• Title/Summary/Keyword: Dispersion additives

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Polymer Adsorption and fiber Dispersion Stability of a Paper Stock Colloidal Suspension with a PAC-PAE Dual Polymer System (PAC-PAE 2중 고분자 내첨 지료의 고분자 흡착 및 교질 분산계의 안정성 연구)

  • 윤성훈;김태영;김덕기;송병규
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.35 no.2
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    • pp.18-25
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    • 2003
  • The adsorption of co-cationic dual polymer system was investigated as was the fiber dispersion stability of a paper stock suspension. Polyaluminum chloride(PAC) and polyamidoamine epichlorohy-drin(PAE) polymers were used as wet-end additives. The adsorbed amounts of PAE polymer in a wet stock were measured by using polyelectrolytic PCD titration. The sheet forming experiments were carried out in a standard handsheet machine. Fiber dispersion stability and relative retention were evaluated in terms of M/K non-uniformity index and sheet basis weight, respectively. The PAE polymer adsorption of Langmuir-isothermal type decreased with increasing PAC addition level. The combination of the two cationic polymers presumably exerts a site-blocking effect by the low molecular weight PAC which gives a partial charge neutralization at a minimum level of addition. From a thermodynamic view point of PAE adsorption, an increase in adsorption entropy and a decrease in train number suggests that the PAR polymer has an extended conformation structure that potentially leads to an enhancement of the fiber dispersion stability. This conclusion is supported by handsheet experiments that examined the PAC-PAE dual polymer effects on the sheet formation and retention.

Effect of $BaTiO_3$ Dispersion on the Properties of Cast Tapes in Processing of Multilayer Ceramic Capacitor(MLCC) (적층 세라믹콘덴서 제조공정에서 $BaTiO_3$의 분산이 테이프캐스팅 성형체의 물성에 미치는 영향)

  • 김봉호;김병관;김명호;백운규
    • Journal of the Korean Ceramic Society
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    • v.33 no.2
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    • pp.214-222
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    • 1996
  • The effect of physicochemical properties of organic solvent and dispersant among organic solvent dispersant binder and plasticizer which are used as processing additives in MLCC fabrication process on the dispersion of BaTiO3 was studied. The steric and electrostatic stabilization mechanisms in dispersion of BaTiO3 in organic media were evaluated respectively. The sttability of BaTiO3 achieved bysteric stabilization was dependent on the fraction of surface coverage of dispersant adsorption on BaTiO3. The electrostatic repulsive forces of BaTiO3 particles dispersed in orgainc media was found to be appreciabley great and dependent mainly on the kinds of organic solvent used. The mechanism affecting the stability of BaTiO3 was studied by the method of rheologi-cal behaviors of BaTiO3 suspension.

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Polymeric Interactions of Dispersant and Binder in Aqueous Silicon Nitride Suspensions (질화규소 현탁액에서 분산제와 결합제의 상호작용연구)

  • Kim, Bong-Ho;Kim, Myong-Ho;Lee, Soo;Paik, Un-Gyu
    • Journal of the Korean Ceramic Society
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    • v.32 no.8
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    • pp.901-908
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    • 1995
  • In aqueous slurry processing of silicon nitride, the interaction of dispersant and binder used as polymeric processing additives on the silicon nitride particle surface was studied to identify the effect of these processing polymeric additives on the ceramic powder processing. The adsoprtion isotherm study of anionic organic molecule as dispersant and nonionic organic molecules as binder of silicon nitricde was studied to investigate the effect of these processing organic additives on the physicochemical properties of silicon nitride particles. As anionic molecule adsorbed onto silicon nitrice surface, the IEP of silicon nitride shifted toward acidic pH and changed the stability of silicon nitride particle. However, the adsorption of binder as nonionic organic molecule onto silicon nitride surface did not changed the IEP but caused the decrease of electrostatic potentials of silicon nitride. These distinctive adsorption behaviors of organic additives on silicon nitride particles can be closely correlated to the stability of silicon nitride particles suspended in aqueous media.

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Study on Cu CMP by using Semi-Abrasive Free Slurry (준 무연마제 슬러리를 아용한 Cu CMP 연구)

  • Kim, Nam-Hoon;Lim, Jong-Heun;Eom, Jun-Chul;Kim, Sang-Yong;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.158-161
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    • 2003
  • The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

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Effect of Binders and Additives on Magnetic and Physical Properties of Ultra Fine Metal Particle Tape (자기 테이프용 초미립 자성 철 입자의 분산거동과 전자및 물리특성에 미치는 첨가제의 영향)

  • 김주호;김기호
    • Journal of the Korean Magnetics Society
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    • v.6 no.1
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    • pp.28-35
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    • 1996
  • Dispersion behavior was investigated as functions of species and arrount of addtives, binders, abrasives, lubricants, etc.. Dispersibilityand other various properties were affected by the fuctional groups of binders. Friction coefficient and surface roughness of tape were changed with lubricants, therefore duratility of magnetic tape was varied. As a result of above investigations, we concluded that dispersion behavior of particles was very sensitive for obtaining maximum properties of metal particle tape.

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Effects of Processing Modifiers on Dispersion and Rheology of Nonaqueous Mullite/Zirconia System Suspensions (뮬라이트/지르코니아계 비수성 현탁액의 분산 및 레올로지에 미치는 공정보조제의 영향)

  • Kim, Ji-Hyun;Yang, Tae-Young;Lee, Yoon-Bok;Park, Chan;Park, Hong-Chae
    • Journal of the Korean Ceramic Society
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    • v.38 no.6
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    • pp.537-544
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    • 2001
  • 뮬라이트, 지르코니아, 뮬라이트/지르코니아 비수성 현탁액의 분산 및 레올로지에 미치는 공정보조제의 영향이 침전밀도, 점도, 입자크기를 측정함으로써 검토되었다. 현탁액의 분산안정성 (높은 침전밀도와 낮은 점도로 특징 된)은 분산제+가소제+결합제를 함유하는 경우에 비하여 분산제 또는 분산제+가소제를 함유하는 경우가 우수하였다. Ball mulling 후의 입자크기분포는 공정보조제의 종류에 거의 영향을 받지 않았다. 결합제를 부가적으로 함유하는 현탁액은 상대적으로 강한 shear thinning 거동을 나타내었다.

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Dispersion Method of Silica Nanopowders for Permalloy Composite Coating (퍼멀로이 합금도금을 위한 나노실리카 분산방법에 관한 연구)

  • Park, So-Yeon;Jung, Myung-Won;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.39-42
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    • 2011
  • The composite electroplating is accomplished by adding inert materials during the electroplating. Permalloy is the term for Ni-Fe alloy and it is used for industrial applications due to its high magnetic permeability, surface wear resistance, corrosion protection. Microhardness for microdevices is enhanced after composite coating and it increases the life cycle. However, the hydroxyl group on the silica makes their surface susceptible to moisture and it causes the silica nanoparticles to be agglomerated in the aqueous solution. The agglomeration problem causes poor dispersion which eventually interrupts uniform deposition of silica nanoparticles. In this study, the dispersion of silica nanoparticles in the permalloy electroplated layer is reported with variation of additives and current densities. The optimum current density was 20 $mA/cm^2$ and the silica content was 9 at% at $50^{\circ}C$. The amount of silica nanopowder codeposition and surface morphologies were influenced with variation of additives. In the bath, smooth surface morphology and relatively high contents of silica nanopowder codeposition were obtained with addition of sodium lauryl sulfate.

Effect of oxidants and additives on the polishing performance in tungsten CMP slurry (텅스텐 CMP 연마액에서 산화제와 첨가제가 연마 성능에 미치는 영향)

  • Lee, Jae Seok;Choi, Beom Suk
    • Analytical Science and Technology
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    • v.19 no.5
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    • pp.394-399
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    • 2006
  • The polishing performance and the relationships of electrochemistry depending upon oxidizers and additives in the tungsten CMP slurry used in semiconductor industry were investigated. Hydrogen peroxide, ferric nitrate and potassium iodate were used as oxidizers and they showed different oxidation reactions on tungsten film depending on the kind of oxidizers and pH of slurry. The differences influenced the polishing performance. Etching reaction was predominated in the hydrogen peroxide. However, passivation reaction was prevailed in ferric nitrate and potassium iodate. TMAH and KOH raised the potential energy and removal rate of tungsten, and improved a dispersion characteristic of slurry by increasing absolute value of zeta potential. Addition of 100 ppm of poly(acrylic acid) of M.W. 250,000 improved dispersion ability.

The Effect of Uni-nanoadditive Manufactured Using RF Plasma Processing on Core-shell Structure in MLCC

  • Song, Soon-Mo;Kim, Hyo-Sub;Park, Kum-Jin;Sohn, Sung-Bum;Kim, Young-Tae;Hur, Kang-Heon
    • Journal of the Korean Ceramic Society
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    • v.46 no.2
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    • pp.131-136
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    • 2009
  • Radio frequency (RF) plasma treatment is studied for the size reduction and the spheroidization of coarse particles to change them into nano-sized powders of spherical shape in MLCC fields. The uni-nanoadditives manufactured by RF plasma processing for high dispersion have been investigated for the effect on core-shell structure in dielectrics of MLCC. Microstructures have been characterized using scanning electron microscope (SEM), transmission electron microscope (TEM) and Electron Probe Micro Analyzer (EPMA). We compared the distribution of core-shell grains between specimens manufactured using uni-nanoadditive and using mixed additive. In addition, the uniformity of rare earth elements in the core-shell structured grains was analyzed. It was shown, from TEM observations, that the sintered specimen manufactured using uni-nanoadditives had more dense small grains with well-developed core-shell structure than the specimen using mixed additives, which had a homogeneous microstructure without abnormal grain growth and shows broad temperature coefficient of capacitance (TCC) curves in all temperature ranges because of well dispersed additives.