• Geomechanics and Engineering
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• v.33 no.4
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• pp.341-352
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• 2023

Long-short pile composite foundations bear both vertical and horizontal loads in many engineering applications. This study used indoor model tests to determine the horizontal bearing mechanism of a composite foundation with long and short piles under horizontal loads. A custom experimental device was developed to prevent excessive eccentricity of the vertical loading device caused by the horizontal displacement. ABAQUS software was used to analyze the influence of the load size and cushion thickness on the horizontal bearing mechanism. The results reveal that a large vertical load leads to soil densification and increases the horizontal bearing capacity of the composite foundation. The magnitude of the horizontal displacement of the pile and the horizontal load borne by the pile are related to the piles' positions. Due to different pile lengths, the long piles exhibit long pile effects and experience bending deformation, whereas the short piles rotate around a point (0.2 L from the pile bottom) as the horizontal load increases. Selecting a larger cushion thickness significantly improves the horizontal load sharing capacity of the soil and reduces the horizontal displacement of the pile top.

• Journal of Powder Materials
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• v.16 no.6
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• pp.442-448
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• 2009

$ZrB_2$-based composites are candidate materials for ultra-high temperature materials (UHTMs). $ZrB_2$ has become an indispensable ingredient in UHTMs, due to its high melting temperature, relatively low density, and excellent resistance to thermal shock or oxidation. $ZrB_2$ powders are usually synthesized by solid state reactions such as carbothermal, borothermal, or combined carbothermal reaction. SiC is added to this system in order to enhance the oxidation resistance of $ZrB_2$. In this study, $ZrB_2$?based composites were successfully synthesized and densified through two different processing paths. $ZrB_2$ or $ZrB_2$ 25 vol.%SiC was fully synthesized from oxide starting materials with reducing agents after heat treatment at 1400$^{\circ}C$. Besides, $ZrB_2$?20 vol.%SiC was fully densified with $B_4C$ as a sintering additive after hot pressing at 1900$^{\circ}C$. The synthesis mechanism and the effect of sintering additives on densification of $ZrB_2$ ?SiC composites were also discussed.

• Proceedings of the Korean Geotechical Society Conference
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• 2000.03b
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• pp.441-448
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• 2000

While the Grouting has been used to reinforce the foundation of structures in wide range of application, there need complementary measures against problems such as pollution, durability, influence on the adjacent structures. Compaction Grouting, the injection of a very stiff, 'zero-slump' mortar grout under relatively high pressure, displaces and compacts soils. It can effectively repair natural or man-made soil strength deficiencies in variety of soil formations. In this paper, on the basis of the case history constructed in this year, a study has been performed to analyze the basic mechanism of the Compaction Grouting, Also, the effectiveness of the ground improvement and the bearing capacity of the Compaction Pile has been verified by the S.P.T and core strength.

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.157-163
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• 1993

Hot pressing after cold cyclic compaction of Al2O3 powder mixtures containing SiC whiskers or Al2O3 short fibers is studied with emphasis on the effects of cold cyclic compaction. The green density of the mixtures increases as the cycle number increases and the cyclic pressure becomes higher. The higher green density is also obtained by cold cyclic compaction with the lower pressrue than a single stroke cold compaction. To achieve a higher densification during hot pressing, cold cyclic compaction before hot pressing is more efficient compared to the conventional hot pressing process (without cold cyclic compaction). Moreover, a low cyclic pressure did not affect on toughening mechanism by whisker reinforcement.

• Journal of Powder Materials
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• v.1 no.1
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• pp.79-84
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• 1994

The mechanism of activated sintering of tungsten powder was discussed in terms of diffusion and segregation of activator atoms at W grain boundaries. Shrinkage behaviours of W-0.2wt.% Ni, W-0.2wt.% Cu or pure W powder compacts during sintering at low temperatures of 900~ $1200^{\circ}C$ were investigated. It was found that the Cu additive inhibits sintering process causing lower densification than pure W compact while remarkable shrinkage occurred in the Ni added W powder. Such contrary effect was explained by comparing self diffusion processes along Ni or Cu segregated W boundaries in which Ni segregants enhance but Cu atoms retard the migration of W atoms at W boundaries.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• Journal of Powder Materials
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• v.7 no.2
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• pp.93-101
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• 2000

In order to clarify the enhanced sintering behavior of nanostructured(NS) W-Cu powder prepared by mechaincal alloying, the sintering behavior during heating stage was analysed by a dilatometry with various heating rates. The sintering of NS W-Cu powders was characterized by the densification of two stages, having two peaks in shrinkage rate curves. The temperature at which the first peak appear was much lower than Cu melting point, and dependent on heating rate. On the basis of the shrinkage rate curves and the microstructural observation, the coupling effect of nanocrystalline W-grain growth and the liquid-like behavior of Cu phase was suggested as a possible mechanism for the enhanced sintering of NS W-Cu powder in the state.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.750-751
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• 2006

We investigated the mechanism how the high green density can be provided during die lubricated warm compaction (WD). We observed and analyzed the densification processes of iron powders including different contents of an inner lubricant, and measured the lateral pressure at the die wall during WD in comparison with conventional compaction and warm compaction. As a result, the high density in WD was due to not only the particles-deformation enhanced by warming powders but also the particles-rearrangement promoted by reducing an amount of the inner lubricant rather than the die lubrication.

• Journal of the Korean Ceramic Society
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• v.26 no.2
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• pp.228-234
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• 1989

Pressureless-sintering of SiC with additions of yttria and alumina was studied. SiC could be densified to about 97% of its theoretical density at 185$0^{\circ}C$ which is about 20$0^{\circ}C$ below the normal sintering temperature of SiC with boron and carbon. Yttria and alumina formed intergranular liquid phases at the sintering temperature and promoted densification by the liquid phase sintering mechanism. The microstructure of sintered specimens was equiaxed and the liquid phase appeared to wet and dissolve SiC grains. The fracture toughness was measured by indentation method and found to be 5.3MPa.m1/2. Processing flaws near the surface of specimens appeared to be the major fracture origin during 3-point bending tests.

• 전기의세계
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• v.28 no.9
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• pp.43-50
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• 1979

Silicon nitride films were chemically deposited on silicon substrates by reacting SiCl$_{4}$ and NH$_{3}$ in a nitrogen atmosphere at 700~1100 .deg.C. The deposition rate increased rapidly with deposition temperature upto about 1000 .deg.C, and became less temperature dependent above this temperature. The etch rate of films in buffered HF solution decreased, with an increase of deposition temperature, and a heat treatment at a temperature higher than that of the deposition considerably reduced the etch rate. It indicates that the heat treatment resulted in a densification of the films. Surface charge density of 3~4 * 10$^{11}$ /cm$^{2}$ was determined from the C-V characteristics of MNS diode, and it was also found that surface charge density depended on deposition temperature, but not film thickness. The current-voltage characteristics displayed a logI-V$^{1}$2/ dependence in the temperature range of 300~500.deg.K. Measurement of the slope of this characteristics and its dependence on temperature and bias polarity suggest that conduction in sili con nitride films arises from the Poole-Frenkel mechanism.