• 소성∙가공
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• 제15권7호
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• pp.518-523
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• 2006

Wet wire drawing of brass coated steel wire, used for tire reinforcement, is realized with Tungsten Carbide(WC) dies sintered with a cobalt(Co) binder. Dies wear represents an important limitation to the production process and cost savings. Several parameters, such as Co content, WC grain size of tungsten carbide, sintering conditions, and so on, affect on the wear of the drawing die. In this study, the effect of the diamond abrasive particle size on the life of the WC centered dies of the wet wire drawing was investigated. Wet wire drawing experiments were carried out on a wet wire drawing machine. From the experiments, the dies life, dies fracture, wire surface roughness, and wire breaks were investigated. From the results, it was found that the wear of the WC dies increased with the increase in the diamond abrasive particle size.

• 한국정밀공학회지
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• 제25권9호
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.

• 한국분말재료학회지
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• 제16권6호
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• 한국표면공학회지
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• 제28권4호
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• pp.225-235
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• 1995

To investigate the effects of pretreatment and substrate bias on the characteristics of the diamond thin films, the thin films were deposited on the p-type Si(100) wafer by MPECVD using mixtures of $H_2$, $CH_4$, and $O_2$ gases. Deposition was carried out at the substrate temperature of $900^{\circ}C$ and at the pressure of 40torr. The effect of the pretreatment on the film formation was the examined by using SiC and diamond powders as abrasive powders. Furthermore, the substrate bias effect on the formation of the diamond film was also examined. The highest nucleation density was observed for the pretreatment with 40~60$\mu\textrm{m}$ size of diamond powders and a negative bias potential(-50V). Many defects and(111) twins in the diamond films were observed.

• 한국정밀공학회지
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• 제18권9호
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• pp.165-170
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• 2001

In normal grinding abrasive particles of a grinding wheel rotate on planes parallel to the direction of workpiece fred. which may induce continued scratch lines on ground surface as the workpiece feeds. Instead in helical scan grinding the planes make an angle, called a helical angle, with the feeding direction. Thus scratch lines produced by abrasive particles per one revolution are discontinued which implies that the generation of scratch lines are suppressed by the helical scan grinding. In this study some experimental works have been done on the helical scan grinding of glass to find the effects of grinding conditions on the surface roughness and estimate the optimal grinding conditions. The helical angle, fred rate, material removal rate and the wheel speed are taken as factors for three kinds of grinding wheels i.e., coarse(#140 mesh), medium(#400) and fine(#800) diamond wheels. The experiments are scheduled by Taguchi technique and ANOVA has been carried out for the interpretation of the results. As a result of this study effects of the factors are verified quantitatively showing that the major factors are changed according to the wheel's mesh size and the helical angle is one of the influencing factors on the surface quality.

• 한국공작기계학회논문집
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• 제12권4호
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• pp.9-16
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• 2003

In this study, the decision of dressing time for diamond wheel was analyzed by observing with acoustic emission signals and surface roughness, and also obtained the machining characteristics by weibull distribution plot for the values of bending strength. From the experimental study, it was possible to predict the time of re-dressing for the diamond grinding wheel with the analysis of acoustic emission signals and surface roughness values, and following conclusions were obtained. The root-mem-square values of acoustic emission signals were obtained low as the increased of table speed for different abrasive grain size. This is caused by the lack of grinding power which is not able to get rid of all real grinding mass of depth as the table speed is increased. The values of bending strength for ground $Si_3 N_4$ specimens were decreased for gain size of #400 than that of #60, but it was found that the surface roughness values for gain size of #60 were better than that of #400. As compared the shape parameter of weibull distribution plot for the values of bending strength, it was found that the reliability of bending strength for grain size of #60 increased than that of #400.

• 대한금속재료학회지
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• 제49권7호
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• pp.522-529
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• 2011

Carbon fiber reinforced plastics (CFRP), which have been developed for their high mechanical properties, are insufficient to secure machinery. This paper investigates the use of magnetic abrasive finishing methods and the characteristics of surface roughness for mirror machining of CFRP. The cylindrical surface of CFRP was ground using a diamond paste with sizes of 0.1, 0.5, 1 and 6${\mu}m$. Consequently, an effective surface roughness of 0.03${\mu}m(R_a)$ could be obtained via a paste size of 0.5${\mu}m$. The surface roughness was not improved due to epoxy abrasion between the carbon fiber and the epoxy.

• 한국정밀공학회지
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• 제33권5호
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• pp.385-392
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• 2016

Recently in the display industry, demands for high-luminance and resolution of display devices have been steadily increasing. Generally, micro linear patterns are applied to an optical film in order to improve its properties of light. However, these patterns are easily viewed to eyes and moire phenomenon can be occurred. Micro random patterns are proposed as a method to solve these problems, increasing light-luminance and light-diffusion. However, conventional pattern manufacturing technologies have long processing times and high costs making it difficult to apply to large area molds. In order to combat this issue, micro-random patterns are formed by using a roll to plate indentation method along with abrasive paper tools composed of AlSiO2, SiC, and diamond grains. Also, forming properties, such as size and fill-factor of random patterns, are analyzed depending on type, mesh of abrasive paper tools, and indentation forces.

• Advances in materials Research
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• 제1권2호
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• pp.129-146
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• 2012

Polycrystalline diamond is an ideal material for parts with micro-holes and has been widely used as dies and cutting tools in automotive, aerospace and woodworking industries due to its superior wear and corrosion resistance. In this research paper, the modeling and simultaneous optimization of multiple performance characteristics such as material removal rate and surface roughness of polycrystalline diamond (PCD) with ultrasonic machining process has been presented. The fuzzy logic and taguchi's quality loss function has been used. In recent years, fuzzy logic has been used in manufacturing engineering for modeling and monitoring. Also the effect of controllable machining parameters like type of abrasive slurry, their size and concentration, nature of tool material and the power rating of the machine has been determined by applying the single objective and multi-objective optimization techniques. The analysis of results has been done using the MATLAB 7.5 software and results obtained are validated by conducting the confirmation experiments. The results show the considerable improvement in S/N ratio as compared to initial cutting conditions. The surface roughness of machined surface has been measured by using the Perthometer (M4Pi, Mahr Germany).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1992년도 추계학술대회 논문집
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• pp.136-144
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• 1992

Recently, Silicon Nitrde ceramic is regarded as the representative engineering ceramic with the excellent mechanical properties and many functions for mechanical components and parts among various kinds of ceramics in the mechanical industry. But, during the manufacturing of engineering ceramics, there is many volumetric shrinkage coupled with a distortion of the parts which is produced. Due to the requirement for high accuracy of size, form, and surface finish of the components, machining is needed surely. Nowdays, grinding with a resin bond type diamond wheels has been generally applied to machining of the engineering ceramics in the whole world because that it can be conveniently proceeded for workers to dress of tool and made with high reliability in producing factories among many bond type super-abrasive wheels yet. It is important task for attaining prescribed mechanical components with high reliability to observe the grinding mechanism of ceramics as like generation of cracks and chipping of material during process. Because they considerably effects on the strength characteristic of machined mechanical components. In this study, various surface grinding experiments using resin bond type diamond wheels are carried out for Silicon Nitride ceramic. Grinding mechanism of ceramics is observed experimentally and the relationship with various conditions is also attained. Form this experimental study, some useful machining data and information to determine proper machining condition for grinding of Silicon Nitride ceramic is obtained.