• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Korean Ceramic Society
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• v.38 no.9
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• pp.799-805
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• 2001

Two commercial alumina powders having different particle size of $0.5{\mu}m$ and 3${\mu}$m were presintered at 1120$^{\circ}$C for 2h and then lanthanum aluminosilicate glass was infiltrated at 1100$^{\circ}$C for up to 4h to obtain the densified glass-alumina composites. The effect of alumina particle size on packing factor, microstructure, wetting, porosity and pore size, and mechanical properties of the composite was investigated. The optimum mechanical properties and compaction behavior were observed for the 3${\mu}$m alumina particle dispersed composite. The 3${\mu}$m alumina particle size and distribution for he preform were within 0.1 to 48${\mu}$m and bimodal and random orientation. The strength and the fracture toughness of the composite having 3${\mu}$m alumina particles were 519MPa and $4.5MPa{\cdot}m^{1/2}$, respectively.

• The Journal of Advanced Prosthodontics
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• v.7 no.3
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• pp.233-239
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• 2015

PURPOSE. This study aimed to evaluate the fit of zirconia ceramics before and after veneering, using 3 different veneering processes (layering, press-over, and CAD-on techniques). MATERIALS AND METHODS. Thirty standardized zirconia CAD/CAM frameworks were constructed and divided into three groups of 10 each. The first group was veneered using the traditional layering technique. Press-over and CAD-on techniques were used to veneer second and third groups. The marginal gap of specimens was measured before and after veneering process at 18 sites on the master die using a digital microscope. Paired t-test was used to evaluate mean marginal gap changes. One-way ANOVA and post hoc tests were also employed for comparison among 3 groups (${\alpha}$=.05). RESULTS. Marginal gap of 3 groups was increased after porcelain veneering. The mean marginal gap values after veneering in the layering group ($63.06{\mu}m$) was higher than press-over ($50.64{\mu}m$) and CAD-on ($51.50{\mu}m$) veneered groups (P<.001). CONCLUSION. Three veneering methods altered the marginal fit of zirconia copings. Conventional layering technique increased the marginal gap of zirconia framework more than pressing and CADon techniques. All ceramic crowns made through three different veneering methods revealed clinically acceptable marginal fit.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.44-51
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• 2016

This paper presents the characteristics of the energy absorption in an expansion tube type impact absorber that is applied to a high weight drop tester and the use of a response surface methodology to predict the impact energy absorption. In order to identify the characteristics of the energy absorption, a set of finite element analysis was conducted with Abaqus Explicit. Moreover, the ISCD-II sampling method and a first order polynomial were used to build a response surface. As a result, we demonstrated that the impact energy could be controlled by four main design variables, namely an expansion pipe's thickness, inner radius, pressing die's expansion angle and expansion ratio. Additionally, we observed the relationship between the four main design variables and the impact energy absorbing time, displacement, and maximum impact force.

• Journal of Powder Materials
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• v.26 no.6
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• pp.508-514
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• 2019

In the development of advanced ceramic tools, material improvements and design freedom are critical in improving tool performance. However, in the die press molding method, many factors limit tool design and make it difficult to develop innovative advanced tools. Ceramic 3D printing facilitates the production of prototype samples for advanced tool development and the creation of complex tooling products. Furthermore, it is possible to respond to mass production requirements by reflecting the needs of the tool industry, which can be characterized by small quantities of various products. However, many problems remain in ensuring the reliability of ceramic tools for industrial use. In this study, alumina inserts, a representative ceramic tool, was manufactured using the digital light process (DLP), a 3D printing method. Alumina inserts prepared by 3D printing are pressurelessly sintered under the same conditions as coupon-type specimens prepared by press molding. After sintering, a hot isostatic pressing (HIP) treatment is performed to investigate the effects of relative density and microstructure changes on hardness and fracture toughness. Alumina inserts prepared by 3D printing show lower relative densities than coupon specimens prepared by powder molding but indicate similar hardness and higher fracture toughness values.

• Journal of Ocean Engineering and Technology
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• v.22 no.6
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• pp.75-82
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• 2008

Flame bending has been extensively used in the shipbuilding industry for hull plate forming In flame bending it is difficult to obtain the desired shape because the residual deformation dependson the complex temperature distribution and the thermal plastic strain. Mechanical bending such as reconfigurable press forming multi-point press forming or die-less forming has been found to improve the automation of hull plateforming because it can more accurately control the desired shape than line heating. Multi-point forming is a process in which external forces are used to form metal work-pieces. Therefore it can be a flexible and efficient forming technique. This paper presents an optimal approach to determining the press-stroke for multi-point press forming of curved shapes. An integrated configuration of Finite element analysis (FEA) and spring-back compensation algorithm is developed to calculate the strokes of the multi-point press. Not only spring-back is modeled by elastic plastic shell elements but also an iterative algorithm to compensate the spring-back is applied to adjust the amount of pressing stroke. An iterative displacement adjustment (IDA) method is applied by integration of the FEA procedure and the spring-back compensation work. Shape deviation between the desired surface and deform￡d plate is minimized by the IDA algorithm.

• Korean Chemical Engineering Research
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• v.57 no.4
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• pp.525-530
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• 2019

The performance and stability of solid oxide fuel cells (SOFCs) depend on the microstructure of the electrode and electrolyte. In anode, porosity and pore distribution affect the active site and fuel gas transfer. In an electrolyte, density and thickness determine the ohmic resistance. To optimizing these conditions, using costly method cannot be a suitable research plan for aiming at commercialization. To solve these drawbacks, we made high performance unit cells with low cost and highly efficient ceramic processes. We selected the NiO-YSZ cermet that is a commercial anode material and used facile methods like die pressing and dip coating process. The porosity of anode was controlled by the amount of carbon black (CB) pore former from 10 wt% to 20 wt% and final sintering temperature from $1350^{\circ}C$ to $1450^{\circ}C$. To achieve a dense thin film electrolyte, the thickness and microstructure of electrolyte were controlled by changing the YSZ loading (vol%) of the slurry from 1 vol% to 5 vol. From results, we achieved the 40% porosity that is well known as an optimum value in Ni-YSZ anode, by adding 15wt% of CB and sintering at $1350^{\circ}C$. YSZ electrolyte thickness was controllable from $2{\mu}m$ to $28{\mu}m$ and dense microstructure is formed at 3vol% of YSZ loading via dip coating process. Finally, a unit cell composed of Ni-YSZ anode with 40% porosity, YSZ electrolyte with a $22{\mu}m$ thickness and LSM-YSZ cathode had a maximum power density of $1.426Wcm^{-2}$ at $800^{\circ}C$.