• Transactions on Electrical and Electronic Materials
• /
• v.3 no.3
• /
• pp.1-7
• /
• 2002

The developed patterns by direct writing of electron beam are measured by AFM, FESEM and optical profiler of WYKO NT3300. From different measurement methods, the measured linewidths of the patterns are shown a little bit wider than designed pattern size due to electrons scattering effect during direct writing of electron beam. The optimized conditions of these experiments are suggested and explained for the forming of structures below 0.1 ㎛ dimension size. Because of electron scattering effects from the different under layers such as Si, Si$_3$N$_4$ and aluminum, the developed pattern size is also influenced by the accelerated energy of electrons, dose, resist and soft and hard bake conditions in PMMA. The distributions of electron beam and calculations of backscattering coefficient are demonstrated by Monte Carlo simulation. From the measured results, the developed linewidth of PMMA/Al /silicon is shown a little bit wider than that of PMMA/Si$_3$N$_4$/silicon structure due to the backscattering effects.

• Journal of Powder Materials
• /
• v.17 no.5
• /
• pp.390-398
• /
• 2010

Aqueous gold nanoparticle dispersion was synthesized by chemical reduction method using diethanolamine as reducing agent and polyethyleneimine as dispersion stabilizer. The synthesis conditions for the stable dispersion of the gold nanoparticle suspension were determined by changing the amount of the reducing agent and dispersant during the wet chemical synthesis procedures. The face centered cubic lattice structure of the gold nanoparticles was confirmed by using X-ray diffraction and the morphologies of the nanoparticles were observed by transmission electron microscope. The synthesized gold nanoparticle dispersion was concentrated by evaporating the dispersion medium at room temperature followed by the addition of ethyleneglycol as humectant for the increase of the elastic properties to obtain gold nanoparticle inks for direct ink writing process. The line patterns were obtained with the gold nanoparticle inks during the writing procedures and the morphologies of the fine patterns were observed by scanning electron microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.10a
• /
• pp.319-320
• /
• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.243-243
• /
• 2004

상용화된 주사식 전자현미경(SEM)을 기본 구조로 하는 가공 시스템을 구축하여 전자빔(Electron beam)을 이용한 초미세 패턴(Nano pattern) 등 형상의 직접 성형, 혹은 직접 묘화(Direct writing) 가공을 수행하기 위해서는 크게 분류하여 연속적으로 스캐닝되는 전자빔을 요구에 따라 적절하게 극히 짧은 시간 내에 개폐하는 빔 블랭커(Beam blanker)와 효율적으로 초미세 패턴 등의 형상을 설계ㆍ가공하기 위한 전용 S/W의 두 가지 요소가 반드시 적용되어야 한다.(중략)

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.875-877
• /
• 2007

Zinc tin oxide (ZTO) sol-gel solution was synthesized for ink-jet printable semiconducting ink. Bottom-contact type TFT was produced by printing the ZTO layer between the source and drain electrodes. The transistor involving the ink-jet printed ZTO had the $mobility\;{\sim}\;0.01\;cm^2V^{-1}s^{-1}$. We demonstrated the direct-writing of semiconducting oxide for solution processed TFT fabrication.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2012.05a
• /
• pp.58.1-58.1
• /
• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.663-666
• /
• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.

• Journal of Sensor Science and Technology
• /
• v.24 no.4
• /
• pp.215-218
• /
• 2015

As several innovative technologies for flexible electric devices are being realized, demand for in-situ strain monitoring for flexible electric devices is being emphasized. Because flexible devices are commonly influenced by substrate strain, suitable strain sensors for flexible devices are essential for the sophisticated maneuvering of flexible devices. In this study, a flexible strain sensor based on an Ag electrode is prepared on a polyimide substrate using the LDW (laser direct writing) process. In this process, first, the Ag nanoparticles are coated on the substrate and selectively sintered using a focused laser. Because of the advantages of the LDW process (such as being mask-less, using low temperatures, and having non-vacuum characteristics), the entire fabrication process has been dramatically simplified; as a final outcome, a highly reliable strain sensor has been fabricated. Using this strain sensor, various strain conditions that arise from different bending radii can be detected by measuring real-time electrical signals.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.503-507
• /
• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Proceedings of the Optical Society of Korea Conference
• /
• 1990.02a
• /
• pp.1-1
• /
• 1990