• Title/Summary/Keyword: Die Material

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Reheating Process of Extrusion Billet with Large Dimension (대형 압출 빌렛트의 재가열 공정)

  • 배정운;서판기;강충길
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10a
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    • pp.261-264
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    • 2003
  • Semi-solid processing is now becoming of great interest for the production of various parts by pressure die casting. Many advantages are associated with this forming process at the condition that the forming operation is performed under appropriate conditions. The thixoforming process, which needs a suspension of a globular, non-dendritic solid phase in the liquid phase, is characterized by three major steps. The first step is casting of billets with a microstructure suited for thixoforming. The second step is reheating of slugs cut from these billets. The third step is injection of the semi-solid slugs into a die. In this paper, the horizontal reheating machine to obtain the optimal conditions suitable for semiu-solid die casting process was used and applied to extrusion material. It is estimated the possibility of application on semi-solid die casting with extrusion material through various results.

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A Study on the High Temperature Fatigue Behavior of Hot Forging Die STD61 Steel (STD61 열간 금형강의 고온피로거동에 관한 연구)

  • 여은구;이태문;이용신
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.711-714
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    • 2002
  • Although recent research of metallic materials in high temperature fatigue have been much accomplished, many studies about brittle material as a die steel in high temperature fatigue does not have been reported. Especially, the study on the fatigue behavior over the transformation temperature is not studied sufficiently because of its difficult analysis and experiment. Therefore, reliable results of brittle material in high temperature fatigue behavior are needed. In this paper, stress-strain curves and stress-life curves in die STD61 steel at 700 and 900 are carefully examined, as the basic experimental data are used to predict from fatigue life over 700.

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A Study on Characteristics of Die Finishing Using Conductive Elastic Tool (도전성 탄성공구를 이용한 금형연마 특성에 관한 연구)

  • 황찬해;임동재;정해도
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.6
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    • pp.96-102
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    • 2000
  • The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

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Experimental investigation on the flow control in non-axisym- metric flat die extrusion-II (비축대칭 평금형 압출에서 유동제어에 관한 실험적 연구-II)

  • 김영호;배원병;강범수;박재우
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.3
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    • pp.130-136
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    • 1997
  • The velocity distrubution at the exit of extrusion die depends on the width of bearing land very much. When uniform bearing land without flow guide is used, the material which is extended through the same die does not, deflect to the constant direction, but when the flow guide is equipped and then the volume compensation is done accurately, the material deflects to one constant direction. Therfore, the part of problem can be known exactly, and extrusion products of straight shape can be produced by the corrected bearing land width.

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Prediction Methodology for Reliability of Semiconductor Packages

  • Kim, Jin-Young
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.09a
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    • pp.79-94
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    • 2002
  • Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

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An Analysis of Backward Extrusion Process with Torsion (비틀림을 이용한 후방압출 공정의 해석)

  • 허진혁;김영호;박재훈;진영은;이종헌
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.846-849
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    • 2000
  • In this paper backward extrusion process with lower die rotation was studied to improve the conventional backward extrusion problems ; requirement of large forming machine, the difficulty to selecting of die material caused by high surface pressure, high cost of forming machine caused by improvement of noise and vibration, and etc. In this experiment, model material, plasticine, was used of specimen. The result values of torsional and conventional backward extrusions were analyzed and compared. FE-simulation is used for analysis with DEFPRM-3D. These results show that the torsional backward extrusion is very useful process because this process can obtain the homogeneous deformation, low forming load. Decreasing forming load improves die life and makes it possible to use press of relatively low capacity. Also this process can reduce corner cavity, improve the initial cast-structure, owing to the high deformation and uniform starin distribution.

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Fabrication of Gas-permeable Die Materials Having Orthogonally Arrayed Pore Channels

  • Chan, Tien-Yin;Lin, Shun-Tian;Chang, Hua-Jun;Chen, Chia-Liang
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.97-98
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    • 2006
  • Gas-permeable metal die materials are developed using tool steel powder, packed in a mold having the insertion of orthogonally arrayed polymer wires. Linear gas-permeable channels in orthogonal array are thus developed by the burning out of the polymer wires, which yield a microstructure with wear resistance value and air permeability much larger than those of the conventional gas-permeable die material.

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A development of double-moving system for composite die using multi-axis shuttle unit in the sheet metal forming (판재성형 가공에서의 다축 단동 유닛을 이용한 복합금형용 Double-moving System 개발)

  • Kim, Dong-wook;Choi, Kyu-Kwang
    • Design & Manufacturing
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    • v.10 no.2
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    • pp.39-43
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    • 2016
  • Most of automobile parts manufactured through sheet metal forming are mass-produced by using press mold. In recent years, automation and speeding up of press lines have been expanding to maximize product productivity using a press die. The proportion of the moving time in the press line is high, and therefore requires high-speed and automated equipment for the moving process. In this paper, to provide the double-moving system can be the moving time reduction and increased productivity. Developed transport system consists of the material supply, the material feeding device and the PLC controller and the devices are positioned between each of the pressing process. In this paper, the double-moving system including developed units using a multi-axial single-acting through this reduced the C/T(cycle time) and improved the productivity.

Effect of Die Attach Process Variation on LED Device Thermal Resistance Property (Die attach 공정조건에 따른 LED 소자의 열 저항 특성 변화)

  • Song, Hye-Jeong;Cho, Hyun-Min;Lee, Seung-Ik;Lee, Cheol-Kyun;Shin, Mu-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.390-391
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    • 2007
  • LED Packaging 과정 중 Die bond 재료로 Silver epoxy를 사용하여 Packaging 한 후 T3Ster 장비로 열 저항 값(Rth)을 측정하였다. Silver epoxy 의 접착 두께를 조절하여 열 저항 값을 측정하였고, 열전도도 값이 다른 Silver epoxy를 사용하여 열 저항 값을 측정하였다. Silver epoxy 접착 두께가 충분하여 Chip 전면에 고루 분포되었을 경우 그렇지 않은 경우보다 평균 4.8K/W 낮은 13.23K/W의 열 저항 값을 나타내었고, 열전도도가 높은 Silver epoxy 일수록 열전도도가 낮은 재료보다 평균 4.1K/W 낮은 12K/W의 열 저항 값을 나타내었다.

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The Prediction of Interfacial Heat Transfer Coefficient According to Contact Time and Pressure in Forging and Casting Die Materials for the Hot Press Forming (핫프레스포밍용 주조, 단조 금형에 대한 시간과 압력에 따른 대류열전달계수의 예측)

  • Kim, N.H.;Kang, C.G.
    • Transactions of Materials Processing
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    • v.19 no.6
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    • pp.378-386
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    • 2010
  • Nowadays there has been great interest in using heat treated cast material for press dies due to several advantages like reduction in die production costs. However, in hot press forming processes H13 forged tool steel is mostly used. Cooling performance of dies in hot press forming processes is considered as an important factor of study and also the IHTC parameter between cast material die and sheet metal should be considered as an essential. In the present study, the IHTC was calculated for the sheet metal in the hot press forming process with cast and forged material dies. The temperature measurements were performed for the sheet metal, casting and forged material dies by applying various contact pressure in hot press forming. IHTC was calculated and studied by adopting the inverse heat convection method in DEFORM-2D. Each IHTC was considered as a function of contact time and contact pressure. The experimental data were compared with calculated data obtained from the proposed equation and references.