• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.166-171
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• 2002

The objective of this paper is to investigate the effect of clearance and the configuration of die system on burr formation by FEM analysis and experimental tests. Compared with casting, forging and machining, shearing has been known, especially in heavy or mass-production industries, as a very economical and fast way to obtain the desired shape Recently, the shearing process becomes widely used in the small and light electronic component manufacturing industries. When shearing a part of sheet metal, the burr formed on the cutting edge is usually unavoidable. The burr would not only degrade the precision of products but also causes additional cost for the deburring process. In this paper, the influence of shearing parameters such as clearance and configurations of the lower pad (ejector) on burr formation is investigated by using the experimental and numerical approach. From the experimental results, it has been shown that the more narrow clearance gives the smaller burr height and the higher shearing forces. The removal of lower holder also makes the sheared surface integrity and the dimensional accuracy become worse. The FEM results (using DEFORM-2D) show good agreement with the experimental results.