• 한국기계가공학회지
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• 제7권3호
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• pp.47-49
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• 2008

The brake pipe is important part in automobile. The brake pipe have to prevent crack, fracture and defects for braking in safety. Especially, shape of ends of pipe has influence on ability of brake. Based on the procedure of process design, in this paper, the forming operation is designed by finite element method. Design variable and response value was selected shape of die and damage factor. To improve die that performed FEM and compared results of two types of die.

• 소성∙가공
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• 제7권3호
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• pp.282-290
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• 1998

In bulk metal forming processes prediction of tool life is very important for saving production cost and achieving good material properties. Generally the service life of tools in metal forming process is limited to a large extent by wear, fracture and plastic deformation of tools. In case of hot and warm forging processes tool life depends on wear over 70%. In this study finite element analyses are con-ducted to warm and hot forging by adopting suggested wear model. By comparison of simulation and eal profile of die suggested wear model. By comparison of simulation and real profile of die suggested model is verified.

• 열처리공학회지
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• 제15권3호
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• pp.136-141
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• 2002

During warm and hot forging process of steels or aluminum alloys, dies are subject to early fracture, severe wear by thermo-mechanical stress. Especially, during the die-casting of aluminum alloys, the service life of dies is incredibly lowered. In this study we investigated the characteristics of TiBN films produced by PECVD. TiBN films showed very high hardness, excellent wear resistance, which could enhance the service life of die parts such as forging punch, die casting core pin successfully.

• 한국생산제조학회지
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• 제5권1호
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• pp.43-50
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• 1996

From a manufacturing standpoint it would be desirable to monitor the degradation of drawing die, that is essential for the maintenance of die quality, the evaluation of product integrity and the reducing scrap. Acoustic emission is powerful method in monitoring fine wire drawing process, especially in detecting the die fracture at early stage. Experiments also suggested that acoustic emission sigals contained valuable information regarding the stage of a drawing process such as the surface appearance of products and the condition of lubrication. These informations are AE monitoring techniques a possible tool in monitoring the drawing process operation. In order to approach this, this paper discusses the nature of acoustic emission signal presented which illustrate the effects of wire and die material, lubricants, and drawing speed on the generation and the mean voltage level of acoustic emission signal. From these experimental, results, we understanded controlling factors of acoustic emission generation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1998년도 춘계학술대회논문집
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• pp.94-99
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• 1998

In bulk metal forming processes prediction of tool life is very important for saving production cost and achieving good material properties. Generally the service life of tools in metal forming process is limited to a large extent by wear, fracture and plastic deformation of tools. In case of hot and warm forging processes, tool life depends on wear over 70%. In this study finite element analyses are applied to warm forging and hot forging by adopting suggested wear model. By comparision of simulation and real profile of die, suggested model is verified

• 한국정밀공학회지
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• 제13권8호
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• pp.80-87
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• 1996

The present paper will give some results of the fatigue behavior of typical axi-symmetric forward extrusion die. The extrusion process is analyzed by rigid-plastic FEM and the deformation analysis of extrusion die is conducted by elasto-plastic FEM. To approach the crack problem LEFM (Linear Elastic Fracture Mechanics) is introduced. Using special element in order to conside the sigularity of stress/ strain in the vicinity of the crack tip, stress intensity factor and the effective stress intensity factor is calculated. Applying proper fatigue crack propagation criterion such as Paris/Erdogan fatigue law and maximum principal criterion to these data, then, the angle and the direction of fatigue crack propagation is simulated. In result, it is proved that the simulated fatigue crack propagates in the zigzag path along the radial direction and fatigue life of the extrusion die is evaluated by using the computed crack growth rate.

• 소성∙가공
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• 제6권4호
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• pp.346-356
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• 1997

The fiber orientation distribution and interface bonding in hot extrusion process have an effect on the maechanical properties of metal matrix composites(MMC's). Aluminium alloy matrix composites reinforced with alumina short fibers are fabricated by compocasting method. MMC's billets are extruded at high temperature through conical and curved shaped dies with various extrusion ratios and temperature. This present study was directed to describe the systematic correlation between extrusion die shape and subsequent results such as fiber breakage, fiber orientation and tensile strength to hot extruded MMC's billet. Extrusion load, tensile strength and hardness for variation of extrusion ratios and temperature are investigated to examine mechanical properties of extruded MMC's SEM fractographs of tensile specimens are observed to analyze the fracture mechanism.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• 한국정밀공학회지
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• 제18권3호
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• pp.182-188
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• 2001

An experiment is carried out to investigate the characteristics of blanking for copper alloy C194 (t=0.254mm), a kind of IC lead frame material. By varying clearance between die and punch, the shapes of shear profile are examined. Finite element analysis with element deletion algorithm for ductile fracture mode is also carried out to study the effect of clearance theoretically and to compare with experimental results. The rectangular shape specimen with four different corner radius is used to study the characteristics of blanking for straight side and corner region simultaneously. As the result, the ratios measured from the experiment of roll over, burnish, and fracture zone based on intial blank thickness are compared with those of FE analysis. Both experiment and FE analysis show that the amount of roll over and fracture is increased as the clearance increases. It has been found that larger clearance is required than that of straight region when the radius of corner is less than thickness of blank, in order to maintain same quality of shear profile at the corner region.

• Journal of Welding and Joining
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• 제31권6호
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.