• Journal of Welding and Joining
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• v.20 no.3
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• pp.116-121
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• 2002

For the accumulation of a fundamental knowledge about the behavior of glass solder during the joining of ceramics, the wettability of solder on silicon nitride have been measured by sessile drop method. $SiO_2-MgO-Al_2O_3$ g1ass solder and oxynitride glass solders were selected as examples while silicon nitride which were used as substrates. Contact angle of solder on silicon nitride didn't decrease with time at high nitrogen content in the solder, but low nitrogen content in solders have the time-dependent property. Reason which contact angle of low nitrogen content in solders decrease on silicon nitride was that diffusion of nitrogen take place between solder and silicon nitride.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.106-109
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• 2016

The YBaCuO superconducting bulks were prepared by the thermal diffusion process involving the peritectic reaction to investigate the effect on microstructure and superconductivity. All the diffused YBaCuO could be successively separated from superconducting 123 phase by applying the thermal diffusion process. Electromagnetic properties of treated and untreated YBaCuO superconductor were evaluated to investigate the pinning effect. It was confirmed experimentally that a large amount of magnetic flux was trapped in the thermal treated superconducting bulk than that in the untreated one, indicating that the pinning centers of magnetic flux are related closely to the occurrence mechanism of the magnetic effect.

• Fibers and Polymers
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• v.1 no.2
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• pp.92-96
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• 2000

A high molecular weight polyhydroxyamide (PHA) solution in N, N-dimethyl acetamide (DMAc) was prepared from 3, 3'-dihydroxybenzidine and isophthalic chloride (IPC), which was used for spinning PHA fiber. Before spinning, the diffusion property of DMAc into various coagulants was examined. The fiber was well formed in coagulants such as water/ethanol with a composition of 5/5, ethanol, and ethanol/isopropanol with a composition of 7/3 and 5/5. However, the PHA fiber spun in the water/ethanol mixture contained voids. After the fiber spun in ethanol was annealed at over $350^{\circ}C$, the ultimate stress and initial modulus of the fiber increased from 75.5 MPa and 3.22 GPa to 369 MPa and 29.5 GPa, respectively. These properties of the PHA fiber spun by the dry spinning method were also enhanced, attaining 154 MPa and 5.56 Gpa, respectivel.

• Transactions of Materials Processing
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• v.6 no.2
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• pp.136-144
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• 1997

(Ag-10%Ni)/Cu clad metals for electric contact switch were fabricated by cold-roll bonding process. 2 or 3 passes of cold-rolling was carried out for each process to investigate the effect of the rolling passes on the bonding property. The effect of the annealing temperature of copper before the cold-roll bonding on the bond strength was also studied. The specimen bonded with copper annealed below 30$0^{\circ}C$ before roll bonding showed good bond strength. This is because high stored energy in copper promoted the short range diffusion and the grain refinement of copper by the static recrystallization increased the degree of the interfacial coherency. The maximum peel strength of clad metals bonded with Cu annealed below 30$0^{\circ}C$ was 120N.

• The Pure and Applied Mathematics
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• v.15 no.3
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• pp.329-342
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• 2008

There have been many experimental and observational evidences which indicate the predator response to prey density needs not always monotone increasing as in the classical predator-prey models in population dynamics. Holling type functional response depicts situations in which sufficiently large number of the prey species increases their ability to defend or disguise themselves from the predator. In this paper we investigated the stability and instability property for a Holling type predator-prey system of a generalized form. Hopf type bifurcation properties of the non-diffusive system and the diffusion effects on instability and bifurcation values are studied.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1221-1227
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• 2015

Diffusion bonding is the key manufacturing process for the micro-channel type heat exchangers. In this study, austenitic alloys such as Alloy 800HT, Alloy 690, and Alloy 600, were diffusion bonded at various temperatures and the tensile properties were measured up to $650^{\circ}C$. Tensile ductility of diffusion bonded Alloy 800HT was significantly lower than that of base metal at all test temperatures. While, for Alloy 690 and Alloy 600, tensile ductility of diffusion bonded specimens was comparable to that of base metals up to $500^{\circ}C$, above which the ductility became lower. The poor ductility of diffusion bonded specimen could have caused by the incomplete grain boundary migration and precipitates along the bond-line. Application of post-bond heat treatment (PBHT) improved the ductility close to that of base metals up to $550^{\circ}C$. Changes in tensile properties were discussed in view of the microstructure in the diffusion-bonded area.

• THE INTERNATIONAL COMMERCE & LAW REVIEW
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• v.12
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• pp.107-132
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• 1999

The technology transfer agreements, which transfer technology from industrialized countries to developing countries, are subjected to control and restrictions in many developing countries in order to protect national interests. The licensors endeavour, therefore, to ensure that their activities fit satisfactorily into the technological policies and plans of the host countries, and contribute to the development of national scientific and technological potential, including the establishment and improvement in host countries of their capacity to innovate. Secondly, the licensors adopt in the course of their business activities practices which permit the rapid diffusion of technologies with due regard to the protection of industrial and intellectual property rights. Thirdly, the licensors endeavour to grant licenses for the use of industrial property rights or to otherwise transfer technology on reasonable terms and conditions.

• Journal of Korea Technology Innovation Society
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• v.5 no.1
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• pp.26-43
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• 2002

Korean government has been putting efforts to promote development of technologies by government sponsored labs and to transfer, diffuse, and commercialize these technologies in private sector since mid 1980s. In spite of these efforts, utilization of government-sponsored technology remains in the very low level. According to the survey conducted by Korea Intellectual and Patent Office (1999), the ratio of unused industrial property rights including patents was above 70% of total industrial property rights. Survey on the information and telecommunication industry done by the Institute of Information Technology Assessment (IITA) in 1999 shows that the utilization ratio of government-sponsored technologies is about 55.8%. This is especially true where government is not the primary or end-user of technologies. The purposes of this paper are to (1) identify a process model of technology commercialization, (2) develop the related variables of each step in the six-step continuous process model of government-sponsored technology commercialization, (3) empirically investigate the data gathered through questionnaire survey, and (4) suggest policy alternatives for promoting technology commercialization in Information and Telecommunication industries.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.328-331
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• 2024

This research explores the development of [100]-textured barium titanate (BaTiO₃, BT) ceramics using sodium bismuth titanate (Na_0.5Bi_4.5Ti₄O₁₅, NBiT) templates, aimed at leveraging the inherent high dielectric property of BT. However, the attempted texturing was unsuccessful, primarily due to bismuth diffusion from the NBiT templates into the BT matrix below the sintering temperature, at 1,000℃. Systematical exploration about the cause of the failure is involved and alternative approaches are proposed in detail to overcome the challenge. These findings contribute to the understanding of techniques and conditions for textured ceramic fabrication and highlight the need for further research in this area.