• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 1994.10b
• /
• pp.9-9
• /
• 1994

• Journal of the korean Society of Automotive Engineers
• /
• v.12 no.2
• /
• pp.59-70
• /
• 1990

Crack of breaking toughness of most Ceramics material is 1-5MPa .root.m but that of Zirconia Ceramics is improved to be 6-8MPa .root.m and its development of machining difficult-to-machine material is on the rise as urgent subject. For general Zirconia Ceramics machining, diamond grinding wheel is generally used by selecting an appropriate one and establishing grinding condition but due to such limitations as economics, grinding efficiency and machining geometry, great interest in machining method being used for diamond tool is emphasized. But it is reported that diamond tool is oxidized by cutting heat in the air and is graphitized in vacuum, which causes bad effects on tool life. In this study, to restraint cutting heat the internal side of tool is cooled, and restraint low temperature cooling system and being experimented. Further, the machinability of diamond tool for Zirconia Ceramics machining is analyzed with respect to tool wear and stress.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.10
• /
• pp.195-201
• /
• 2002

This paper deals with the precision grinding for aspherical surface of optical parts. A parallel grinding method using the spherical wheel was suggested as a new grinding method. In this method, the wheel axis is positioned at a $\pi$/4 from the Z-axis in the direction of the X-axis. An advantage of this grinding method is that the wheel used in grinding achieves its maximum area, reducing wheel wear and improving the accuracy of the ground mirror surface. In addition, a truing by the CG (curve generating) method was proposed. After truing, the shape of spherical wheel transcribed on the carbon is measured by the Form-Talysurf-120L. The error of the form in the spherical wheel which is the value ${\Delta}x$ and $R{^2}{_y}$ inferred from the measured profile data is compensated by the re-truing. Finally, in the aspherical grinding experiment, the WC of the molding die was examined by the parallel grinding method using the resin bonded diamond wheel with a grain size of ＃3000. A form accuracy of 0.16${\mu}m$ P-V and a surface roughness of 0.0067${\mu}m$ Ra have been resulted.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.42-45
• /
• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.10a
• /
• pp.61-64
• /
• 1995

Grinding has been adapted as a finishing process,which can carry out form and surface integrity at the same time. Recently, high efficient and precise grinding technique is required bacause the needs for functional parts such as silicon wafer,ceramic,and electric materials are increasing. Accordingly, the development of grinding wheel appropriate to that purpose is very important. So, in this paper we newly developed a diamond grinding wheel by applying the superior characteristics of spheroidal graphite of the cast iron sintered product. Especially, a electric resistance sintering method was applied in which rapid heat treatment is possible. Finally, we have achieved successful results that the grinding wheel has high hardness,durability and grinding ability,and satisfies above conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.787-792
• /
• 2000

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and the material removal are measured and discussed. The results are as follows.

• Tribology and Lubricants
• /
• v.24 no.6
• /
• pp.332-337
• /
• 2008

This paper presents the surface defect analysis based on the experimental investigation of scribed glasses. The scribing process by a diamond wheel cutter is widely used as a reliable and inexpensive method for sizing of glass sheets. The wheel cutter generates a small median crack on the glass surface, which is then propagated through the glass thickness for complete separation. The surface contour patterns in which are formed during a scribing process are strongly related to wheel cutter parameters such as wheel tip surface finish, tip angle and wheel diameter, and cutting process parameters such as scribing pressure, speed and tooling technique. The scribed surface of a glass sheet provides normal Wallner lines, which represent regular median cracks and crack propagation in glass thickness, and abnormal surface roughness patterns. In this experimental study, normal and abnormal surface topographic patterns are classified based on the surface defect profiles of scribed glass sheets. A normal surface of a scribed glass sheet shows regular Wallner lines with deep median cracks. But some specimens of scribed glass sheets show that abnormal surface profiles of glass sheets in two pieces are represented by a chipping, irregular surface cracks in depth, edge cracks, and combined crack defects. These surface crack patterns are strongly related to easy breakage of the scribed glass imposed by external forces. Thus the scribed glass with abnormal crack patterns should be removed during a quality control process based on the surface defect classification method as demonstrated in this study.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.537-542
• /
• 2004

Machinble Ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. Lapping used diamond slurry and lapping by in-process electrolytic dressing is developed to solve this problem. On this paper, a comparative study of processing ability of lapping used diamond slurry and lapping by in-process electrolytic dressing.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.19 no.3
• /
• pp.105-110
• /
• 2020

Alumina, a typical ceramic material used for semiconductors and display parts, is the subject of research and development efforts for mineral material processing. Alumina is extremely difficult to process since it is brittleness to either fine ceramics material. We have studied the shape of diamond particles and their use in machinability for alumina processing. Our study was carried out under various processing conditions, including cutting speed, table speed, and the surface roughness of the work piece. We also analyzed the wear characteristics of the tool by total cutting.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.9
• /
• pp.18-24
• /
• 2001