• Title/Summary/Keyword: Direct write

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Simulation on Structure of Spiral Inductors for LAM Process Applications (LAM 공정 응용을 위한 나선형 인덕터의 구조에 대한 시뮬레이션)

  • Yun, Eui-Jung;Kim, Jae-Wook;Park, Hyeong-Sik;Lee, Won-Kuk
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1347-1348
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    • 2006
  • 기존 반도체공정들이 갖는 리소그래피와 식각 등의 공정단계를 배제하는 direct-write 공정을 이용하여 친환경적인 이점을 가질 수 있는 나선형 인덕터의 구조를 제안하고 주파수 특성을 확인하였다. 인덕터의 구조는 Si를 $300{\mu}m$, $SiO_2$$3{\mu}m$으로 하였으며, CU 코일의 폭과 선간의 간격은 LAM 공정과 direct-write 공정을 이용할 수 있도록 각각 $100{\mu}m$으로 설정하여 3회 권선하였다. 인덕터는 200-500MHz 범위에서 3.5nH의 인덕턴스, 4GHz에서 최대 29 정도의 품질계수를 가지며, SRF는 2.6GHz로 시뮬레이션 결과를 얻을 수 있었다.

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Direct write patterning of ITO film by Femtosecond laser ablations

  • Farson, Dave;Choi, Hae-Woon;Kim, Kwang-Ryul;Hong, Soon-Kug
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.583-588
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    • 2005
  • Indium tin oxide (ITO) is a commonly used conducting transparent oxide film (CTO) used in flat panel display applications. Direct write laser ablation is sometimes employed for ITO patterning and it is important that the substrate material and remaining ITO be affected as little as possible by the laser ablation. In this investigation, femtosecond laser ablation of ITO was studied to identify laser processing parameters which cleanly ablated ITO with a minimum of damage to a glass substrate and surrounding ITO. The Ti:Sapphire chirp pulse amplified femtosecond laser used for the experiments had a wavelength of 775nm and produced pulses with a duration of 150fs at a rate of 2 kHz. Ablation was carried out at a sufficiently high panel scanning speed that single ablation spots could be studied. The pulse energy was adjusted to determine feasible spot diameters and depths which could be ablated into the ITO without damaging the glass substrate. Next, ablation of lines without glass damage was also demonstrated. Experiments were also performed with a high repetition rate (100kHz) femtosecond laser.

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Contact Resistance between Flexible Tactile Sensor Fabricated by Direct Write and Copper Alloy Terminals (Direct write 기술로 제작된 유연촉각센서와 동합금 단자의 접촉저항)

  • Kim, Jindong;Bae, Yonghwan;Yun, Haeyong;Lee, Inhwan;Kim, Hochan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.10
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    • pp.111-116
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    • 2020
  • Flexible tactile sensors, which are primarily used as grippers in robots, are mainly used to handle highly elastic or highly flexible objects. That is, flexible grippers are used when an object cannot be sufficiently controlled by applying a specific output force or taking a specific grabbing action. This is because a flexible tactile sensor needs to measure the pressure applied directly to held objects while deforming according to the shape of the object to be handled. CNT-based sensors used to be made from a highly flexible polymer to give flexibility and it is known that the sensors are greatly affected by the contact resistance of the terminal that connects the sensor to an electrical circuit; therefore, this paper clarifies the contact resistance of MWCNTs-based flexible tactile sensors and terminals. The effects of main and plating materials for terminals are investigated and the combinations of main and plating materials that exhibit contact resistance are measured in a typical industrial environment.

Low-Power 2-level Cache Architectures for Embedded System (내장형 시스템을 위한 저전력 2-레벨 캐쉬 메모리의 설계)

  • Jong-Min Lee;Soon-Tae Kim;Kyung-Ah Kim;Su-Ho Park;Yong-Ho Kim
    • Proceedings of the Korea Information Processing Society Conference
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    • 2008.11a
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    • pp.806-809
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    • 2008
  • 온칩(on-chip) 캐쉬는 외부 메모리로의 접근을 감소시키는 중요한 역할을 한다. 본 연구에서는 내장형 시스템에 맞추어 설계된 2-레벨 캐쉬 메모리 구조를 제안하고자 한다. 레벨1(L1) 캐쉬의 구성으로 작은 크기, 직접사상(direct-mapped) 그리고 바로쓰기(write-through)를 채용한다. 대조적으로 레벨2(L2) 캐쉬는 일반적인 캐쉬 크기와 집합연관(Set-associativity) 그리고 나중쓰기(write-back) 정책을 채용한다. 결과적으로 L1캐쉬는 한 사이클 이내에 접근될 수 있고 L2캐쉬는 전체 캐쉬의 미스율(global miss rate)을 낮추는데 효과적이다. 두 캐쉬 계층간 바로쓰기(write-thorough) 정책에서 오는 빈번한 L2 캐쉬 접근으로 인한 에너지 소비를 줄이기 위해 본 연구에서는 One-way 접근 기법을 제안하였다. 본 연구에서 제안한 2-레벨 캐쉬 메모리 구조는 평균적으로 26%의 성능향상과 43%의 에너지 소비 그리고 77%의 에너지-지연 곱에서 이득을 보여주었다.

Interconnecting Nanomaterials for Flexible Substrate and Direct Writing Process

  • Jwa, Yong-Ho
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.58.1-58.1
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    • 2012
  • Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

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Conductive Inks Manufactured with the Help of Low Melting Metals (용해도 낮은 금속을 이용한 전기 전도성 잉크)

  • Han, Kenneth N.;Kim, Nam-Soo
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.1
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    • pp.126-131
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    • 2008
  • In this investigation, various factors affecting manufacturing conductive inks are presented, examined and discussed. The discussion includes inherent difficulties in making conductive inks successful and at the same time offers ways in which these difficulties might be overcome. One of the solutions to overcome such difficulties is to use low melting metals and alloys. This aspect is also detailed.

ShEx Schema Generator for RDF Graphs Created by Direct Mapping

  • Choi, Ji-Woong
    • Journal of the Korea Society of Computer and Information
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    • v.23 no.10
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    • pp.33-43
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    • 2018
  • In this paper, we propose a method to automatically generate the description of an RDF graph structure. The description is expressed in Shape Expression Language (ShEx), which is developed by W3C and provides the syntax for describing the structure of RDF data. The RDF graphs to which this method can be applied are limited to those generated by the direct mapping, which is an algorithm for transforming relational data into RDF by W3C. A relational database consists of its schema including integrity constraints and its instance data. While the instance data can have been published in RDF by some standard methods such as the direct mapping, the translation of the schema has been missing so far. Unlike the users on relational databases, the ones on RDF datasets were forced to write repeated vague SPARQL queries over the datasets to acquire the exact results. This is because the schema for RDF data has not been provided to the users. The ShEx documents generated by our method can be referred as the schema on writing SPARQL queries. They also can validate data on RDF graph update operations with ShEx validators. In other words, they can work as the integrity constraints in relational databases.