• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.83-89
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• 2015

본 논문에서는 졸-침투와 직접-패턴 공정을 이용하여 향상된 압전 후막의 전기적 특성과 우수한 패터닝 특성을 동시에 만족할 수 있는 제작 방법을 제시한다. 저온(< $850^{\circ}C$) 공정 후 후막의 고밀도 및 직접-패턴의 목적을 달성하기 위해서, 감광성 티탄산 지르콘산 연 ($Pb(Zr,Ti)O_3$, PZT) 졸을 스크린인쇄된 PZT 후막 내부로 침투시켰다. 직접-패턴된 PZT막은 포토크롬마스크와 UV 조사에 의해서 일정한 간격으로 인쇄된 후막 위에 성공적으로 형성되었다. 스크린인쇄된 후막은 분말형태의 기공성 구조를 갖고 있어 조사된 UV빛이 산란되기 때문에, 감광성 졸-침투 공정을 할 때 PZT 후막의 특성을 증가시키기 위한 공정의 최적화가 필요하다. 침투된 감광성 PZT 졸의 농도, 조사된 UV 시간 및 용매 현상 시간을 최적화한 결과, 0.35 M의 PZT 농도, 4 분의 UV 조사시간과 15 초의 용매 현상시간으로 졸-침투된 PZT 후막은 $800^{\circ}C$ 소결 온도에서 입자들의 성장에 의해 치밀화 정도가 증가되었다. 또한 PZT후막의 강유전 특성(잔류분극 및 항복 전압)도 향상되었다. 특히 잔류분극값은 스크린인쇄된 후막보다 약 4배정도 증가되었다. 이렇게 제작된 후막은 어레이타입의 압전형 마이크로미터크기의 센서 및 액츄에이터 등에 응용 가능성을 제시할 수 있었다.

• 한국세라믹학회지
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• 제42권6호
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• pp.425-431
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• 2005

Line Shaped Solid Oxide Fuel Cell (SOFC) with multilayered structure has been fabricated via direct-writing process. The cell is electrolyte of Ni-YSZ cermet anode, YSZ electrolyte and LSM cathode. They were processed into pastes for the direct writing process. Syringe filled with each electrode and electrolyte paste was loaded into the computer-controlled robe-dispensing machine and the paste was dispensed through cylindrical nozzle of 0.21 mm in diameter under the air pressure of 0.1 tow onto a moving plate with 1.22 mm/s. First of all, the anode paste was dispensed on the PSZ porous substrate, and then the electrolyte paste was dispensed. The anode/electrolyte and the PSZ substrate were co-fired at $1350^{\circ}C$ in air atmosphere for 3 h. The cathode layer was similarly dispensed and sintered at $1200^{\circ}C$ for 1 h. All the electrode/electrolyte lines were visually aligned during the direct writing process. The effective reaction area of fabricated SOFC was $0.03 cm^2$, and the thickness of anode, electrolyte and cathode was 20 $\mu$m, 15 $\mu$m, and 10 $\mu$m, respectively. The single line-shaped SOFC fabricated by direct-writing process exhibited OCV of 0.95 V and maximum power density of $0.35W/cm^2$ at $810^{\circ}C$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1431-1433
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• 1995

This paper describes the characteristics of Si Hall sensors fabricated on a SOI(Si-on-insulator} structure, in which the SOI structure was forrmed by SDB(Si-wafer direct bonding) technology. The Hall voltage and the sensitivity of implemented Si Hall devices show good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average $600V/A{\cdot}T$. In the temperature range of 25 to $300^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the product Sensitivity) are less than ${\pm}6.7{\times}10^{-3}/^{\circ}C$ and ${\pm}8.2{\times}10^{-4}/^{\circ}C$, respectively. From these results, Si Hall sensors using the SOI structure presented here are very suitable for high-temperature operation.

• 대한치과의사협회지
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• 제50권7호
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• pp.368-376
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• 2012

The demand for tooth-colored restorations has grown considerably during the last decade. Posterior composite restorations have risen in popularity as a result of the development of improved resin composites, bonding systems and operating techniques. A major limitation of direct composite restoration is the difficulty of controlling the polymerization shrinkage. To overcome this limitation, the indirect fabrication of a composite restoration and cementation with resin cement has been advocated. Unfortunately, the current available resin cements with indirect restorations do not always bond to dentin as strongly as dentin adhesive systems bond with direct resin composite restorations. Several procedural strategies have been proposed for indirect composite restoration. In this regard, the rationale for the indication, characteristics and clinical application is described in this paper. As a result, we will try to suggest the evidence-based guidelines for indirect composite restorations by reviewing each available indirect composite products, technical procedure and pronosis.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.215-219
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• 2004

We reported two new techniques of barrier rib formation that are applicable to a variety of structures for high-efficiency PDPs suitable for mass-production [1]. These two methods are mold replication and direct glass sculpting. Especial progress has since been made in improving these methods to be more suitable for high-efficiency PDPs with the DelTA cell structure. This paper reports photolithographic fabrication methods for the masters used in mold replication. The masters for more complex barrier rib forms are easier to make with these methods. The paper also reports a process that combines the direct glass sculpting method with an ink-jet printing method of electrode formation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.104-107
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• 2002

Direct Metal Manufacturing (DMM) is a new additive process that aims to take die making and metalworking in an entirely new direction. It is the blending of five common technologies : lasers, computer-aided design (CAD), computer-aided manufacturing (CAM), sensors and powder metallurgy. The resulting process creates parts by focusing an industrial laser beam onto a tool-steel work piece or platform to create a molten pool of metal. A small stream of powdered tool-steel metal is then injected into the melt pool to increase the size of the molten pool. By moving the laser beam back and forth, under CNC control, and tracing out a pattern determined by a computerized CAD design, the solid metal part is built line-by-line, one layer at a time. DMM produces improved material properties in less time and at a lower cast than is possible with traditional fabrication.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1433-1438
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• 2007

Characteristics of a phase change type micro actuator have been studied. The micro actuator has been designed for a micro-pump in an active direct methanol fuel cell(DMFC), consisting of an actuating chamber, a membrane, an electric heater, and a sensor of resistance temperature detector (RTD). In the present study, researches have been focused on the response of the actuator to control algorithm of the heater. The experiments demonstrated that the displacement of the membrane increase with temperature variation which is a function of applied voltage, duty ratio, and operating frequency of heating. The results also showed that operation of the actuator with high voltage at small duty of heating is more efficient than the same power consumption of heating with low voltage at large duty.

• Transactions on Electrical and Electronic Materials
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• 제1권1호
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• pp.6-11
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• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• 전자공학회논문지A
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• 제31A권12호
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• pp.16-22
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• 1994

In this paper, transmitter and receiver modules for free space optical interconnection are implemented and characterized. In the transmitter module, bias circuitry which inject current into the direct modulated laser diode is fabricated and in the receiver module, p-i-n diode is integrated with an MMIC amplifying stage. Laser diode has a direct-modulated bandwidth of 2 GHz at 1.4 Ith bias while p-i-n diode and amplifying stage has a bandwidth of 1.3 GHz and 1.5 GHz, repectively. Optical interconnection has a bandwidth of 1.3 GHz and linearly transmit modulated voltage signal up to 1.5 Vp-p. Measured loss of optical interconnection is 5dB which is composed of optoelectronic conversion loss of 15 dB, electrical impedance mismatch loss of 6.7 dB in transmitter module and gain of 18 dB in receiver module. Seperation between transmitter and receiver can be extended up to 50 cm by using a lens.

• 한국재료학회지
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• 제17권7호
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• pp.352-357
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• 2007

Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.