• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Laser Solutions
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• v.11 no.1
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• pp.7-11
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• 2008

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.421-422
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• 2006

• Journal of IKEEE
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• v.19 no.3
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• pp.440-446
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• 2015

This study has examined susceptibility of LNA(Low Noise Amplifier) due to Front-Door Coupling under Narrow-Band high power electromagnetic wave. M/DFR(Malfunction/Destruction Failure Rate) was measured to investigate the diagnostic of IC test. In addition, decapsulation analysis was used to understand the inside of the chip state in LNA devices. The experiments is employed as an open-ended waveguide to study the destruction effects of LNA using a 2.45 GHz Magnetron as a high power electromagnetic wave. The susceptibility level of LNA was assessed by electric field strength, and its failure modes were observed. The malfunction of LNA device has showed as the type of self-reset and power-reset. The electric field strength of malfunction threshold is 524 V/m and 1150 V/m respectively. Also, he electric field of destruction threshold is 1530 V/m. Three types of damaged LNA were observed by decapsulation analysis: component, onchipwire, and bondwire destruction. Based on these results, the susceptibility of the LNA can be applied to a database to help elucidate the effects of microwaves on electronic equipment.

• Fire Science and Engineering
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• v.33 no.5
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• pp.19-27
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• 2019

Fire extinguishing composite materials based on low-viscosity epoxy resin (EP) and containing 50 wt% of encapsulated fire extinguishing agent (EFA) have been studied. The positive effect of the EP on the kinetics and temperature of the EFA decapsulation was established. The EP increases the decapsulation temperature of the EFA from 130 ℃ to 155 ℃ and changes the kinetics of the decapsulation. The epoxy matrix increases the thermal stability of the EFA more than 3.9 times compared to that of the pure EFA. The protective effect of the EP on the storage stability of the EFA was validated. The mass loss of EP-containing EFA at 60 ℃ and 80% humidity over 96 h is 0.4%. The mass loss of pure EFA under the same conditions is 15%. A similar effect was observed under ultraviolet radiation: the EP-containing EFA loses 0.8% at pure EFA mass of 6%. The testing of alternative polymer matrixes has been considered.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.301-302
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• 2007

• Journal of radiological science and technology
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• v.29 no.3
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• pp.147-155
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• 2006

The crystal structures of fully dehydrated $K_3Na_8H-A(R_1=0.0478,\;R_2=0.0458\;and\;a=12.257(1){\AA})$ have been studied by single-crystal x-ray diffraction methods in the cubic space group. Pm3m in order to understand the structure of the zeolite as a gas storage medium and the mechanisms based on the encapsulation and decapsulation processes of gas molecules. In the crystal structures of dehydrated $K_3Na_8H-A$, three $K^+$ ions per unit cell are located on the 8-oxygen ring(0.0, 0.4531, 0.4531) and eight $Na^+$ ions per unit cell are located near the centers of 6-oxygen rings. Each $K^+$ ions on the 8-ring is $2.87(2){\AA}$ and $2.79(1){\AA}$ away from two kinds of framework oxygen atoms. These values are more realistic than previously known values in $K_{12}Na-A$. The exact positions of $K^+$ ions are ca. $0.8{\AA}$ away from the centers of the 8-rings which are previously reported as the preferred location of $K^+$ ions. Because the zeolites frameworks are stabilized as the results, more effective controls of gas molecules at encapsulation, decapsulation, and storage are achieved. Additionally, the available storage volumes are also maximized and more volume of gases can be stored in the materials. Therefore, oxygen storage bottles in hospital can be minimized and portable oxygen bottles for patients in emergency can be developed by using the materials.

• Bulletin of the Korean Chemical Society
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• v.18 no.3
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• pp.280-286
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• 1997

Potential energy function sets for some ion-exchanged A-type zeolites, K-A and Rb11Na1-A, were determined by introducing the X-ray crystal structures as constraints. The potential functions reproduced well the X-ray crystal structures of the monovalent ion-exchanged zeolites. The activation energies for the en- or de-capsulation of small molecules (H2, O2, N2, and CH4) and inert gases from the α-cage of model zeolites (Na-A, K-A, Rb11Na1-A, and Cs3Na9-A) were obtained by the molecular mechanical calculations. The calculated activation energies agreed well with experimental results.

• Journal of Power Electronics
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• v.14 no.6
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• pp.1345-1356
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• 2014

The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.7 no.1
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• pp.75-83
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• 2008

In this paper, we propose an efficient algorithm that assigns single temporary IPv4 address and port number to improve efficiency of IPv4 address that is allocated in DSTM service. And, we have analyzed the elementary functions for DSTM and have designed the functional modules. Also, we have implemented the DTI interface for encapsulation and decapsulation of IPv6 packets. The performance analysis and comparison are investigated whether the appropriate interworking service is possible or not. Our observation results show that the performance of IPv4 over IPv6 tunneling is suitable to DSTM service due to the reduction of delay by eliminating checksum calculations in the header of IPv6 tunneling.