• Computers and Concrete
• /
• v.3 no.1
• /
• pp.29-42
• /
• 2006

In this study, a novel education system for inspection of concrete bridges is presented. The new education approach uses virtual reality (VR) and three-dimensional computer graphics (3DCG) in training engineers to become bridge inspection specialists. The slow time-dependent deterioration of concrete bridges can be reproduced on the computer screen in any chosen time frame, thus providing the trainees with illustrative and educative insight into the deterioration problem. In the proposed VR/3DCG approach a three-dimensional model of concrete bridge, including surfaces, viewpoints and walkthrough paths is created. With the help of this virtual bridge model, an experienced bridge inspection specialist teaches the different deterioration phenomena of concrete bridges to the trainees. The new system was tested, and the inspection results from the case bridge showed that in comparison with the traditional Japanese bridge inspection education system, the new system gives better results. In addition to the improvement of quality of bridge inspections, the new VR/3DCG system-based education brings along some other, more intangible benefits.

• Proceedings of the KIEE Conference
• /
• 2001.07d
• /
• pp.2199-2201
• /
• 2001

The 3-dimensional measuring machine by using an ultrasonic sensor is used one of the NDE(Nondestructive Examination). It is applied to the inspection of pipelines, boreholes, pressure vessel and tank, and so on. In particular when a harsh environment prohibits the use of moving mechanical parts. The 3-dimensional measuring machine by using an ultrasonic sensor, which measure 1-dimensional information and 2-dimensional information simultaneously from a target of inspection, and then reembody 3-dimensional information. So we can find the situation in progress and predict remaining life and corrosion without destructive examination. It's a point of excellence that the 3-dimensional measuring machine is portable.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.04a
• /
• pp.510-514
• /
• 2002

The 3-dimensional measuring machine by using an ultrasonic sensor is used one of the NDE(Non Destructive Examination). It is applied to the inspection of pipelines, boreholes, pressure vessel and tank, and so on. In particular when a harsh environment prohibits the use of moving mechanical parts. The 3-dimensional measuring machine by using an ultrasonic sensor, which measure 1-dimensional information and 2-dimensional information simultaneously from a target of inspection, and then reembody 3-dimensional information. So we can find the situation in progress and predict remaining life and corrosion without destructive examination. It's a point of excellence that the 3-dimensional measuring machine is portable.

• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.127.5-127
• /
• 2001

The 3-dimensional measuring machine by using an ultrasonic sensor is used one of the NDE (Nondestructive Evaluation). It is applied to the inspection of pipelines, boreholes, pressure vessel and tank, and so on. On particular when a harsh environment prohibits the use of moving mechanical parts. The 3-dimensional measuring machine by using an ultrasonic sensor, which measure 1-dimensional information and 2-dimensional information simultaneously from a target of inspection, and then re construct 3-dimensional information. So we can find the situation in progress and predict remaining life and corrosion without destructive examination. It´s a point of excellence that the 3-dimensional measuring machine is portable.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1996.11a
• /
• pp.444-449
• /
• 1996

The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.10a
• /
• pp.156-159
• /
• 2005

The outer race of CV(constant velocity) joint is an important load-supporting automotive put that transmits torque between the transmission gear box and driving wheel. The outer race is difficult to forge because its shape is very complicated and the required dimensional tolerances are very small. To guarantee the dimensional accuracy of the forged CV Joint, the quick and precise measurement is required to increase the inspection speed of forged products. Therefore in this study, PP(Pre-Position) Device to decrease the inspection time of measuring system has been developed to cope with forging cycle time. The measured inspection time confirms that the PPD is very effective in decreasing inspection time.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.6
• /
• pp.1743-1752
• /
• 1996

In this paper, a precision inspection technique using CAD/CAI integration is proposed for the parts having very thin and sharp 3 dimensional curve features. The technique begings with feature reconstruction of turbine blades which have 3 dimensional combined feometry, such as splines, and thin circles. The alifnment procedures consistsb of two phases-rough and fine phases : rough phase alignment is based on the conventional 6 point5s probing on the clear cut surfacef, and fine phase alignment is based on the intial measurement on the 3 dimensional curved parts using an lterative measurement feed-back least sequares technique for alignment. Forf the analysis of profile tolerance of parts, the actual measured points are obtained by finding the closet points on the CAD geometry by the developed subdivision technique and the Tschebycheff norm is applied based on iterative fashion, giving accurate profile tolerance value. The developed inspection technique is applied to practical procedures of blade manufacturing and demonstrated high performance.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.909-910
• /
• 2013

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.62 no.8
• /
• pp.1151-1156
• /
• 2013

In this study, to clearly establish the concept of a geometric modeling I apply for the concept of Pushbroom, limited to two-dimensional radiation Locator to provide a three-dimensional information purposes. Respect to the radiation scanner Pushbroom modeling techniques, geometric modeling method was presented introduced to extract three-dimensional information as long as the rotational component of the Gamma-Ray Linear Pushbroom Stereo System, introduced the two-dimensional and three-dimensional spatial information in the matching relation that can be induced. In addition, the pseudo-inverse matrix by using the conventional least-squares method, GCP(Ground Control Point) to demonstrate compliance by calculating the key parameters. Projection transformation matrix is calculated for obtaining three-dimensional information from two-dimensional information can be used as the primary relationship, and through the application of a radiation image matching technology will make it possible to extract three-dimensional information from two-dimensional X-ray imaging.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.1-9
• /
• 2001

This paper proposes an inspection algorithm for micro ball grid array ($\mu$BGA) solder balls. This algorithm is motivated by the difficulty of finding defect balls by human visual inspection due to their small dimensions. Specifically, it is developed herein an automated vision-based inspection algorithm for $\mu$BGA's, which can inspect solder balls not only for so-called two dimensional errors, such as missings, positions and sizes, but also for height errors. The inspection algorithm uses two dimensional images of $\mu$BGA obtained through special blue illumination, and processes them with a rotation-invariant sub algorithm. It can also detect height errors when a two-camera system is available. Simulation results show that the proposed algorithm is more efficient in detecting ball defects compared with the conventional algorithms.