• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.407-410
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• 2003

We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

• Composites Research
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• v.35 no.3
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• pp.121-126
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• 2022

Owing to advantages of polymeric materials for hydrogen tank liner like light-weight property and high specific strength, polymer based composites have gained much attention. Despite of many benefits, polymeric materials for fuel cell tank cause problems which is critical to applications as low gas barrier property, and poor processability when adding fillers. For these reasons, improving gas barrier property of polymer composites is required to study for expanding application fields. This work presents impermeable polymer nanocomposites by introducing thin barrier coating using layer by layer (LBL) deposition method. Also, bi-layered and quad-layered nanocomposites were fabricated and compared for identifying relationship between deposition step and gas barrier property. Reduction in gas permeability was observed without interrupting mechanical property and processability. It is discussed that proper coating conditions were suggested when different coating materials and deposition steps were applied. We investigated morphology, gas barrier property and mechanical properties of fabricated nanocomposites by FE-SEM, Oxygen permeation analyzer, UTM, respectively. In addition, we revealed the mechanism of barrier performance of LBL coating using materials which have high aspect ratio.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.69-76
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• 1993

The statistical methodology using RSM (response surface method) was used too ptimize the deposition conditions of selective CVD tungsten process for improving the deposition rate and the adhesion property. Temperature, flow rate of SiH$_4$ and WF$_6$ and H$_2$ and Ar carrier gases were chosen for the deposition variables and process characteristics due to carrier gas were intensively investigated. It was observed that temperature was the main factor influencingthe deposition rate in the case of H$_2$ carrier gas while the reactant ratio, $SiH_{4}/WF_{6}$, had the principal effect on the deposition rate in the case of Ar carrier gas. The increased deposition rate and the good adhesion to Si were obtained under Ar carrier gas compared to H$_2$ carrier gas. The optimum conditions for deposition rate and antipeeling property were found to be the temperature range of 300~32$0^{\circ}C$ and the reactant ratio, $SiH_{4}/WF_{6}$, of 0.5~0.6.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.2
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• pp.641-648
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• 1996

Thermophoretic particle deposition on a circular cylinder in a uniform laminar air flow was numerically investigated using a control volume method based on the generalized non-orthogonal coordinate system. Variation of air properties due to the change of temperature was taken into account. Effects of variable property on the distribution of heat transfer and deposition rates of particle were discussed. A new correlation of thermophoretic particle deposition on a circular cylinder was proposed in the present study.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.2
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• pp.250-256
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• 2014

In this study, we deposited and investigated ${\mu}c$-Si:H thin films prepared by Plasma Enhanced Chemical Vapor Deposition(PECVD) system. To deposition silicon thin films, we controlled $SiH_4$ gas concentration, RF input power, and heater temperature. According to the experiments, the more $SiH_4$ gas concentration increased, deposition rate also increased but crystalline property decreased at the same conditions. In the RF input power case, deposition rate and crystalline property increased together when the input power increased from 100[W] to 300[W]. If RF input power was 300[W], deposition rate has reached saturation point. In the heater temperature, deposition rate increased when heater temperature increased. Crystalline property maintained a certain level until heater temperature was $250[^{\circ}C]$. And then it was a suddenly increased. Multistep method has been proposed to improve the quality of ${\mu}c$-Si:H thin film. $SiH_4$ gas was injected with a time interval. According to the experiments, crystallite ratio improve about 20~60[%] and photo conductivity increased up to six times.

• Journal of Powder Materials
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• v.21 no.6
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• pp.434-440
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• 2014

Silicon carbide(SiC) layer is particularly important tri-isotropic (TRISO) coating layers because it acts as a miniature pressure vessel and a diffusion barrier to gaseous and metallic fission products in the TRISO coated particle. The high temperature deposition of SiC layer normally performed at $1500-1650^{\circ}C$ has a negative effect on the property of IPyC layer by increasing its anisotropy. To investigate the feasibility of lower temperature SiC deposition, the influence of deposition temperature on the property of SiC layer are examined in this study. While the SiC layer coated at $1500^{\circ}C$ obtains nearly stoichiometric composition, the composition of the SiC layer coated at $1300-1400^{\circ}C$ shows discrepancy from stoichiometric ratio(1:1). $3-7{\mu}m$ grain size of SiC layer coated at $1500^{\circ}C$ is decreased to sub-micrometer (< $1{\mu}m$) $-2{\mu}m$ grain size when coated at $1400^{\circ}C$, and further decreased to nano grain size when coated at $1300-1350^{\circ}C$. Moreover, the high density of SiC layer (${\geq}3.19g/cm^3$) which is easily obtained at $1500^{\circ}C$ coating is difficult to achieve at lower temperature owing to nano size pores. the density is remarkably decreased with decreasing SiC deposition temperature.

• Journal of Electrical Engineering and Technology
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• v.1 no.1
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• pp.98-100
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• 2006

ZnO thin films were deposited at different repetition rates of 5 Hz and 10 Hz by pulsed laser deposition. X-ray diffraction (XRD) full widths at half maximum (FWHMs) of (002) ZnO peak in ZnO thin film deposited at 5 Hz and 10 Hz was 0.22 and $0.26^{\circ}$, respectively. The grain size of ZnO thin film deposited at 5 Hz was larger than that of 10 Hz. The variation of repetition rates did not have an effect on the optical property of ZnO thin films. The degradation of the crystalline quality and surface morphology in ZnO thin film deposited at 10 Hz resulted from supersaturation effect by decrease of time interval between a ZnO particle arriving on a substrate by laser shot and a ZnO particle arriving on a substrate by next laser shot.

• Korean Journal of Materials Research
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• v.27 no.2
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• pp.69-75
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• 2017

To establish low-temperature process conditions, process-property correlation has been investigated for Ga-doped ZnO (GZO) thin films deposited by pulsed DC magnetron sputtering. Thickness of GZO films and deposition temperature were varied from 50 to 500 nm and from room temperature to $250^{\circ}C$, respectively. Electrical properties of the GZO films initially improved with increase of temperature to $150^{\circ}C$, but deteriorated subsequently with further increase of the temperature. At lower temperatures, the electrical properties improved with increasing thickness; however, at higher temperatures, increasing thickness resulted in deteriorated electrical properties. Such changes in electrical properties were correlated to the microstructural evolution, which is dependent on the deposition temperature and the film thickness. While the GZO films had c-axis preferred orientation due to preferred nucleation, structural disordering with increasing deposition temperature and film thickness promoted grain growth with a-axis orientation. Consequently, it was possible to obtain a good electrical property at relatively low deposition temperature with small thickness.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.3
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• pp.472-476
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• 2007

In this study, we investigated methods for p-type ZnO deposition as well as stability enhancement of its properties. The film was prepared by co-depositing AlAs and ZnO in a RF magnetron sputtering system. Property variation was monitored with photoluminescence and Hall measurements by stressing the films at $250^{\circ}C$ for various duration upto 144 hours. Results indicated that co-deposition is a useful method for p-type ZnO preparation. In particular, pre-treatment in 30% $H_2O_2$ for 1min was observed to be effective in reducing the property variation taking place during the subsequent high temperature processes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.55-56
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• 2005

The properties of phosphorus doped ZnO thin films deposited on (001) sapphire substrates by pulsed laser deposition (PLD) were investigated depending on various deposition conditions. The phosphorus (P) doped ZnO target was composed of ZnO + x wt% Al (x=1, 3, 5). The structural, electrical and optical properties of the ZnO thin films were measured by X-ray diffraction (XRD), Hall measurements and photoluminescence (PL). As the deposition temperature optimized, the electrical properties of the phosphorus doped ZnO (ZnO:P) layer showed a electron concentration of $7.76\times10^{16}/cm^3$, a mobility of 10.225 $cm^2/Vs$, a resistivity of 7.932 $\Omega$cm. It was observed the electrical property of the film was changed by dopant activation effect as target variations and deposition conditions.