• 제목/요약/키워드: Dielectric resistance

검색결과 330건 처리시간 0.025초

NiCr 박막 저항계의 열적 안정성에 관한 연구 (The Study on Thermal Stability of NiCr Thin-films Resistor)

  • 김인성;정순종;김도한;송재성
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.168-170
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    • 2001
  • The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on corning glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then 10 ppm/$^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

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PC1D Simulation을 통한 결정질 실리콘 태양전지의 국부적 후면 전극 최적화 설계 (An optimal design for the local back contact pattern of crystalline silicon solar cells by using PC1D simulation)

  • 오성근;임충현;조영현
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.43.1-43.1
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    • 2010
  • In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

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Low Temperature PECVD for SiOx Thin Film Encapsulation

  • Ahn, Hyung June;Yong, Sang Heon;Kim, Sun Jung;Lee, Changmin;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.198.1-198.1
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    • 2016
  • Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

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고압 커패시터의 고장분석과 신뢰성 평가 (Reliability Evaluation and failure Analysis for High Voltage Ceramic Capacitor)

  • 김진우;송옥병;신승우;이희진;신승훈;유동수
    • 한국신뢰성학회:학술대회논문집
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    • 한국신뢰성학회 2001년도 정기학술대회
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    • pp.337-337
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    • 2001
  • High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

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압전층의 2단 증착법을 이용한 체적 음향파 박막형 공진기의 제작과 성능향상에 관한 연구 (A Study of the Fabrication and Enhancement of Film Bulk Acoustic Wave Resonator using Two-Step Deposition Method of Piezoelectric Layer)

  • 박성현;추순남;이능헌
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권7호
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    • pp.308-314
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    • 2005
  • The 2 GHz film bulk acoustic wave resonator(FBAR), one of the most necessary device of the next generation mobile communication system, consisted of solidly mounted resonator(SMR) structure using Brags reflector, was researched in this paper The FBAR applied SiO$_{2}$ and W had large difference of the acoustic impedance to reflector Al to electrode and ZnO to piezoelectric layer. Specially, the FBAR applied the two-step deposition method to improve the c-axis orientation and increase reproducibility of the fabrication device had good performance. The electrical properties of plasma such as impedance, resistance, reactance, $V_{pp},\;I{pp}$, VSWR and phase difference of voltage and current, was analyzed and measured by RF sensor with the variable experiment process factors such as gas ratio, RF power and base vacuum level about concerning the thickness, c-axis orientation, adhesion and roughness. The FBAR device about the optimum condition resulted reflection loss(S$_{11}$) of -17 dB, resonance frequency of 1.93 GHz, electric-mechanical coefficient(k$_{eff}$) of 2.38 $\%$ and Qualify factor of 580. It was seen better qualify than the common dielectric filter at present and expected on business to the filter device of 2 GHz bandwidth with the MMIC technology.

MECHANICAL AND ELECTRICAL PROPERTIES OF STYRENE-BUTADIENE-STYRENE/ ALUMINIUM COMPOSITES

  • Renukappa, N.M.;Siddaramaiah, Siddaramaiah;Sudhaker Samuel, R.D.;Jeevananda, T.;Kim, Nam-Hoon;Lee, Joong-Hee
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.142-147
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    • 2007
  • A series of styrene-butadiene-styrene/aluminium (SBR/Al) composites have been compounded with different weight ratios of Al. The prepared SBR-Al systems have been characterized for different mechanical properties such as tensile strength, tensile modulus and surface hardness have improved with the increase in content of Al in SBR matrix. This may is because of the increase in polymer-filler interaction. The electrical properties such as volume conductivity, surface resistivity, dielectric constant, dissipation factor (tan delta), and break down voltage of SBR/Al composites have been measured with reference to volume fraction $(V_{f}),$ frequency and temperature. The resistance of the SBR-Al composites is found to be ohmic. The voltage-current (V-I) characteristics for SBR-Al also exhibit a linear relationship indicating the ohmic behavior.

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FBAR용 ZnO 박막의 열처리 온도변화에 따른 미세조직 및 전기적 특성 (Microstructure and Electrical Properties of ZnO Thin Film for FBAR with Annealing Temperature)

  • 김봉석;강영훈;조유혁;김응권;이종주;김용성
    • 한국세라믹학회지
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    • 제43권1호
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    • pp.42-47
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    • 2006
  • In this paper, we prepared high-quality ZnO thin films for application of FBAR (Film Bulk Acoustic Resonator) by using pulse DC magnetron sputtering. To prevent the formation of low dielectric layers between metal and piezoelectric layer, Ru film of 30 nm thickness was used as a buffer layer. In addition we investigated the influence of annealing condition with various temperatures. As the annealing temperature increased, the crystalline orientation with the preference of (002) c-axis and resistance properties improved. The single resonator which was fabricated at $500^{\circ}C$ exhibited the resonance frequency and the return loss 0.99 GHz and 15 dB, respectively. This work demonstrates potential feasibility for the use of thin film Ru buffer layers and the optimization of annealing condition.

A Two-dimensional Steady State Simulation Study on the Radio Frequency Inductively Coupled Argon Plasma

  • Lee, Ho-Jun;Kim, Dong-Hyun;Park, Chung-Hoo
    • KIEE International Transactions on Electrophysics and Applications
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    • 제2C권5호
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    • pp.246-252
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    • 2002
  • Two-dimensional steady state simulations of planar type radio frequency inductively coupled plasma (RFICP) have been performed. The characteristics of RFICP were investigated in terms of power transfer efficiency, equivalent circuit analysis, spatial distribution of plasma density and electron temperature. Plasma density and electron temperature were determined from the equations of ambipolar diffusion and energy conservation. Joule heating, ionization, excitation and elastic collision loss were included as the source terms of the electron energy equation. The electromagnetic field was calculated from the vector potential formulation of ampere's law. The peak electron temperature decreases from about 4eV to 2eV as pressure increases from 5 mTorr to 100 mTorr. The peak density increases with increasing pressure. Electron temperatures at the center of the chamber are almost independent of input power and electron densities linearly increase with power level. The results agree well with theoretical analysis and experimental results. A single turn, edge feeding antenna configuration shows better density uniformity than a four-turn antenna system at relatively low pressure conditions. The thickness of the dielectric window should be minimized to reduce power loss. The equivalent resistance of the system increases with both power and pressure, which reflects the improvement of power transfer efficiency.

NiCr 박막의 어닐링과 열적안정성에 관한 연구 (The Study on Thermal Stability of NiCr Thin-films)

  • 김인성;민복기;송재성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.81-84
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    • 2004
  • The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on coming glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then $10\;ppm/^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

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높은 입력 임피던스를 가지는 테라헤르츠 Yagi-Uda 안테나 (A Terahertz Yagi-Uda Antenna with High Input Impedance)

  • 한경호;;박익모;한해욱
    • 한국광학회지
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    • 제20권2호
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    • pp.65-70
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    • 2009
  • 본 논문에서는 높은 입력 임피던스를 가지는 테라헤르츠 Yagi-Uda 안테나를 제안하였다. 제안된 Yagi-Uda 안테나는 두께가 얇은 기판 위에 설계하여 기판의 비유전율에 의한 안테나의 임피던스 저하를 줄이고 Yagi-Uda 안테나 고유의 복사패턴을 가지도록 하였다. 전 파장 길이를 가지는 U-형태의 다이폴을 driver로 사용하여 공진주파수에서 $4,400{\Omega}$ 정도의 높은 입력저항을 얻을 수 있었다. 따라서 제안된 Yagi-Uda 안테나는 기존의 테라헤르츠 안테나들에 비하여 증가된 테라헤르츠파 출력을 얻을 수 있다.