• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.881-882
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• 2006

In 1997, Dr. James Chien-Min Sung patented the technology of making diamond tools according to a predetermined pattern. The optimization of this pattern may double the tool life and the cutting speed. In 1998, Sung also made $DiaGrid^{(R)}$ saw segments that showed superior performance in cutting granite and marble. In 2000, Sung visited Shinhan and introduced them this revolutionary concept of diamond saw segments. In 2005, Shinhan adapted the idea and produced saw segments with diamond grits set in a predetermined pattern, their results confirmed that the sawing speed and the sawing life were both improved over conventional designs.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.228-233
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• 2007

An experimental and numerical approach has been carried out to characterize the noise and the safety of circular diamond saw with chinks by laser-cutting. The sound pressure level of a circular diamond saw with chinks was measured when cutting workpieces. Therefore, frequency analysis results show us that the sound level was reduced as position of chinks approach to out-diameter. But the safety of circular diamond saw was lower due to the stress concentrated at the edge of chinks while cutting workpieces. FEM analysis was used for safety evaluation with the variation position of chinks. The noise characteristics of circular diamond saw were also estimated during cutting test.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.5
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• pp.171-174
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• 2016

The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ($(CH_3)_4NOH$, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.

• Journal of Powder Materials
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• v.10 no.3
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• pp.201-208
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• 2003

Distributions of diamond particles protruding on the surface of worn diamond segments in circular saw has been investigated. Scanning electron microscope was used to examine the worn ,surface and radial saw blade wear and grinding ratio was measured. The number of protruded diamond particle was approximately 50% of the total number of particles, and that was independent of diamond particle concentration and table speed. It was also noted that the inter-particle distance did not follow a symmetric function like Gaussian distribution function, instead it fitted well with a probability density function based on gamma function. The distribution of inter-particle spacing, therefore, was analyzed using a gamma function model.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1059-1060
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• 2013

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1997.04a
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• pp.242-246
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• 1997

Diamond grit was coated with Ti by RF Sputtering to investigate the effect of coated diamond particles on performance of diamond impregnated saw. Coated and uncoated powders were separately mixed with 70Co-30W(wt %) powders by conventional milling technique. Hot pressing was carried out to make specimens. The wear test were carried out with these two types of diamond impregnated specimens. It was demonstrated that Ti coating was effective in improving the ability of grit retention and thus enhanced the tribological performance of diamond tool.

• Tribology and Lubricants
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• v.13 no.3
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• pp.102-107
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• 1997

Diamond grit was coated with Ti by RF Sputtering to investigate the effect of coated diamond particles on performance of diamond impregnated saw. Coated and uncoated powders were separately mixed with 70Co-30W powders by conventional milling technique. Hot pressing was carried out to make specimens. The wear test were carried out with these two types of diamond impregnated specimens. It was demonstrated that Ti coating was effective in improving the ability of grit retention and thus enhanced the tribological performance of diamond tool.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1140-1141
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• 2006

Diamond tools with several layers of diamond grits through thickness direction were tested by sawing. The saw blades with evenly distributed grits showed better cutting performance compared to the random distributed saw. At a given concentration of grits, as the spacing between layers was increased, the cutting performance was improved, and as decreased, it showed more tool life

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.560-565
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• 2005

The objective of this paper is to decide optimal of the slot angle to minimize stress concentration in rotating disc of diamond saw. The fracture phenomena of the slot are discussed by the theoretical and experimental approaches and then some recommendation are presented to prevent the fracture. The focus of this investigation is to evaluation the effect of the slot on stress distribution using optimum design technique and finite element method(FEM) analysis. Stress concentration of the slot with respect to the various parameter of the slot such position, size, number, rotation speed. From the experimental results, when the slot angle of diamond saw is located $8^{\circ}\~12^{\circ}$ from rotating direction, the maximum equivalent stress reduces.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.83-90
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• 2018

This paper introduces a innovative diamond wire saw cutting technology and its experimental verification that can be utilized for cutting heavy structures. While conventional diamond wire saw cutting technologies such as water cooled cutting method and dry cutting method cause severe environmental problems due to generating massive concrete sludge or dust scattering, the proposed method can eliminate those problems considerably. Through extensive experiments using heavy structure test bed and real bridge pier structure, comprehensive analysis and comparative evaluation about various cutting methods were performed. As a result, the innovative diamond wire saw cutting method could achieve a similar cutting and cooling performance to the water cooled cutting method without generating concrete sludge and it showed an improved cutting and cooling performance to the dry cutting method without dust scattering. Consequently it is confirmed that the suggested cutting technology can be a promising environment-friendly alternative in the field of heavy structure dismantling.