• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.3
• /
• pp.320-326
• /
• 2017

Multistage deep-drawing technology is used widely in the production of mobile phone battery cases to improve productivity and economy. To ensure adequate capacity and rigidity, such cases are fabricated as a rectangular cup with a high slender ratio. The multistage deep-drawing of a rectangular cup entails a high slender ratio, and the heights of the product sides may be non-uniform because of the complicated deformation mechanisms. This causes problems in product assembly that affects the surface quality of the case. This study examined a blank shape that minimizes the height variations of the product to resolve the aforementioned problems. Optimization design and analysis were performed to identify the shape that yields the least variation. The long and short sides of an oval blank were set as the design variables. The objective function was set to yield the lowest height difference, and the thickness reduction rate of the product was set to the target range. In addition, the height of the final shape was set as a constraint. The height difference was minimized successfully using the optimized design. The design process of the initial blank for all rectangular shapes can be automated in the future.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.1
• /
• pp.31-39
• /
• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Society of Naval Architects of Korea
• /
• v.48 no.6
• /
• pp.528-538
• /
• 2011

As a forming method for curved hull plates more efficient than the flame bending, mechanical bending using multi point press forming and die-less forming is discussed in this paper. the mechanical forming is a flexible manufacturing system for automatically forming of hull parts. It is especially suited to varied curved parts. This paper discusses a multiple point pressing machine composed of a pair of reconfigurable punches in order to achieve the rapid forming of curved hull plates using division forming and presents how forming information is obtained from the given design surface. Although the mechanical forming can be efficient in the metal forming, spring back after pressing is a phenomenon which must be carefully considered when quantifying the process variables. If the spring back is not accurately controlled, the fabricated shell plate cannot meet assembly tolerance. This paper describes the principles to calculate the proper stroke of each punch at the divided areas. the strokes are determined by an iterative process of sequential pressing and spring back compensation from an unfolded flat shape to its given design surface. FEA(finite element analysis) is used to simulate the spring back of the plate and the IDA(iterative displacement adjustment) method adjusts the offset of pressing punches from the deformation results and the design surface. The shape deviations of two surfaces due to spring back are compensated by integrated system using FEA and IDA method. For the practical application, It is aimed to develop an integrated system that can automatically perform the compensation process and calculate strokes of punches of the double sides' reconfigurable multiple-press machine and some experimental results obtained with mechanical bending are presented.