• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.159-162
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• 2008

High pressure is involved during injection molding operation specially packing phase. Cracks in the mold are often occurred by high cavity pressure. In this study, structural analysis of mold has been performed using commercial softwares, Abaqus and Ansys, to investigate cause of crack in the injection mold. Structural analysis contains four cases: stress distribution according to the cavity pressure, stress concentration according to the boundary conditions, stress concentration for inter-locking design of mold, and stress concentration for distributed cavity pressure. Through this study it was observed that the locations of stress concentrations were coincident with locations of crack. Robust mold design is being required to withstand high cavity pressure.

• 소성∙가공
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• 제26권6호
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• pp.372-377
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• 2017

In this paper, an effective design procedure was proposed to design the rib of die structure for auto-body member with ultra-high strength steel (UHSS) having ultimate tensile strength (UTS) of 1.5 GPa. From analysis results of the die structure, structural safety of the die was evaluated with information such as displacement and von-Mises stress. It was concluded that the casting part could be designed in order to reduce tool deformation. A design guideline of the die structure was proposed, especially for the rib structure in the casting part with an optimization scheme and local reinforcement concept. Simulation result following the design guideline fully explained that stability of the tool structure could be obtained simultaneously with weight minimization.

• 소성∙가공
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• 제18권1호
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• pp.13-19
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• 2009

In the recent years, the production of light-weight products has become important because of increasing demands for the energy savings through weight reduction. Therefore the advanced manufacturing technology with Al alloy is continuously required in many industrial fields. Bending characteristics of Al rectangular tube with hollow and solid section has been analyzed by FE analysis in press bending with wing-die. Bending stress is affected by punch stroke and rotation of wing-die. There were different sectional sagging characteristics between the solid rectangle section and the hollow rectangle section.

• 소성∙가공
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• 제3권4호
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• pp.454-467
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• 1994

The drawbead restraining forces for the various radius of drawbead and die corner are analyzed by the belt theory, and they are compared with the experimental results. During this procedure, the drawing angles are also varied from $0^{\circ}$ to $60^{\circ}$, and the near part of the drawed die corner are divided into fur steps for the theoretical analysis. The stress distributions through the sheet thickness for these steps are also suggested theoretically. The wide range of experimental data of the drawing forces and strain distributions for the various dimension and blank holding forces are presented. It is concluded that the theoretical assumption for the restraining force analysis is very useful from the comparison with the experimental results.

• 소성∙가공
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• 제7권4호
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• pp.375-381
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• 1998

This paper presents development of finite element simulation program and analysis of hot extrusion through square dies with a mandrel. The design of extrusion dies is still an art rather than science. Die design for a new extrusion process is developed from through in-plant trials. In the present paper, a three-dimensional steady-state finite element simulation program is developed. Steady-state assumption is used for both the analyses of deformation and temperature. The developed program is effectively used to simulate hollow extrusion of several sections. Distributions of temperature effective strain rate, mean strain rate and mean stress are studied for an effective design of extrusion dies.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 추계학술대회 논문집
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• pp.77-81
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• 2001

The present study is concemed with the design of high pressure container reinforced by winding wire used as a die component in cold forming of metals. The stress analysis for the design of high pressure container has been made under an optimal design criterion. The wire-winding equipment and the tension control unit according to the theoretical winding force are installed. The circumferential stresses at the inner wall of die housing are measured every turn of wire-winding. The measure stresses are in good agreement with the analytically predicted ones.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 소성∙가공
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• 제29권4호
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• pp.203-210
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• 2020

In this study, formability and springback behavior of 1.5 GPa grade ultra-high strength steel (UHSS) sheet were predicted through the finite element simulation, and structural stability of the forming dies was verified by the coupled forming-structural analysis. Uniaxial tension and uniaxial tension-compression tests were performed to obtain experimental data for modeling the springback properties of the sheet material. The springback values predicted by simulation were compared with those from actual measurements. The results calculated from the kinematic hardening model were found to be much more accurate than those from the isotropic hardening model. Deformation of the forming die and springback of the product were calculated by the coupled forming-structural analysis. The higher the strength of the die material, the smaller the surface displacement of the die and the springback of the product. The internal stresses of the dies made of three materials, FC300, FCD550 and STD11 were compared with the yield stress of each material. The results provided a basis for determining the most suitable material for each part of the die set. As a result, simulation techniques have been established for predicting formability and springback in the UHSS sheet forming process.

• 대한치과보철학회지
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• 제41권4호
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• pp.405-420
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• 2003

Purpose : The purpose of this study was to compare the fracture resistance of the IPS Empress ceramic crown with 1.0mm width rounded shoulder, which is usually recommended in all ceramic crown. and 0.5mm width chamfer finish lines on the maxillary central incisor. Material and method : After 15 metal dies were made for each group, the IPS Empress all ceramic crowns were fabricated and cemented with resin cement(Bistite resin cement, Tokuyama Soda Co. LTD., Japan) on the metal die. The cemented crowns were mounted on the positioning jig and the universal testing machine(Zwick Z020, Zwick Co. Germany)was used to measure the fracture strength with loading on the incisal edge. And also, three-dimensional finite element stress analysis was used to measure the stress distribution with the various types of the finish lines(1.0mm width rounded shoulder, 0.5mm width chamfer), the loading site(incisal edge, incisal $\frac{1}{3}$) and the type of loading(concentration loading, distribution loading). Results and conclusion : 1. In the fracture resistance experiment according to the finish line, the mean fracture strength of rounded shoulder(876N) and the mean fracture strength of chamfer(882N) did not skew any significant difference between each other(p>0.05). 2. The stress distribution of all ceramic crown in three dimensional finite element analysis showed concentration aspect at loading point and cervical area or labial surface. 3. In metal die, there were no differences in stress distribution between finish lines, but in natural teeth model, chamfer finish line showed higher stress than rounded shoulder finish line. 4. When force was loaded on the incisal edge the stress was concentrated on the incisal edge and the cervical area of labial surface. When force was loaded on the incisal $\frac{1}{3}$, the stress concentrated on the cervical area of labial surface and the cingulum area. 5. Generally, natural teeth model showed higher and various stress than the metal die.

• Journal of Welding and Joining
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• 제31권6호
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.