• 제목/요약/키워드: Defects Pattern

검색결과 432건 처리시간 0.026초

자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발 (The Development of Pattern Classification for Inner Defects in Semiconductor Packages by Self-Organizing Map)

  • 김재열;윤성운;김훈조;김창현;양동조;송경석
    • 한국공작기계학회논문집
    • /
    • 제12권2호
    • /
    • pp.65-70
    • /
    • 2003
  • In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

A Study on the Pattern Recognition Rate of Partial Discharge in GIS using an Artificial Neural Network

  • Kang Yoon-Sik;Lee Chang-Joon;Kang Won-Jong;Lee Hee-Cheol;Park Jong-Wha
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • 제5C권2호
    • /
    • pp.63-66
    • /
    • 2005
  • This paper describes analysis and pattern recognition techniques for Partial Discharge(PD) signals in Gas Insulated Switchgears (GIS). Detection of PD signals is one of the most important factors in the predictive maintenance of GIS. One of the methods of detection is electro magnetic wave detection within the Ultra High Frequency (UHF) band (300MHz $\~$ 3GHz). In this paper, PD activity simulation is generated using three types of artificial defects, which were detected by a UHF PD sensor installed in the GIS. The detected PD signals were performed on three-dimensional phi-q-n analysis. Finally, parameters were calculated and an Artificial Neural Network (ANN) was applied for PD pattern recognition. As a result, it was possible to discriminate and classify the defects.

패턴이 있는 TFT-LCD 패널의 결함검사를 위하여 근접패턴비교와 경계확장 알고리즘을 이용한 자동광학검사기(AOI) 개발 (Development of AOI(Automatic Optical Inspection) System for Defect Inspection of Patterned TFT-LCD Panels Using Adjacent Pattern Comparison and Border Expansion Algorithms)

  • 강성범;이명선;박희재
    • 제어로봇시스템학회논문지
    • /
    • 제14권5호
    • /
    • pp.444-452
    • /
    • 2008
  • This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects in Semiconductor Packages)

  • 김재열;윤성운;한재호;김창현;양동조;송경석
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2002년도 추계학술대회 논문집
    • /
    • pp.345-350
    • /
    • 2002
  • In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

  • PDF

Study on the Self Diagnostic Monitoring System for an Air-Operated Valve : Algorithm for Diagnosing Defects

  • Kim Wooshik;Chai Jangbom;Choi Hyunwoo
    • Nuclear Engineering and Technology
    • /
    • 제36권3호
    • /
    • pp.219-228
    • /
    • 2004
  • [1] and [2] present an approach to diagnosing possible defects in the mechanical systems of a nuclear power plant. In this paper, by using a fault library as a database and training data, we develop a diagnostic algorithm 1) to decide whether an Air Operated Valve system is sound or not and 2) to identify the defect from which an Air-Operated Valve system suffers, if any. This algorithm is composed of three stages: a neural net stage, a non-neural net stage, and an integration stage. The neural net stage is a simple perceptron, a pattern-recognition module, using a neural net. The non-neural net stage is a simple pattern-matching algorithm, which translates the degree of matching into a corresponding number. The integration stage collects each output and makes a decision. We present a simulation result and confirm that the developed algorithm works accurately, if the input matches one in the database.

반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects In Semiconductor Packages)

  • 김재열;김창현;윤성운
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2005년도 추계학술대회 논문집
    • /
    • pp.721-726
    • /
    • 2005
  • In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

  • PDF

신경회로망을 이용한 레이저 용접 내부결함 모니터링 방법 (Monotoring Secheme of Laser Welding Interior Defects Using Neural Network)

  • 손중수;이경돈;박상봉
    • 한국레이저가공학회지
    • /
    • 제2권3호
    • /
    • pp.19-31
    • /
    • 1999
  • This paper introduces the monitoring scheme of laser welding quality using neural network. The developed monitoring scheme detects light signal emitting from plasma formed above the weld pool with optic sensor and DSP-based signal processor, and analyzes to give a guidance about the weld quality. It can automatically detect defects of laser weld and further give an information about what kind of defects it is, specially partial penetration and porosity among the interior defects. Those could be detected only by naked eyes or X-ray after welding, which needs more processes and costs in mass production. The monitoring scheme extracts four feature vectors from signal processing results of optical measuring data. In order to classify pattern for extracted feature vectors and to decide defects, it uses single-layer neural network with perceptron learning. The monitoring result using only the first feature vector shows confidence rate in recognition of 90%($\pm$5) and decides whether normal status or defects status in real time.

  • PDF

VISUALIZATION OF INTERNAL DEFECTS IN PLATE-TYPE NUCLEAR FUEL BY USING NONCONTACT OPTICAL INTERFEROMETRY

  • Park, Seung-Kyu;Park, Nak-Gyu;Baik, Sung-Hoon;Kang, Young-June
    • Nuclear Engineering and Technology
    • /
    • 제45권3호
    • /
    • pp.361-366
    • /
    • 2013
  • An imaging technique to visualize the internal defects in a plate-type nuclear fuel specimen was developed by using an active optical interferometer for a nondestructive quality inspection. A periodic thermal wave having a sinusoidal intensity pattern induced a periodical strain variation for the specimen. The varying strain image was acquired using an optical laser interferometer. The strain distribution over the internal defects will be distorted in an acquired strain image because a part of the thermal wave will be reflected from these defects during propagation. In this paper, internal defects were efficiently visualized by sequentially accumulating the extracted defect components. The experimental results confirmed that the developed visualization system can be a valuable tool to detect the internal defects in plate-type nuclear fuel.

An Analysis of the Partial Discharge Pattern Related to the Artificial Defects Introduced at the Interface in an XLPE Cable Joint using a Laboratory Model

  • Lee, Jeon-Seon;Koo, Ja-Yoon
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • 제2C권5호
    • /
    • pp.239-245
    • /
    • 2002
  • In this work, in order to realize the possible defects at the cable joint interface, four different types of artificial defects are provided : conducting, insulating substances, void and scratches. The analysis related to the PD patterns has been performed by means of conventional Phase Resolved Partial Discharge Analysis (PRPDA) and Chaotic Analysis of Partial Discharge (CAPD) as well which was proposed by our previous communication. As a result, it could be pointed out that each defect has shown particular characteristics in its pattern respectively and that the nature of defect causing partial discharge could be identified more distinctively when the CAPD is combined with the conventional statistic method, PRPDA.

Digital shearography를 이용한 내부결함 검출에 있어서 전단량과 내부압력 변화에 따른 간섭줄무늬 패턴 분석 (The analysis of interferometry fringe pattern under shearing quantity and inside pressure change for inspect inside defects using by digital shearography)

  • 김형택;김경석;홍진후;강기수
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2001년도 춘계학술대회 논문집
    • /
    • pp.140-143
    • /
    • 2001
  • Digital shearography, a speckle pattern method is based on the superposition of two laterally sheared images. Therefore, object points which are positioned in some distance from each other are superposed in the image plane. This shearography, one of NDT methods without contact, is able to inspect defects in pipelines and pressure vessels that are used in nuclear power plants. This is can inspect whole fields and has a low sensitivity to environmental noise. Because optical setting is very simple, it has a little exhaustion of time, cost and man power. And also it can find a defect position through real time monitoring of a part. This paper, finds out the relationship among shearing quantity image quality and defect size with this method.

  • PDF