• Transactions of Materials Processing
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• v.9 no.5
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• pp.533-538
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• 2000

This study has been carried out to develop a CRT die using hot forging. The conventional CRT die made by casting has defects such as void and inclusion. These defects of the cast die make micro-spots on the surface of the CRT which affect the quality of the final product. So, a hot forging process is developed to avoid these defects of CRT die by the model material test and the rigid-plastic FEM. Firstly, model material tests are carried out with plasticine billets in order to investigate the material flow pattern in the die cavity and to get the reasonable initial values for designing the preform in the FE simulation. And then a finite element analysis has been performed to Predict the preform and the forging load of a CRT die. We also suggest an integrated die-set which combines two die-sets into one die-set to save manufacturing time and cost in case of similar die-size.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.23-29
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• 2013

Recent advances in printing technology have increased the productivity of the roll-to-roll (R2R) printing process for printed circuitry. In the R2R printed electronics, characteristics of printed and coated layers are one of the most important issues that determine the functional quality of final products. The slot-die technology can coat a large area with high uniformity using low-viscosity materials; determining the process parameters is important to obtain excellent coating qualities. In this study, a viscocapillary model was used to predict qualities of coated layers and patterns. On the basis of analysis results, a novel meta model was derived using design of experiment methodology to improve accuracy. Sensitivity analysis was performed to define major parameters in R2R slot-die coating process. The coating speed was found to most significantly affect the coated layer thickness and was easily controlled. The performance of the proposed model is verified through experimental studies. Based on the statistical analysis results, R2R slot die process can be optimized to guarantee a desired thickness.

• Transactions of Materials Processing
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• v.18 no.7
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• pp.556-564
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• 2009

Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.06a
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• pp.29-33
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• 2000

OKUMA Die/Mold manufacturing system provides high speed, high rigidity and heavy cutting in a compact machining center and CAD/CAM system.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.249-254
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• 2000

The contact forces between die components for the drawing of large size automotive panels introduce elastic deflections of the die components. Due to the deflections, the gap between blank holder and die varies locally resulting in nonuniform material flow. Such a nonuniform die gap usually requires correcting operation, so called die spotting, which is time consuming trial and error process. To reduce the die spotting time, the optimization of the blank holder bending deflection is needed. In this paper, we implemented an analysis procedure to predict the blank holder deflection. The analysis procedure and design of experiments techniques are applied to the optimization of balance block heights. The optimization results can be used as guidelines in actual die spotting process.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.341-346
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• 2002

The production part requiring multiple processes such as piecing, blanking and notching are performed with a high production rates in progressive die. In order to prevent the defects of process result, the optimum of strip process layout design, die design, die making, and tryout with inspection etc. are needed. According to these factors of die development process, they required theory and practice of metal working process and its background, die structure, machining conditions for die making, die materials, heat treatment of die components, know-how and so on. In this study, we designed and analyzed die components also simulated the strip process layout of multiple stage drawing by DEFORM. Especially the result of tryout and its analysis become to the feature of this study.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.347-352
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• 2002

The Cut off-type progressive die for U-bending production part is a very specific division. This study reveals the sheet metal forming process with multi-forming die by Center Carrier type feeding system. Through the FEM simulation by DEFORM, it was accepted to u-bending process as the first performance to design of strip process layout. The next process of die development was studied according to sequence of die development, i.e. die structure, machining condition for die making, die materials, heat treatment of die components, know-how and so on. The feature of this study is the die development of scrapless progressive die of multi-stage through the Modeling on the I-DEAS program, components drawing on the Auto-Lisp, CAD/CAM application, ordinary machine tool operating and revision by tryout.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.147-154
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• 1995

In this paper, a computer-aided design system for axisymmetric deep drawing process will be described. An approach to the system is based on the knowledge based system. The system has been written in AutoLISP with personal computer. The system is composed of four main modules, such as input , geometrical design, test & rectification and user modification . The system which aids designer provides powerful capabilities for the design of axisymmetric deep drawing process.