• Polymer(Korea)
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• v.24 no.2
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• pp.201-210
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• 2000

To determine the effect of chain length of linear amine curing agents on the thermal and mechanical properties, standard epoxy resin, diglycidyl ether of bisphenol A (DGEBA) was cured with diethylenetriamine (DETA), triethylenetetraamine (TETA) and tetraethylenepentaamine (TEPA) in a stoichiometrically equivalent ratio. From this work, the effect of linear amine curing agents on the thermal and mechanical properties was significantly influenced by chain length of curing agents. In contrast, the results showed that the DGEBA/DETA system had higher values than the DGEBA/TETA and DGEBA/TEPA system in the density, shrinkage (%), thermal expansion coefficient, tensile modulus, and flexural strength. Whereas the DGEBA/DETA cure system had lower values than the DGEBA/TETA and DGEBA/TEPA cure system in the maximum exothermic temperature, conversion (%), and T$_{g}$. These findings imply that the differences in the maximum conversion about the chain length of curing agents affect the thermal and mechanical properties.s.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2425-2433
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• 2018

This study investigates a new organic based material and its dielectric and mechanical properties. It is a comprehensive nanocomposite comprising a combination of various types of nanofillers with hydrophobic silica nanoparticles (AEROSIL R 974) as a matrix modifier and a polyamide nano nonwoven textile, Ultramid-Polyamide 6, pulped in the electrostatic field as a dielectric barrier. The polymer matrix is an epoxy network based on diglycidyl ether of bisphenol A (DGEBA) and cycloaliphatic diamine (Laromine C260). The designed nanocomposite material is an alternative to the conventional three-component composites containing fiberglass and mica with properties that exceed current electroinsulating systems (volume resistivity on the order of $10^{16}{\Omega}{\cdot}m$, dissipation factor tan ${\delta}=4.7{\cdot}10^{-3}$, dielectric strength 39 kV/mm).

• Applied Chemistry for Engineering
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• v.7 no.5
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• pp.963-969
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• 1996

Cure characteristics of DGEBA(diglycidyl ether of bisphenol A)/dicy(dicyandiamide) system containing diuron(3-(3,4-dichloro phenyl) -1,1-dimethylurea) as an accelerator was investigated. The system has shelf life of six months because dicy is insoluble in liquid/solid resins at room temperature. It is generally known that dicy is an adequate curing agent for one component adhesive due to its highly latent property. With increasing the amount of added dicy, reaction heat of DGEBA/dicy system increased and degree of conversion was not varied. For DGEBA/dicy/diuron system, cure temperature decreased about $40^{\circ}C$ and cure reaction became fast by the addition of diuron which activates dicy. $T_g$ of the mixed resin decreased with the amount of accelerator. which was interpreated with molecular structure forming loose chain. Cure kinetics of DGEBA/dicy and DGEBA/dicy/diuron system were explained using Kamal's autocatalytic reaction model. The effect of acceleration was confirmed with that reaction model.

• Macromolecular Research
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• v.15 no.1
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• pp.10-16
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• 2007

In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravi-metrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1009-1013
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• 2001

The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.147-150
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• 2002

The cure kinetics of blends of epoxy (DGEBA:diglycidyl ether of bisphenol A)/anhydride (NMA:nadic methyl anhydride) resin with synthesized amino terminated polyetherimide (AT-PEI) were studied using differential scanning calorimetry (DSC) and Dynamic Mechanical Analysizer(DMA) under isothermal condition to determine the reaction parameters and gel-vitrification behavior. The fracture toughness of AT-PEI 20phr/epoxy resin system was improved over 224% and 42.5% more than neat epoxy resin and commercial PEI/Epoxy Resin System.

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.499-503
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• 1987

The electrical characteristics of Epoxy Robin vary with temperature. In this study, the variation of the electric characteristics of Epoxy Resin with various hardening temperature was studied. Epoxy Resin used as samples are Epotohto YD-128 of Diglycidyl Ether of Bisphenol A (DGEBA) series and hardener, Goodmide G-240. It's mixing rate is 3 to 1. Hardening temperature was varied from 25[$^{\circ}C$] to 50[$^{\circ}C$] by 5[$^{\circ}C$]. During the hardening progress, illumination, resistivity and the internal temperature of material which were dependet on the variety of hardening temperature were measured. The electrical properties of hardened samples were examined by means of X-ray diffraction, tan $\delta$ test, TG-DTA analysis and treeing test. On this basis, optimal hardening temperature in insulation characteristics was examined.

• Journal of Adhesion and Interface
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• v.23 no.2
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• pp.44-52
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• 2022

Epoxy resin has the disadvantage of being easily destroyed by instantaneous impact due to its high crosslinking density despite its high glass transition temperature (T_g) and excellent properties. To compensate for this, in this study, polyol was synthesized by ring opening polymerization of propylene glycol (PPG) diamine, Jeffamine D 2000 and propylene carbonate, and urethane modified epoxy was synthesized using this. The properties of the synthesized urethane modified epoxy were confirmed by FT-IR, H-NMR. To confirm the degree of improvement in impact resistance as an adhesive, a urethane modified epoxy adhesive was prepared by mixing a digylcidyl ether bisphenol A (DGEBA) with curing agent and curing accelerator. Properties test of urethane modified epoxy were shear strength, tensile strength and impact strength. As a result, excellent results were obtained in all test when the ratio of DGEBA : urethane modified epoxy was 8:2.

• Polymer(Korea)
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• v.25 no.2
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• pp.199-207
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• 2001

In the present study the cure behavior of diglycidyl ether of bisphenol-A(DGEBA) using an anhydride-based hardener in the presence of N,N-dimethyl benzyl amine (BDMA) or 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN) as an accelerator has been monitored and interpreted from the viewpoint of photophysical properties by means of fluorescence spectroscopy. To do this, 1,3-bis-(1-pyrene)propane (BPP) was well incorporated in the epoxy resin system by mechanical blending. The BPP probe, which is very sensitive to conformational change of the molecule influenced by the surrounding medium, successfully formed intramolecular excimer fluorescence. It is susceptible to the micro-viscosity or local viscosity and molecular mobility according to the epoxy cure. The cure behavior was explained with monomer fluorescence intensity ($I_{M}$ ), excimer fluorescence intensity ($I_{E}$ ) and $I_{M}$ /$I_{E}$ ratio as a function of cure time, cure temperature and accelerator. The present work agreed with the previous report on the cure behavior of an epoxy-anhydride system studied using DSC or torsion pendulum method. This study also suggests that the use of fluorescence technique may provide information on cure behavior of a thermosetting resin in a low temperature region, which has not been well interpreted by other analytical methods.

• Clean Technology
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• v.23 no.4
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• pp.378-387
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• 2017

To obtain epoxy resin with permanently attached flame-retardant groups, phosphorus compound containing di-hydroxyl group [10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ] and silicone compound containing di-hydroxyl group (polydimethylsiloxane, hydroxyl terminated, PDMS) were reacted with uncured epoxy prepolymer (diglycidyl ether of bisphenol A, DGEBA) and then cured using 4,4-diaminodiphenylmethane (DDM) as a crosslinking agent. The properties of the resulting epoxy materials were characterized using Fourier transform infrared (FTIR) spectrometer, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), limiting oxygen index (LOI) test/vertical burning test (UL 94-V test), tensile properties test and impact test. This study examined the effect of phosphorus/silicone compound contents on the thermal/mechanical properties and flame retardancy of cured epoxy resins containing phosphorus and silicone compounds. It was found that the thermal/mechanical properties of epoxy resins containing phosphorus and silicone components were higher than those of simple epoxy resin. The flame-retardancy (LOI: 29.9 ~ 31.8% and UL 94-V: V-0) of all samples containing phosphorus compound and phosphrous compound/silicone compound was found to be passed the flame-retardant requirements (LOI: > 30%, UL 94-V: V-0) of LOI and vertical burning tests. However, the flame-retardancy (LOI: 21.4% and UL 94-V: no rating) of simple epoxy resin was found to be failed the flame-retardant requirements.