• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.468-471
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• 2005

The Air Quality Sensor(AQS), located near the fresh air inlet, serves to reduce the amount of pollution entering the vehicle cabin through the HVAC(heating, ventilating, and air conditioning) system by sending a signal to close the fresh air inlet door/ventilation flap when the vehicle enters a high pollution area. One chip sensor module which include above two sensing elements, humidity sensor and bad odor sensor was developed for AQS (air quality sensor) in automobile. With this sensor module, PIC microcontroller was designed with back propagation neural network to reduce detecting error when the motor vehicles pass through the dense fog area. The signal from neural network was modified to control the inlet of automobile and display the result or alarm the situation. One chip microcontroller, Atmega128L (ATmega Ltd., USA) was used. For the control and display. And our developed system can intelligently detect the bad odor when the motor vehicles pass through the polluted air zone such as cattle farm.

• Journal of the Semiconductor & Display Technology
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• v.2 no.2
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• pp.17-20
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• 2003

The current drive in an MOSFET is limited by the intrinsic channel resistance. All the other parasitic elements in a device structure playa significant role and degrade the device performance. These other resistances need to be less than 10%-20% of the channel resistance. To achieve the requirements, we should investigate a methodology of separation and quantification of those resistances. In this paper, we developed the extraction method of resistances using calibrated TCAD simulation. The resistance of the extension region is also partially determined by the formation of a surface accumulation region that forms under the gate in the tail region of the extension profile.

• Journal of the Optical Society of Korea
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• v.18 no.4
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• pp.345-349
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• 2014

A direct-lit color-matching liquid crystal display using a lenticular lens array with grouped lens elements that image linear RGB light sources on the RGB subpixels of a color filter to enhance transmittance is designed, simulated, and fabricated. The RGB LED linear light sources were fabricated using small RGB LEDs in a linear array arrangement, and the lenticular lens array consisted of eight units of the same structure with a gap of 2.19 mm. The optical transmittance of the liquid crystal panel was improved by as much as 240% due to the color matching.

• Journal of the Korea Computer Industry Society
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• v.9 no.3
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• pp.105-114
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• 2008

We present an eye tracking system using a low cost 3D CMOS imager for 3D displays that ensures a correct auto stereoscopic view of position- dependent stereoscopic 3D images. The tracker is capable of segmenting the foreground objects (viewer) from background objects using their relative distance from the camera. The tracker is a novel 3D CMOS Image Sensor based on Time of Flight (TOF) principle using innovating photon gating techniques. The basic feature incorporates real time depth imaging by capturing the shape of a light-pulse front as it is reflected from a three dimensional object. The basic architecture and main building blocks of a real time depth CMOS pixel are described. For this application, we use a stereoscopic type of display using parallax barrier elements that is described as well.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.1005-1008
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• 2002

The authors introduce 3D display systems developed in our laboratories for recent ten years. Those are mainly realized by several technologies in holography: electro-holography. holographic stereogram, holographic optical elements (HOE) and hologram screen. We are currently focusing the development of 3D projection screen without glasses. Powerful directionality of the light beam is required for 3D projection screen unlike 2D type. We succeeded in achieving the superior diffractive efficiency of hologram screen that is based on the advanced volume holography. This technology is extensively useful to retrieve the Bragg condition of volume hologram in the three-dimensional space. Owing to this technology we could establish the principle of multi-view projection screen and have confirmed the case of 4 viewing points.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.17-21
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• 2004

Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

• Current Optics and Photonics
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• v.1 no.2
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• pp.150-156
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• 2017

A diffraction limited optical system for head mounted displays (HMDs) was designed. This optical system consists of four modules, including 1:5 mm and 5:30 mm beam expanders, polarization grating-polarization conversion system (PG-PCS) and refractive/diffractive projection optical module. The PG-PCS module transforms the unpolarized Gaussian beam to a linearly polarized beam and it simultaneously homogenizes the spatial intensity profile. The optical projector module has a $30^{\circ}$ field of view, a 22 mm eye relief, and a 10 mm exit pupil diameter with a compact structure. Common acrylic materials were utilized in the optical design process; therefore, the final optical system was lightweight. The whole optical system is suitable for a 0.7 inch liquid crystal on silicon microdisplay (LCOS) with HDTV resolution ($1920{\times}1080$) and $8.0{\mu}m$ pixel pitch.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.17-22
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• 2020

Recently, the decrease in thin film thickness has been actively studied by changing several physical elements such as the increase in revolution velocity of lower substrate equipped with AC or DC motor. In this paper, we propose a novel spin coater control system that changes AC or DC motor and common use software with limitation of velocity and position control into step motor and LABVIEW software based on GUI to control revolution velocity and position more precisely. By determining six input values of rotation velocity 1, 5, 10, 25, 50, 100 PPS, we fabricated six samples using coating target, TA(tantalum) on silicon substrate and measured their thin film thickness by SEM. Hence, this research can be applied to inferring thin film thickness of tantalum regarding any value of revolution velocity without additional experiments and for linear reference model via property analysis of thin film thickness using other thin-film materials.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.21-28
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For modeling elements, the system is divided into electrical part, magnetic part, and mechanical part. Each part is modeled using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to obtain the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Results of simulations and experimental show that the designed PID controller provides a improved ratio of signal to noise and a reduced sensitivity improved to the conventional PID controller.

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.61-65
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• 2011

The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.