• Title/Summary/Keyword: Deposition tunnel

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A Study on the Temperature Distribution Change of the Spent Nuclear Fuel Disposal Canister and its Surrounding Structures due to the Spent Fuel Heat according to the Deposition Time Elapse (고준위폐기물 열에 의한 처분용기 및 처분용기 주위 구조물의 시간경과에 따른 온도분포 변화)

  • Choi, Jong-Won;Kwon, Young-Joo
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.20 no.2
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    • pp.157-164
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    • 2007
  • The prediction of the temperature distribution change of the spent nuclear fuel disposal canister and its surrounding structures (bentonite buffer, granitic rock etc.) due to the spent fuel heat is very important for the design of the 500m deep granitic repository for the spent nuclear fuel disposal canister (about 10,000 years long) deposition. In this study, the temperature distribution change of the composite structure which comprises the canister, the bentonite buffer, the deposition tunnel due to the spent fuel heat is computed using the numerical analysis method. Specially, the temperature distribution change of the composite structure is analysed as the deposition time elapses up to m years. The analysis result shows that the temperature of each part of the repository increases slowly in different way but the latest part temperature increases slowly up to 150 years and thereafter decreases slowly.

Wave Drag Reduction due to Repetitive Laser Pulses (반복 레이저 펄스를 이용한 초음속 비행체의 항력저감)

  • Kim, Jae-Hyung;Sasoh, Akihiro;Kim, Heuy-Dong
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2011.04a
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    • pp.381-384
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    • 2011
  • Wave drag reduction due to the repetitive laser induced energy deposition over a flat-nosed cylinder is experimentally conducted in this study. Irradiated laser pulses are focused by a convex lens installed in side of the in-draft wind tunnel of Mach 1.94. The maximum frequency of the energy deposition is limited up to 80. Time-averaged drag force is measured using a low friction piston which was backed by a load cell in a cavity as a controlled pressure. Stagnation pressure history, which is measured at the nose of the model, is synchronized with corresponding sequential schlieren images. With cylinder model, amount of drag reduction is linearly increased with input laser power. The power gain only depends upon the pulse energy. A drag reduction about 21% which corresponds to power gain of energy deposition of approximately 10 was obtained.

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Fabrication and characterization of $WSi_2$ nanocrystals memory device with $SiO_2$ / $HfO_2$ / $Al_2O_3$ tunnel layer

  • Lee, Hyo-Jun;Lee, Dong-Uk;Kim, Eun-Kyu;Son, Jung-Woo;Cho, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.134-134
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    • 2011
  • High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.

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A Study on the Binary Appearance in Pseudo limestone Cavern (이차원의 위종유동에 관한 동굴미지형학적 연구 -천연기염물 236호로 지정된 황금굴을 중심으로-)

  • 한국동굴학회
    • Journal of the Speleological Society of Korea
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    • no.66
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    • pp.45-57
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    • 2005
  • This Paper is a study on the duality of speleothem that appeared in 'Hyeob Jae Cave' which is designated as the natural monumen. No.236. It is located at Hyeob Jae Ri, Hanrim Eub, Bug Je-ju Gun, Je-judo. The findings are as follows. 1. The distribution range of the shelly sand which has maximum thickness of $10m{\pm}$ and average of $3m{\pm}$ was $3.2m^2$. 2. The desert hollow acted to promote the speleothem deposits in the lava tunnel with lava mound formed by lavapilz and artificial breaksand wall. 3. The main component of the pseudo limestone cavern was carbonate Calcium from shelly sand. And the deposition of speleothem in the Cave was accelerated after the volcanic erupsion of Biyang island in 1002. A.D. 4. The secondary depositions of Calcite recognized as speleothem up to now it can be used for the pseudo karst in general. 5. It seems that the variety of the cave deposits is decided depending upon the geology, land form, climate, vegetations and the structural environmental factors. 6. It seems that the wondering development of accretionary deposits caused by encrusting has a close relation with intermittent seepage of ground water. 7. Finally, we can acknowledge the coexistent duality of speleothem by shelly sand along with the joint and the lava stalactites formed at the same time with the lava tunnel on the ceiling where there was no seepage.

Thermal-mechanical sensitivity analysis for the near-field of HLW repository (고준위 폐기물 처분장 near-field에 대한 열-역학적 민감도 분석)

  • 권상기;최종원;강철형
    • Tunnel and Underground Space
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    • v.13 no.2
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    • pp.138-152
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    • 2003
  • Three-dimensional computer modeling using FLAC3D had been carried out fur evaluating the thermal-mechanical stability of a high-level radioactive waste repository excavated in several hundred deep location. For effective modeling, a FISH program was made and the geological conditions and rock properties achieved from the drilling sites in Kosung and Yusung areas were used. Sensitivity analysis fer the stresses and temperatures from the modeling designed utilizing fractional factorial design was carried out. From the sensitivity analysis, the important design parameters and their interactions could be determined. From this study, it was found that deposition hole spacing is the most important parameter on the thermal and mechanical stability. The second and third most important parameters were disposal tunnel and buffer thickness.

Electrical characteristics of high-k stack layered tunnel barriers with Post-Rapid thermal Annealing (PRA) for nonvolatile memory application

  • Hwang, Yeong-Hyeon;Yu, Hui-Uk;Son, Jeong-U;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.186-186
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    • 2010
  • 소자의 축소화에 따라 floating gate 형의 flash 메모리 소자는 얇은 게이트 절연막 등의 이유로, 이웃 셀 간의 커플링 및 게이트 누설 전류와 같은 문제점을 지니고 있다. 이러한 문제점을 극복하기 위해 charge trap flash 메모리 (CTF) 소자가 연구되고 있지만, CTF 메모리 소자는 쓰기/지우기 속도와 데이터 보존 성능간의 trade-off 관계와 같은 문제점을 지니고 있다. 최근, 이를 극복하기 위한 방안으로, 다른 유전율을 갖는 유전체들을 적층시킨 터널 절연막을 이용한 Tunnel Barrier Engineered (TBE) 기술이 주목 받고 있다. 따라서, 본 논문에서는 TBE 기술을 적용한 MIS-capacitor를 높은 유전율을 가지는 Al2O3와 HfO2를 이용하여 제작하였다. 이를 위해 먼저 Si 기판 위에 Al2O3 /HfO2 /Al2O3 (AHA)를 Atomic Layer Deposition (ALD) 방법으로 약 2/1/3 nm의 두께를 가지도록 증착 하였고, Aluminum을 150 nm 증착 하여 게이트 전극으로 이용하였다. Capacitance-Voltage와 Current-Voltage 특성을 측정, 분석함으로써, AHA 구조를 가지는 터널 절연막의 전기적인 특성을 확인 하였다. 또한, high-k 물질을 이용한 터널 절연막을 급속 열처리 공정 (Rapid Thermal Annealing-RTA) 과 H2/N2분위기에서 후속열처리 공정 (Post-RTA)을 통하여 전기적인 특성을 개선 시켰다. 적층된 터널 절연막은 열처리를 통해 터널링 전류의 민감도의 향상과 함께 누설전류가 감소됨으로서 우수한 전기적인 특성이 나타남을 확인하였으며, 적층된 터널 절연막 구조와 적절한 열처리를 이용하여 빠른 쓰기/지우기 속도와 전기적인 특성이 향상된 비휘발성 메모리 소자를 기대할 수 있다.

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Electrical Properties of Molecular Diode Using Eicosanoic Acid Langmuir-Blodgett(LB) Monolayer Film (Eicosanoic Acid Langmuir-Blodgett(LB) 박막을 이용한 분자 다이오드의 전기적 특성)

  • Koo, Ja-Ryong;Lee, Ho-Sik;Kwon, Hyuck-Joo;Sohn, Byoung-Chung
    • Journal of the Korean Applied Science and Technology
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    • v.20 no.2
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    • pp.148-153
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    • 2003
  • Electron transfer through an Langmuir-Blodgett(LB) monolayer film sandwiched between metal electrodes. We used an eicosanoic acid material and the material was very famous as a thin film insulating material. Eicosanoic acid monolayer was deposited by Langmuir-Blodgett(LB) technique and a subphase was a $CdCl_2$ solution as a 2${\times}10^{-4}$ mol/L. Also we used a bottom electrode as an Al/$Al_2O_3$ and a top electrode as a Al and Ti/Al. Here, the $Al_2O_3$ on the bottom electrode was deposited by thermal evaporation method. The $Al_2O_3$ layer was acted on a tunneling barrier and insulating layer in tunnel diode. It was found that the proper transfer surface pressure for film deposition was 25 mN/m and the limiting area per molecule was about 24 ${\AA}^2$/molecule. When the positive and negative bias applied to the molecular device, the behavior shows that a tunnel switching characteristics. This result were analyzed regarding various mechanisms.

Electrical characteristic of stacked $SiO_2/ZrO_2$ for nonvolatile memory application as gate dielectric (비휘발성 메모리 적용을 위한 $SiO_2/ZrO_2$ 다층 유전막의 전기적 특성)

  • Park, Goon-Ho;Kim, Kwan-Su;Oh, Jun-Seok;Jung, Jong-Wan;Cho, Won-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.134-135
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    • 2008
  • Ultra-thin $SiO_2/ZrO_2$ dielectrics were deposited by atomic layer chemical vapor deposition (ALCVD) method for non-volatile memory application. Metal-oxide-semiconductor (MOS) capacitors were fabricated by stacking ultra-thin $SiO_2$ and $ZrO_2$ dielectrics. It is found that the tunneling current through the stacked dielectric at the high voltage is lager than that through the conventional silicon oxide barrier. On the other hand, the tunneling leakage current at low voltages is suppressed. Therefore, the use of ultra-thin $SiO_2/ZrO_2$ dielectrics as a tunneling barrier is promising for the future high integrated non-volatile memory.

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Comparison of Tunneling Characteristics in the MTJs of CoFeB/MgO/CoFeB with Lower and Higher Tunneling Magnetoresistance

  • Choi, G.M.;Shin, K.H.;Seo, S.A.;Lim, W.C.;Lee, T.D.
    • Journal of Magnetics
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    • v.14 no.1
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    • pp.11-14
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    • 2009
  • We investigated the I-V curves and differential tunneling conductance of two, CoFeB/MgO/CoFeB-based, magnetic tunnel junctions (MTJs): one with a low tunneling magnetoresistance (TMR; 22%) and the other with a high TMR (352%). This huge TMR difference was achieved by different MgO sputter conditions rather than by different annealing or deposition temperature. In addition to the TMR difference, the junction resistances were much higher in the low-TMR MTJ than in the high-TMR MTJ. The low-TMR MTJ showed a clear parabolic behavior in the dI/dV-V curve. This high resistance and parabolic behavior were well explained by the Simmons' simple barrier model. However, the tunneling properties of the high-TMR MTJ could not be explained by this model. The characteristic tunneling properties of the high-TMR MTJ were a relatively low junction resistance, a linear relation in the I-V curve, and conduction dips in the differential tunneling conductance. We explained these features by applying the coherent tunneling model.

Employing Al Etch Stop Layer for Nb-based SNS Josephson Junction Fabrication Process (Al 식각정지층을 이용한 Nb-based SNS 조셉슨 접합의 제조공정)

  • Choi, J.S.;Park, J.H.;Song, W.;Chong, Y.
    • Progress in Superconductivity
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    • v.12 no.2
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    • pp.114-117
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    • 2011
  • We report our efforts on the development of Nb-based non-hysteretic Josephson junction fabrication process for quantu device applications. By adopting and modifying the existing Nb-aluminum oxide tunnel junction process, we develop a process for non-hysteretic Josephson junction circuits using metal-silicide as metallic barrier material. We use sputter deposition of Nb and $MoSi_2$, PECVD deposition of silicon oxide as insulator material, and ICP-RIE for metal and oxide etch. The advantage of the metal-silicide barrier in the Nb junction process is that it can be etched in $SF_6$ RIE together with Nb electrode. In order to define a junction area precisely and uniformly, end-point detection for the RIE process is critical. In this paper, we employed thin Al layer for the etch stop, and optimized the etch condition. We have successfully demonstrated that the etch stop properties of the inserted Al layer give a uniform etch profile and a precise thickness control of the base electrode in Nb trilayer junctions.