• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12A
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• pp.1922-1931
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• 1999

A multicast traffic’s feature is the function of providing a point to multipoints cell transmission, which is emerging from the main function of ATM switch. However, when a conventional point-to-point switch executes a multicast function, the excess load is occurred because unicast cell as well as multicast cell passed the copy network. Additionally, due to the excess load, multicast cells collide with other cells in a switch. Thus a deadlock that losses cells raises, extremely diminishes the performance of switch. An input queued switch also has a defect of the HOL (Head of Line) blocking that less lessens the performance of the switch. In the proposed multicast switch, we use shared memory switch to reduce HOL blocking and deadlock. In order to decrease switch’s complexity and cell's processing time, to improve a throughput, we utilize the method that routes a cell on a separated paths by traffic pattern and the scheduling algorithm that processes a maximum 2N cell at once in the control part. Besides, when cells is congested at an output port, a cell loss probability increases. Thus we use the Output Memory (OM) to reduce the cell loss probability. And we make use of the method that stores the assigned memory (UM, MM) with a cell by a traffic pattern and clears the cell of the Output memory after a fixed saving time to improve the memory utilization rate. The performance of the proposed switch is executed and compared with the conventional policy under the burst traffic condition through both the analysis based on Markov chain and simulation.

• Clinical and Experimental Pediatrics
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• v.50 no.7
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• pp.665-671
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• 2007

Purpose : The purpose of this study was to investigate the clinical features and outcome in newborns undergoing cardiac surgery. Methods : Eighty two neonates underwent heart surgery for congenital heart defect at Kyungpook National University Hospital between March 2000 and February 2006. Patient characteristics (sex, age, diagnosis), pre-operative conditions, operation type, postoperative complications and mortality were reviewed retrospectively. Results : In 82 patients, 41 (50%) were male. The mean age and weight at operation were 12 days and 3.2 kg, respectively. The common cardiac anomalies were complete transposition of the great arteries (TGA), Tetralogy of Fallot (TOF), pulmonary atresia with intact ventricular septum, and single ventricle variants. Fifty seven operations were performed with cardiopulmonary bypass and corrective surgery was done on 54 patients. Arterial switch operation and modified Blalock-Taussig shunt were most frequently performed as corrective and palliative operations, respectively. The early hospital mortality rate was 7%; the late mortality was 3.9%. Complications were acute renal insufficiency, delayed sternal closure, wound infection, arrhythmia, and brain hemorrhage. Conclusion : During the last 6 years, the outcomes of cardiac surgery for congenital heart defects in neonates improved by progress in perioperative, anaesthetic, surgical, and postoperative care.

• Journal of Periodontal and Implant Science
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• v.32 no.3
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• pp.489-500
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• 2002

The purpose of this study was to evaluate newly fabricated tricalcium phosphate(TCP)/chitosan microgranuls as bone substitutes. TCP/chitosan microgranules were fabricated by dropping TCP-chitosan suspension into the NaOH/ethanol solution. The size of microgranules could be controllable via airflow rate. PDGF-BB was loaded into the fabricated granules via freeze-drying methods(300 ng/20 mg). To evaluate cell proliferation, cultured osteoblasts cell lines(MC3T3-El) was dropped on the BioOss(R), chitosan microgranules, TCP/chitosan microgranules and cultured for 1, 7 , 14, and 28 days. Scanning electron microscopic observation was done after 7 days of culture and light microscopic examination was done after 28 days of culture. PDGF-BB release from the microgranules was tested. Rabbit calvarial defects(8 mm in diameter) were formed and chitosan, TCP/chitosan, PDGF-TCP/chitosan microgranules, and BioGran(R) were grafted to test the ability of new bone formation. At SEM view, the size of prepared microgranules was 250-1000 um and TCP powders were observed at the surface of TCP/chitosan microgranules. TCP powders gave roughness to the granules and this might help the attachment of osteoblasts. The pores formed between microgranules might be able to allow new bone ingrowth and vascularization. There were no significant differences in cell number among BioOss(R) and two microgranules at 28 day. Light and scanning electron microscopic examination showed that seeded osteoblastic cells were well attached to TCP/chitosan microgranules and proliferated in a multi-layer. PDGF-BB released from TCP/chitosan microgranules was at therapeutic concentration for at least 1 week. In rabbit calvarial defect models, PDGF-TCP/chitosan microgranules grafted sites showed thicker bone trabeculae pattern and faster bone maturation than others. These results suggested that the TCP/chitosan microgranules showed the potential as bone substitutes.

• Journal of Veterinary Clinics
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• v.18 no.4
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• pp.418-423
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• 2001

To investigate the modulation of nerve growth factor (NGF) during corneal epithelial wound healing and the effect of topical NGF on corneal epithelial wound healing in dogs. An axial epithelial defect was created in the right eye using 6mm axial corneal mechanical debridement while the left served as an unwounded control. The tears were collected from both eyes during 1 week and the corneal epithelium was processed for the measurement of NGF at day 0 and 7. The NGF content of tears and corneal epithelium was determined by enzyme-linked immunosorbent assay. In another experiment, the animals were divided into 3 groups. The right eyes in each group were treated every six hours with 200 ug/ml of recombinant human (rh) NGF, murine NGF, or 600 ug/ml of anti-NGF blocking antibody. The left eye of each animal was treated with bovine serum albumin (BSA) to serve as controls. Wound healing was analyzed using NIH image software. Tear NGF was markedly increased in the wounded eyes, relative to tears from control eyes during the early healing period. The NGF content of the corneal epithelium was elevated in the wounded eye (p=0.024). Time to wound closure and rate of epithelial migration were not significantly different between the NGF treated or the NGF antibody treated, and the control BSA treated eyes. Corneal epithelial wounding increased NGF content only on the wounded side during the early healing period. Neither topical recombinant human or murine NGF affected corneal epithelial wound healing in the normal dog.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.10 no.4
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• pp.273-280
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• 2012

The electrochemical behaviors of 10 g-scale fresh and oxidized Zircaloy-4 cladding hulls were examined in $500^{\circ}C$ LiCl-KCl molten salts to confirm the feasibility of the electrorefining process for the treatment of hull wastes. In the results of measuring the potential-current response using a stainless steel basket filled with oxidized Zircaloy-4 hull specimens, the oxidation peak of Zr appears to be at -0.7 to -0.8 V vs. Ag/AgCl, which is similar to that of fresh Zircaloy-4 hulls, while the oxidation current is found to be much smaller than that of fresh Zircaloy-4 hulls. These results are congruent with the outcome of current-time curves at -0.78 V and of measuring the change in the average weight and thickness after the electrochemical dissolution process. Although the oxide layer on the surface affects the uniformity and rate of dissolution by decreasing the conductivity of Zircaloy-4 hulls, electrochemical dissolution is considered to occur owing to the defect of the surface and phase properties of the Zr oxide layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.148-148
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• 2011

Recently, there have been many research activities to develop the large-area plasma source, which is able to generate the high-density plasma with relatively good uniformity, for the plasma processing in the thin-film solar cell and display panel industries. The large-area CCP sources have been applied to the PECVD process as well as the etching. Especially, the PECVD processes for the depositions of various films such as a-Si:H, ${\mu}c$-Si:H, Si3N4, and SiO2 take a significant portion of processes. In order to achieve higher deposition rate (DR), good uniformity in large-area reactor, and good film quality (low defect density, high film strength, etc.), the application of VHF (>40 MHz) CCP is indispensible. However, the electromagnetic wave effect in the VHF CCP becomes an issue to resolve for the achievement of good uniformity of plasma and film. Here, we propose a new electrode as part of a method to resolve the standing wave effect in the large-area VHF CCP. The electrode is split up a series of strip-type electrodes and the strip-type electrodes and the ground ones are arranged by turns. The standing wave effect in the longitudinal direction of the strip-type electrode is reduced by using the multi-feeding method of VHF power and the uniformity in the transverse direction of the electrodes is achieved by controlling the gas flow and the gap length between the powered electrodes and the substrate. Also, we provide the process results for the growths of the a-Si:H and the ${\mu}c$-Si:H films. The high DR (2.4 nm/s for a-Si:H film and 1.5 nm/s for the ${\mu}c$-Si:H film), the controllable crystallinity (~70%) for the ${\mu}c$-Si:H film, and the relatively good uniformity (1% for a-Si:H film and 7% for the ${\mu}c$-Si:H film) can be obtained at the high frequency of 40 MHz in the large-area discharge (280 mm${\times}$540 mm). Finally, we will discuss the issues in expanding the multi-electrode to the 8G class large-area plasma processing (2.2 m${\times}$2.4 m) and in improving the process efficiency.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4736-4741
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• 2014

This study examined PCB component cleaning on a PCB component surface, which has defects of precipitation type washing (existing rinse method), sealant and foreign material formed in the adhesive process that could not be removed easily. The spin jig was developed for PCB component cleaning, in which the PCB component settled down, to solve the conventional problem of the removal of foreign material with the centrifugal force by high speed rotation. The results are as follows. With decreasing fraction defect in PCB component washing, the development and substrate damage decreased by more than 80% according to the abstergent in the rotary type using the centrifugal force in the existing precipitation type. When the base plate showed a large difference with the time to include the process after washing the design using the existing method, easy attachment and separation of the PCB component could be possible. The washing time was enhanced 90% compared to the existing time. The reliability of the security and washing collaboration of the design and stability of the cleaning process could be secured so that there was no phenomenon of secession, the PCB component fixed for a cleansing rotation jig could maintain a fixed force by the centrifugal force. The stability and reliability of the washing process and the defective rate could be improved to less than 1%.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Journal of the Korea institute for structural maintenance and inspection
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• v.18 no.3
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• pp.133-142
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• 2014

Recently, more focus is shift to imbalances in aggregate market supply and demand and an exhaustion of natural resources. In this situation, Electric arc furnace oxidizing slag (EAF Slag) has high application possibility as aggregate for concrete due to similar property with general aggregate. In this study, We've got the plan to assure the chemical stability of EAF Slag, and then experimentally tested the mechanical performance and durability for the fine aggregate used EAF Slag. On this test result, we suggest the application plan. At the result of this study, it shows that EAF slag would reduce the surface defect such as pop-out due to natural aging for the fixed hour and adjustment the grain size of EAF Slag. And mechanical performance and durability according to the replacement rate of concrete service, were revealed more than equal or equal compare to general aggregate. Hereafter, quality control must precede not to impede the beauty of concrete surface as assure the safety for aging and processing. And, to establish the environmental resource recycling system for by-products of steel, it should be made development of various application and guideline of quality control for the EAF slag aggregate. Moreover, it must be constantly studied all kind of engineering performance and durability for related to this study.

• Korean Journal of Food Science and Technology
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• v.31 no.2
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• pp.368-374
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• 1999

This study was designed to investigate effects of pulsed electric field (PEF) treatment on physiological changes of microbial cells, using domestically fabricated pilot scale PEF device. The effect of non-thermal PEF treatment on physiological characteristics of microorganisms was determined by salt resistance, the amount of UV absorbents, cell staining, recovery rate of defected cells, and changes in structure of cell membrane. Salt resistance of Escherichia coli, Bacillus subtilis and Rhodotorula minuta was examined after PEF treatment at 40 kV/cm, 84 pulse, $10{\mu}s$ pulse duration. Approximately $1\;log_{10}$ cell number of viable microorganisms was decreased by addition of salt. PEF treatment significantly increased the amount of UV absorbents at 260 and 280 nm because of leakage from damaged cell membrane by PEF treatment. Although three kinds of microorganisms treated by PEF were difficult to be observed due to their cell membrane damage, untreated cells were clearly observed by a microscope. PEF-treated R. minuta was not stained by methylene blue due to cell membrane defect. When E. coli, B. subtilis and R. minuta were cultured after PEF treatment, they showed 5, 4, and 8 hr longer lag phase, respectively, compared to control, but growth rates were not affected.