• Title/Summary/Keyword: Delay Spacer

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Vibration Simulation Using LuGre Friction Model for Cladding Tube Fretting Wear Analysis (피복관 프레팅마모 해석을 위한 LuGre 마찰모델 성능 고찰)

  • Park, Nam-Gyu;Kim, Jin-Seon;Kim, Joong-Jin;Kim, Jae-Ik
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.26 no.1
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    • pp.55-62
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    • 2016
  • Nuclear fuels are always exposed to hot temperature and high speed coolant flow during the reactor operation. Thus the fuel rod accompanies small amplitude vibration due to the turbulent flow. The random vibration causes friction between the fuel rod and the grid structure which provides the lateral supports. The friction is critical to the fuel rod fretting wear, and it degrades fuel performance when a severe wear is developed. LuGre friction model is introduced in the paper, and the performance was evaluated comparing to the classical Coulomb model. It is shown that the developed friction force considering the Coulomb friction is not enough to stop or delay the motion while the stick-slip can be simulated using LuGre friction model. Numerical solutions of the two dimensional spacer grid cell model with the modern friction are also reviewed, and it is discussed that the new friction model simulates well the nonlinear mechanism.

Device and Circuit Performance Issues with Deeply Scaled High-K MOS Transistors

  • Rao, V. Ramgopal;Mohapatra, Nihar R.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.1
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    • pp.52-62
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    • 2004
  • In this paper we look at the effect of Fringe-Enhanced-Barrier-lowering (FEBL) for high-K dielectric MOSFETs and the dependence of FEBL on various technological parameters (spacer dielectrics, overlap length, dielectric stack, S/D junction depth and dielectric thickness). We show that FEBL needs to be contained in order to maintain the performance advantage with scaled high-K dielectric MOSFETs. The degradation in high-K dielectric MOSFETs is also identified as due to the additional coupling between the drain-to-source that occurs through the gate insulator, when the gate dielectric constant is significantly higher than the silicon dielectric constant. The technology parameters required to minimize the coupling through the high-K dielectric are identified. It is also shown that gate dielectric stack with a low-K material as bottom layer (very thin $SiO_2$ or oxy-nitride) will be helpful in minimizing FEBL. The circuit performance issues with high-K MOS transistors are also analyzed in this paper. An optimum range of values for the dielectric constant has been identified from the delay and the energy dissipation point of view. The dependence of the optimum K for different technology generations has been discussed. Circuit models for the parasitic capacitances in high-K transistors, by incorporating the fringing effects, have been presented.

Sub-10 nm Ge/GaAs Heterojunction-Based Tunneling Field-Effect Transistor with Vertical Tunneling Operation for Ultra-Low-Power Applications

  • Yoon, Young Jun;Seo, Jae Hwa;Cho, Seongjae;Kwon, Hyuck-In;Lee, Jung-Hee;Kang, In Man
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.172-178
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    • 2016
  • In this paper, we propose a sub-10 nm Ge/GaAs heterojunction-based tunneling field-effect transistor (TFET) with vertical band-to-band tunneling (BBT) operation for ultra-low-power (LP) applications. We design a stack structure that is based on the Ge/GaAs heterojunction to realize the vertical BBT operation. The use of vertical BBT operations in devices results in excellent subthreshold characteristics with a reduction in the drain-induced barrier thinning (DIBT) phenomenon. The proposed device with a channel length ($L_{ch}$) of 5 nm exhibits outstanding LP performance with a subthreshold swing (S) of 29.1 mV/dec and an off-state current ($I_{off}$) of $1.12{\times}10^{-11}A/{\mu}m$. In addition, the use of the highk spacer dielectric $HfO_2$ improves the on-state current ($I_{on}$) with an intrinsic delay time (${\tau}$) because of a higher fringing field. We demonstrate a sub-10 nm LP switching device that realizes a good S and lower $I_{off}$ at a lower supply voltage ($V_{DD}$) of 0.2 V.