• Journal of Korean Institute of Industrial Engineers
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• v.41 no.4
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• pp.330-337
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• 2015

A bucket-brigade is a way of transporting items where items are passed from one person to the next. The operation of the bucket brigade imitates the cooperative behavior of ants when brood, food or other resources are moved. Koo (2009) presented a bucket brigade-based assembly cell where each worker follows a simple rule: perform assembly operations on a product until the next worker downstream takes it over; then go back to the previous worker upstream to take over a new assembly job. In this way, the flow line is self-balanced without any predetermined job assignment. However, there are some productivity losses related to hand-off and blocking. This paper examines the hand-off and blocking losses and presents a new bucket brigade-based assembly cell where working areas for each assembler is restricted with the help of buffer interfaces. Simulation experiments are used to validate the performance of the new assembly system.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.1
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• pp.12-21
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• 1999

All kinds of electronic machinery including portable communication system are being smaller size and are used at high frequency. It generates a lot of unwanted noise signals called electromagnetic interface (EMI). This paper presents an analysis result of EMI generation in VLSI and propose new circuits to minimize of EMI using I/O driver with parallel buffer architecture and distributed decoupling capacitor in a chip. The proposed circuits are evaluated with i8052 MCU which is shown reducing of delta current 1/3 times and improvement of EMI more 10dBuV compared with conventional processors.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• Journal of the Korean Vacuum Society
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• v.19 no.6
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• pp.495-500
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• 2010

In this study, $Al_2O_3$ and $TiO_2$ films was deposited on to PES (poly(ethersulfon) substrate by using atomic layer deposition as functions of deposition temperature and plasma power. The density and carbon contents of $Al_2O_3$ and $TiO_2$ films was changed by varying process conditions. High density thin films was achieved through optimizing the process conditions. Buffer layer was deposited prior to the processing of upper thin films to avoid PES surface destruction during the high power plasma process and to enhances the tortuous path for water vapor permeation for the defect decoupling effect. The water vapor transmission rate by using MOCON test was investigated to analyze the effect. Water vaper permeation properties was improved by using the inorganic multi-layer passivation layer and activation energy of the water vapor permeation was increased.