element method) under the load condition of uniform tension. The analysis was carried out by the supposing that stress states are plane stress or plane strain and elastic or elastic-plastic. And the Von Mises yield criterion and the incremental theory as plastic flow were adopted in this analysis. As the summarized results obtained, the stress concentration phenomenon was severer as the soft insert metal was thicker, in plane strain than in plane stress and in elastic-plastic state than in elastic state. Furthermore, the inducing mechanism of stress concentration was well expressed by the constraint forces(Fc) generated between the soft and the hard material.

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Behavior of Fatigue Crack at Interface and Around Interface for friction Welded Dissimilar Materials (이종마찰압접재의 접합계면 및 계면근방에서의 피로균열거동)

  • 오환섭
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.03a
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    • pp.287-292
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    • 1998
  • In this study behavior of fatigue crack and fatigue fracture is observed under rotary bending fatigue testing in friction welded dissimilar materials. Fatigue fracture most occurred in SM15C heat affected zone around Interface. In case of fatigue test, stress is reduced the position of fracture gradually moves to the welded Interface. Micro crack of heat affected zone surface on SM15C is observed at any different stress.

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A study on the eigenvector analyses for V-notched cracks in Anisotropic Dissimilar Materials by the Reciprocal Work Contour Integral Method (상반일 등고선 적분법(RWCIM)을 이용한 이방성 이종재료 내의 V-노치 균열에 대한 고유벡터 해석)

  • Roh, Hong-Rae;Kim, Jin-Kwang;Cho, Sang-Bong
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.115-120
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    • 2000
  • This paper examines that it is possible to apply RWCIM for determining eigenvector coefficients associated with eigenvalues for V-notched cracks in anisotropic dissimilar materials using the complex stress function. To verify the RWCIM algorithm, two tests will be shown. First it is performed to ascertain whether predicted coefficients associated with eigenvectors is obtained exactly. Second, it makes an examination of the state of stress for FEM and RWCIM according to a number of eigenvectors at a location far away from the V-notched crack tip.

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Prediction of crack propagation path in IC package by BEM (경계요소법에 의한 반도체 패키지의 균열진전경로 예측)

  • Song, Chun-Ho;Chung, Nam-Yong
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages (반도체 패키지의 경계요소법에 의한 균열진전경로의 예측)

  • Chung, Nam-Yong
    • Transactions of the Korean Society of Automotive Engineers
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    • v.16 no.3
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    • pp.15-22
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    • 2008
  • Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.