• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.308-313
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• 2002

In order to investigate the characteristics of grinding and diamond wheel grinding ceramic materials, grinding resistance, surface roughness of worked surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of A1$_2$O$_3$, cutting edge ratio is begger than that of ZrO$_2$and Si$_3$N$_4$. That's because A1$_2$O$_3$has a characteristics of low fracture toughness and bending stress.

• 한국공작기계학회논문집
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• 제13권1호
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• pp.16-21
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• 2004

In order to investigate the characteristics of diamond wheel grinding of ceramic materials, grinding resistance, surface roughness of ground surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of $Al_2O_3$, cutting edge ratio is bigger than that of $ZrO_2$ and $Si_3N_4$. That's because $Al_2O_3$ has a characteristic of low fracture toughness and bending stress.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.315-320
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• 2001

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel and Resinoid-bond CBN wheel. For various condition of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and material removal are measured and discussed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.344-348
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness after using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreases. For the case of vitrified bond wheel, cutting edge ratio does not change.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.76-81
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• 1995

MgO single crystal is widely used as a the material of high temperature resistance, but is difficult to grind because of brittleness and crack generation. Therefore, superabrasive diamond wheel is required for mirror like grinding of this material. This study describes a newly proposed optimum in-process electrolytic dressing system for carrying out effective dressing of superbrasive diamond wheel. Using this system the grinding surface of MgO single crystal was improved, the grinding force was very l9ow and crack was removed. In conclusion, this system is good to obtain the efficient grinding and mirror-like grinding without crack of MgO single crystal.

• 한국기계가공학회지
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• 제19권3호
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• pp.105-110
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• 2020

Alumina, a typical ceramic material used for semiconductors and display parts, is the subject of research and development efforts for mineral material processing. Alumina is extremely difficult to process since it is brittleness to either fine ceramics material. We have studied the shape of diamond particles and their use in machinability for alumina processing. Our study was carried out under various processing conditions, including cutting speed, table speed, and the surface roughness of the work piece. We also analyzed the wear characteristics of the tool by total cutting.

• Journal of Mechanical Science and Technology
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• 제16권5호
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• pp.633-638
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• 2002

An approach to enhance dimensional accuracy of the grinding process has been presented, and grinding of a glass material with a metal-bonded diamond wheel has been studied. In this study, a grinding tool is suspended flexibly and controlled by an electromagnetic actuator. During grinding, profile error of a ground surface is indirectly measured and fed back to a control system. A model of grinding error has been suggested on which the indirect measurement has been based. An optimal PID control is adopted and effectiveness of the in-process feedback control has been verified experimentally.

• 한국정밀공학회지
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• 제17권5호
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• pp.131-136
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• 2000

This paper is concerned with the surface roughness and the bending strength of ground workpiece in ZrO2 ceramic grinding. Surface roughness was measured with surface tracer and bending strength value was obtained by three-point bending test on machining center using tool dynamometer. Grinding experiments were carried out to examine the effects of grinding conditions including diamond mesh size, table speed, and depth of cut on ground surface roughness. The correlation between surface roughness and bending strength was also inspected. The experimental results indicate that the rougher surface is produced as the mesh size of diamond wheel is reduced and table speed is increased, but surface roughness is not affected by depth of cut. The values of bending strength decrease as the values of Ra, Rmax and Ku increase.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.