• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.96-103
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• 2011

Rotor grip is used as a component of rotor system in unmanned helicopter. Instead of usual machining, hot forging process has been considered to improve its proof stress against repeated loading conditions and crash in the farm-field. Die design and forming analysis have been performed according to the conditions such as billet volume, flash, cavity filling, and the distribution of damage during the forming by using FE analysis. In the results of analysis, the possibility of structural failure in the model has not been found because its maximum effective stress is much lower than yield strength of the titanium alloy. In the forging die design, flash has been allowed because of low production in the industrial field. Preform design was studied by using FE-analysis, and its optimal dimension was obtained in the hot forging of rotor grip with titanium alloy.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.10
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• pp.1877-1889
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• 1992

Upsetting is performed in open-die press forging to deform metal in all directions in order to enhance soundness of a product and reduce directionality of properties caused by casting. It is necessary to ensure sufficient forging ratio for subsequent cogging operations and consolidate the void along the centerline. To obtain these benefits, the upper die shape (dome and dished shape) is considered as an upsetting parameter. Thermo-viscoplastic finite element analysis has been carried out so as to understand the influence of upper die shape on the effective strain, hydrostatic stress and temperature in the upset-forged ingots without internal defects. The analysis is focused on the investigation into internal void closure in ingots with pipe holes and circular voids. The computational results have shown that the volume fraction of the void is independent of the circular void size and the closure of internal voids is much more influenced by the effective strain than the hydrostatic stress around the void. It is finally suggested that the height reduction must be over 35% for consolidation of internal voids.

• Transactions of Materials Processing
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• v.24 no.4
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• pp.234-240
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• 2015

Multi-pass shape drawing is very important to produce steel profiles in round samples. In the current study, a process design system is developed for a multi-pass shape drawing. In general, the number of passes for a multi-pass shape drawing is 2 to 3 when the reduction ratio, drawing stress, and productivity are considered. Therefore, calculating the drawing stress and designing the intermediated die shapes are very important. In order to calculate the drawing stress, a shape drawing load prediction method is proposed using a general axisymmetric drawing load prediction model. An intermediate die shape design method is proposed using the initial and the final product shapes. Based on this analysis, a process design system is developed for multi-pass shape drawing for steel profiles. The system works with AutoCAD. The system was applied to design a shape drawing of a spline.

• Transactions of Materials Processing
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• v.17 no.8
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• pp.570-578
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• 2008

A flexible forming apparatus is composed a number of punches which have spherical pin tip shape instead of conventional solid die. The flexible forming tool consisted of punch array in a matrix form was proposed as an alternative forming method to substitute the conventional line heating method which use heat source to induce residual stress along specified heating lines. In this study, application of the flexible forming process to the small scale curved plate forming was conducted. Numerical simulations for both solid and flexible die forming process were carried out to compare the shape of the products between flexible and conventional die forming process. In addition, spring-back analysis was conducted to figure out the feasibility of the flexible forming process comparing with the die forming process in view of final configuration of the specimens. Moreover, experiment was also carried out to confirm the formability of the process. Consequently, it was confirmed that the flexible die forming method has capability and feasibility to manufacture the curved plates for shipbuilding.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.199-203
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• 2003

Idler of excavator are large product with diameter 500 - 600 mm and parts of a power transmit device. The object of the paper is developed large products by hot closed-die forging. The forging process which is proposed from numerical analysis and various tests is developed a large products with good quality. To estimate the design process parameters such as working load, temperature and flash thickness so on, numerical analysis are used by DEFORM 2D. To obtain a flow stress data and optimal forging temperature is carried out hot compression and tensile test at a various temperature range. Developed product is tested mechanical properties of elongation, hardness and tensile strength so on. Test results are presented excellent mechanical properties.

• Design & Manufacturing
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• v.6 no.1
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Transactions of Materials Processing
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• v.15 no.8 s.89
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• pp.609-614
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• 2006

Micro-alloyed steels(MA steels) for cold forging was developed to replace the usual quenched and tempered steel. MA steels have several advantages over the conventional quenched and tempered carbon steels. First of all, energy consumption could be lowered due to the elimination of spherodizing annealing and quenching/tempering heat treatment. Also, bending during quenching could be avoided when MA steels are applied for manufacturing of long fastener parts. However, larger amount of load is exerted on the dies compared than in the case of conventional mild steels, which might lead to the earlier fracture of dies, when MA forging steels are applied in forging practice. Therefore, die lift could be a critical factor to determine whether HA forging steels could be widely applied in cold forging practice. In the present study, authors have investigated the forging characteristics of non-heat treated micro-alloyed steel by using a series of experimental and numerical analyses. Firstly, microstructural features and its effect on the deformation behavior have been studied. Numerical analysis has been done on the forging of guide rod pin to investigate for the optimization of forging process and die stress prediction.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.848-851
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• 2002

In the field of automobile industry, lightweight problems are very important in terms of reducing fuel and protecting environment. To satisfy these demands, the attempt to substitute aluminum automobile components for cast steel part has been actively carried out. To fabricate the aluminum automobile suspension part that has the same mechanical properties with cast steel part, design conditions such as shape and dimension of part shall be established. Therefore in this study, shape and dimension conditions of suspension part were proposed. Aluminum automobile suspension part was fabricated by semi-solid die-casting process under the obtained design conditions. Moreover to evaluate the possibility of application to the automobile component, stress and fatigue analysis were performed by using ABAQUS S/W and compared with those of conventional automobile suspension part.